HL7588

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Product Technical Specification AirPrime HL7548 and HL7588 4116369 9.0 September 04, 2017

4116369 Rev 9.0 September 04, 2017 2 Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to t he user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.

4116369 Rev 9.0 September 04, 2017 3 Product Technical Specification Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more pat ents licensed from MMP Portfolio Licensing. Copyright © 2017 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries. Watcher® is a registered trademark of NETGEAR, Inc., used under license. Windows® and Windows Vista® are registered trademarks of Microsoft Corporation. Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of their respective owners. Contact Information Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/ Global toll-free number: 1-877-687-7795 6:00 am to 5:00 pm PST Corporate and product information Web: sierrawireless.com

4116369 Rev 9.0 September 04, 2017 4 Product Technical Specification Document History Version Date Updates 1.0 October 07, 2014 Creation December 01, 2014 Updated:

• 2 Pad Definition
• Table 10 VGPIO Electrical Characteristics
• Figure 11 EMC and ESD Components Close to the SIM Removed section 6 X-Ray Exposure January 08, 2015 Updated:
• 1.7 ESD
• The note in section 3.2 Current Consumption January 29, 2015 Updated:
• 1.8.2 Regulatory
• Table 8 Current Consumption
• 3.9 Main Serial Link (UART1)
• 7 Legal Information Removed:
• B13, IPv6 and digital audio support for the HL7548
• HSIC February 23, 2015 Updated section 2 Pad Definition

1.1 February 25, 2015

Updated:

• 1.3 General Features
• PCM support in: ▪ Figure 1 Architecture Overview ▪ 1.5 Interfaces ▪ Table 6 Pad Definition ▪ 3.14 PCM
• Table 17 UART1 Pad Description
• 5.4.1 Using UART1

1.2 February 27, 2015 Updated section 7 Legal Information

2.0 April 09, 2015 Updated:

• Table 1 Supported Bands/Connectivity
• Table 3 ESD Specifications
• 2 Pad Definition
• Table 8 Current Consumption Removed SIM2 and GPIO12 throughout the document May 05, 2015 Updated:
• Supported LTE category for HL7548 in Table 2 General

Features

• 2 Pad Definition
• 3.5 SIM Interface May 07, 2015 Added section 6 Reliability Specification Updated Table 41 Ordering Information

4116369 Rev 9.0 September 04, 2017 5 Product Technical Specification Version Date Updates

2.1 May 18, 2015

Updated:

• Table 2 General Features
• 3.7 Electrical Information for Digital I/O
• 3.16.3 TX_ON Indicator (TX_ON) Removed GPIO3 from:
• 2 Pad Definition
• Table 12 UIM1 Pad Description
• Table 16 GPIO Pad Description 2.2 May 19, 2015 Added PCM in section 3.7 Electrical Information for Digital I/O

3.0 July 13, 2015

Updated:

• Signal names from PWR_ON to PWR_ON_N, and RESET_IN to RESET_IN_N
• Figure 2 Mechanical Overview
• 2 Pad Definition
• 3.14 PCM
• Figure 8 PWR_ON_N Sequence with VGPIO Information

3.1 July 21, 2015 Updated Table 6 Pad Definition

3.2 August 06, 2015

Updated:

• Table 6 Pad Definition
• 3.2 Current Consumption

3.3 August 21, 2015

Added Table 9 Current Consumption per Power Supply Updated:

• 3.2 Current Consumption
• AT command to use from +CPOF to +CPWROFF
• 7.1 FCC Regulations

3.4 September 21, 2015

Updated:

• Table 8 Current Consumption
• Table 9 Current Consumption per Power Supply

4.0 November 04, 2015

Updated:

• Table 5 Regulation Compliance
• Table 8 Current Consumption
• 7 Legal Information

5.0 January 28, 2016 Updated Table 29 Conducted RX Sensitivity (dBm)

6.0 April 21, 2016

Added inrush current and duration in section 5.1 Power-Up Sequence Removed HL7519 6.1 May 06, 2016 Added 5.5 Power Supply Design

6.2 June 30, 2016

Updated:

• Band support limitation in section 1 Introduction and Table 2 General Features
• Figure 2 Mechanical Overview
• 4 Mechanical Drawings
• 8 Ordering Information

6.3 July 08, 2016

Updated:

• Band support limitation in section 1 Introduction and Table 2 General Features
• 8 Ordering Information

4116369 Rev 9.0 September 04, 2017 6 Product Technical Specification Version Date Updates

6.4 September 19, 2016

Updated:

• PWR_ON_N pull up resistor value from 47kΩ to 100kΩ
• 5.4.1 Using UART1
• 7.2 IC Statement

7.0 February 03, 2017

Updated:

• Table 2 General Features
• 3.14 PCM

7.1 February 15, 2017 Updated the Protocol Stack row of Table 2 General Features

8.0 June 22, 2017

Updated:

• Table 15 Digital I/O Electrical Characteristics
• 4 Mechanical Drawings

9.0 August 23, 2017

Updated:

• Pin 64 from UIM1_DET to UIM1_DET/GPIO3
• Table 6 Pad Definition
• Note below Table 14 USB Pad Description

4116369 Rev 9.0 September 04, 2017 8 Product Technical Specification

on wireless networks (as listed in Table 1 Supported Bands/Connectivity). provide customers with the highest level of flexibility in implementing high-end solutions. Table 1. Supported Bands/Connectivity while HL7588 modules operating on AT&T support LTE bands B2, B4, B5, B17, and UMTS bands B2 and B5.

• Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings
• Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions
• Offers electrical and functional compatibility
• Provides Direct Mount as well as Socketability depending on customer needs

• Length: 23 mm
• Width: 22 mm
• Thickness: 2.5 mm
• Weight: 3.5 g Note: Dimensions specified above are typical values. 1.3. General Features The table below summarizes the AirPrime HL7548 and HL7588 features.

Table 2. General Features

• Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm (nominal)
• Complete body shielding
• RF connection pads (RF main interface)
• Baseband signals connection Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V RF HL7548 (quad-band LTE):
• LTE B2: 1900 PCS
• LTE B4: 1700 AWS
• LTE B5: 850 CLR
• LTE B17: 700 HL7588 (penta-band LTE and dual-band UMTS)**:
• LTE B2: 1900 PCS
• LTE B4: 1700 AWS
• LTE B5: 850 CLR
• LTE B13: 700
• LTE B17: 700
• UMTS B2: 1900 PCS
• UMTS B5: 850 CLR Audio interface*
• Digital interface only
• Supports Narrow-Band and Wide-band Adaptive Multirate (AMR-NB and AMR-WB) vocoders
• MO and MT calling
• Echo cancellation and noise reduction
• Emergency calls (112, 110, 911, etc.)
• Incoming call notification
• DTMF generation

4116369 Rev 9.0 September 04, 2017 14 Product Technical Specification Introduction Feature Description SIM interface

• Dual SIM Single Standby (DSSS)
• 1.8V/3V support
• SIM extraction / hot plug detection
• SIM/USIM support
• Conforms with ETSI UICC Specifications
• Supports SIM application tool kit with proactive SIM commands Application interface
• NDIS NIC interface support (Windows XP, Windows 7, Windows 8, Windows CE, Linux)
• Multiple non-multiplexed USB channel support
• Dial-up networking
• USB selective suspend to maximize power savings
• CMUX multiplexing over UART*
• AT command interface – 3GPP 27.007 standard, plus proprietary extended AT commands Protocol Stack
• Single mode LTE operation: ▪ LTE FDD, bandwidth 1.4-20 MHz ▪ System Release: 3GPP Rel. 9 ▪ Category 4 (up to 150 Mbit/s in downlink, 50 Mbit/s in uplink) ▪ MIMO DL 2x2 and 4x2 ▪ Max modulation 64 QAM DL, 16 QAM UL ▪ Intra-frequency and inter-frequency mobility ▪ SMS over SGs and IMS ▪ SON ANR ▪ Public Warning System PWS
• HSDPA (High Speed Downlink Packet Access)* ▪ Evolved High Speed Downlink Packet Access (HSDPA+) ▪ Compliant with 3GPP Release 9 ▪ Up to Category 24 (DC, 42.2Mbps) ▪ Continuous Packet Connectivity (CPC) ▪ Enhance fractional DPCH ▪ IPv6 support
• HSUPA (High Speed Uplink Packet Access)* ▪ Compliant with 3GPP Release 9 ▪ Category 6 (5.7 Mbps) ▪ Robust Header Compression (RoHC)
• RXDIV Performance Enhancements* ▪ Type 3i (HSDPA)
• HSPA Enhancements* ▪ MAC-ehs Rel. 7 ▪ HSDPA Enhanced CELL_FACH/PCH states ▪ HSUPA Enhanced CELL_FACH states (eFACH) Rel 8 ▪ MAC-i/is Rel.8 ▪ Serving cell change enhancements Rel. 8 SMS
• SMS over SGs and IMS
• SMS MO and MT
• SMS saving to SIM card or ME storage
• SMS reading from SIM card or ME storage
• SMS sorting
• SMS concatenation
• SMS Status Report
• SMS replacement support
• SMS storing rules (support of AT+CNMI, AT+CNMA)

• Multiple (up to 20) cellular packet data profiles
• Sleep mode for minimum idle power draw
• Mobile-originated PDP context activation / deactivation
• Support QoS profile ▪ Release 97 – Precedence Class, Reliability Class, Delay Class, Peak Throughput, Mean Throughput ▪ Release 99 QoS negotiation – Background, Interactive, and Streaming
• Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol).
• Supports PAP and CHAP authentication protocols
• PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
• RFC1144 TCP/IP header compression Environmental Operating temperature ranges (industrial grade):
• Class A: -30°C to +70°C
• Class B: -40°C to +85°C RTC Real Time Clock (RTC) with calendar * This feature is only available on the HL7588. ** AirPrime HL7588 modules operating on Verizon support LTE bands B2, B4, B13, and UMTS bands B2 and B5; while HL7588 modules operating on AT&T support LTE bands B2, B4, B5, B17, and UMTS bands B2 and B5. 1.4. Architecture The figure below presents an overview of the AirPrime HL7548 and HL7588’s internal architecture and external interfaces. AirPrime HL7548 and HL7588 Memory (Flash + RAM) SAW Filters 26MHz 32.768KHz UART x 1 Trace Debug (5 pins) VBATT GND VGPIO BAT_RTC GPIO x 13 RESET_IN RF Main JTAG LGA- 146 Baseband SIM1 MCU DSP PMU RF Analog Baseband Peripherals LGA- 146 26M_CLKOUT 32K_CLKOUT PWR_ON Dulpexer PA USB Antenna Switch Antenna Switch RX_LTE RF RF DIV RFRX_LTE ADC x 1 PCM* TX_ON*

Figure 1. Architecture Overview

• 1x – 8-wire UART for the HL7588; 4-wire UART for the HL7548
• 1x – Active Low RESET
• 1x – USB 2.0
• 1x – Backup Battery Interface
• 2x – System Clock Out
• 1x – Active Low POWER-ON
• 1x – 1.8V/3V SIM
• 1x – JTAG Interface
• 13x – GPIOs (3 of which have multiplexes)
• 1x – Main Antenna
• 1x – RX Diversity Antenna
• 1x – VGPIO
• 1x – TX_ON (only available on the HL7588)
• 1x – ADC
• 1x – PCM (only available on the HL7588)
• 1x – Debug Interface 1.6. Connection Interface The AirPrime HL7548 and HL7588 module is an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.

Figure 2. Mechanical Overview

• 66 inner signal pads, 1x0.5mm, pitch 0.8mm
• 1 reserved test point (do not connect), 1.0mm diameter
• 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch
• 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm
• 4 inner corner ground pads, 1x1mm
• 4 outer corner ground pads, 1x0.9mm

Refer to the following table for ESD Specifications. Table 3. ESD Specifications

• JESD22-A114 ± 1kV Human Body Model
• JESD22-A115 ± 200V Machine Model
• JESD22-C101C ± 250V Charged Device Model Signals SIM connector Adding ESD protection is highly recommended at the point where the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user. Other host signals 1.8. Environmental and Certifications 1.8.1. Environmental Specifications The environmental specification for both operating and storage conditions are defined in the table below.

Table 4. Environmental Specifications

• Shall exhibit normal function during and after environmental exposure.
• Shall meet the minimum requirements of 3GPP or appropriate wireless standards. Class B is defined as the operating temperature ranges that the device:
• Shall remain fully functional during and after environmental exposure
• Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even when one or more environmental constraint exceeds the specified tolerance.
• Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed.

The AirPrime HL7548 and HL7588 are compliant with FCC and IC regulations. FCC and IC compliance will be reflected on the AirPrime HL7548 and HL7588 label. Table 5. Regulation Compliance to dispose of this product in an environmental friendly manner.

AirPrime HL7548 and HL7588 pads are divided into 3 functional categories.

• Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF 3 family of modules. These Core functions are always available and always at the same physical p ad locations. A customer platform using only these functions and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
• Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it is always at the same pad location.
• Custom functions and associated pads are specific to a given module, and make an opportunistic use of specific chipset functions and I/Os. Custom features should be used with caution as there is no guarantee that the custom functions available on a given module wi ll be available on other CF3 modules. Other pads marked as “not connected” or “reserved” should not be used.

Table 6. Pad Definition

2 UART1_RI* /

8 UART1_DCD* /

4116369 Rev 9.0 September 04, 2017 20 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused P ads Type

9 UART1_DSR* /

TRACE_DATA0 UART1 Data set ready / Trace data 0 O L 1.8V Connect to test point Core / Custom 10 GPIO2 / TRACE_DATA2 General purpose input/output / Trace data 2 I/O 1.8V Connect to test point Core / Custom 11 RESET_IN_N Input reset signal I L 1.8V Left Open Core

12 USB_D-

USB Data Negative (Low / Full Speed) I/O 3.3V Connect to test point Extension USB Data Negative (High Speed) 0.38V

13 USB_D+

USB Data Positive (Low / Full Speed) I/O 3.3V Connect to test point Extension USB Data Positive (High Speed) 0.38V

14 NC Not Connected (Reserved for future use) Left Open Not connected

15 NC Not Connected (Reserved for future use) Left Open Not connected

16 USB_VBUS USB VBUS I 3.3V – 5.5V Connect to test point Extension

17 NC Not Connected (Reserved for future use) Left Open Not connected

18 NC Not Connected (Reserved for future use) Left Open Not connected

19 NC Not Connected (Reserved for future use) Left Open Not connected

20 NC Not Connected (Reserved for future use) Left Open Not connected

21 BAT_RTC Power supply for RTC backup I/O 1.8V Left Open Extension 22 26M_CLKOUT 26MHz System Clock Output O 1.8V Left Open Extension 23 32K_CLKOUT 32.768kHz System Clock Output O 1.8V Left Open Extension 24 ADC1 Analog to digital converter I 1.2V Left Open Extension

25 NC Not Connected (Reserved for future use) Left Open Not connected

26 UIM1_VCC 1.8V/3V SIM1 Power supply O 1.8V/3V Mandatory connection Core 27 UIM1_CLK 1.8V/3V SIM1 Clock O 1.8V/3V Mandatory connection Core 28 UIM1_DATA 1.8V/3V SIM1 Data I/O 1.8V/3V Mandatory connection Core

4116369 Rev 9.0 September 04, 2017 21 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused P ads Type 29 UIM1_RESET 1.8V/3V SIM1 Reset O L 1.8V/3V Mandatory connection Core

30 GND Ground 0V 0V Mandatory

31 RF_DIV RF Input - Diversity Mandatory

32 GND Ground 0V 0V Mandatory

33 PCM_OUT* PCM data out O 1.8V Left Open Extension 34 PCM_IN* PCM data in I 1.8V Left Open Extension 35 PCM_SYNC* PCM sync out I/O 1.8V Left Open Extension 36 PCM_CLK* PCM clock I/O 1.8V Left Open Extension

37 GND Ground 0V 0V Mandatory

38 NC Not Connected (Reserved for future use) Left Open Not connected

39 GND Ground 0V 0V Mandatory

40 GPIO7 General purpose input/output I/O 1.8V Left Open Core 41 GPIO8 / TRACE_CLK General purpose input/output / Trace clock I/O 1.8V Connect to test point Core/Custom

42 NC Not Connected (Reserved for future use) Left Open Not connected

43 NC Not Connected (Reserved for future use) Left Open Not connected

44 GPIO13 General purpose input/output O 1.8V Left Open Extension 45 VGPIO GPIO voltage output O 1.8V Left Open Core 46 GPIO6 General purpose input/output I/O 1.8V Left Open Core

47 NC Not Connected (Reserved for future use) Left Open Not connected

48 GND Ground 0V 0V Mandatory

4116369 Rev 9.0 September 04, 2017 22 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused P ads Type

49 RF_MAIN RF Input/output Mandatory

50 GND Ground 0V 0V Mandatory

51 GPIO14 General purpose input/output I 1.8V Left Open Extension 52 GPIO10 General purpose input/output I/O 1.8V Left Open Extension 53 GPIO11 General purpose input/output I/O 1.8V Left Open Extension 54 GPIO15 General purpose input/output I/O 1.8V Left Open Extension

55 NC Not Connected (Reserved for future use) Left Open Not connected

56 NC Not Connected (Reserved for future use) Left Open Not connected

57 NC Not Connected (Reserved for future use) Left Open Not connected

58 NC Not Connected (Reserved for future use) Left Open Not connected

59 PWR_ON Active Low Power On control signal I L 1.8V Mandatory connection Core 60 TX_ON* TX indicator O 2.3V Left Open Extension 61 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 62 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core

63 VBATT Power supply I

3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core

64 UIM1_DET / GPIO3 UIM1 Detection /

General purpose input/output I/O H 1.8V Left Open Core 65 GPIO4 General purpose input/output I/O H 1.8V Left Open Extension 66 GPIO5 General purpose input/output I/O 1.8V Left Open Extension 67-70 GND Ground GND 0V Core

4116369 Rev 9.0 September 04, 2017 23 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused P ads Type 71 - 166 Note: These pads are not available on the AirPrime HL7548 and HL7588 module. 167 - 234 GND Ground GND 0V Core 236 JTAG_RESET JTAG RESET I L 1.8V Left Open Extension 237 JTAG_TCK JTAG Test Clock I 1.8V Left Open Extension 238 JTAG_TDO JTAG Test Data Output O 1.8V Left Open Extension 239 JTAG_TMS JTAG Test Mode Select I 1.8V Left Open Extension 240 JTAG_TRST JTAG Test Reset I L 1.8V Left Open Extension 241 JTAG_TDI JTAG Test Data Input I 1.8V Left Open Extension 242 JTAG_RTCK JTAG Returned Test Clock O 1.8V Left Open Extension * This signal is only available on the HL7588.

Figure 3. Pad Configuration

1. Detailed Interface Specifications

VBATT and VBATT_PA connection if requirements below are fulfilled. Table 7. Power Supply

• This value must be guaranteed during the burst.

Note: Load capacitance for VBATT is around 32µF ± 20% embedded inside the module. Load capacitance for VBATT_PA is around 10µF ± 20% embedded inside the module. additional 0.6mA will be consumed if USB is connected. of voltages and temperature. Table 8. Current Consumption

• This band is only supported on the HL7588.

Table 9. Current Consumption per Power Supply

• This band is only supported on the HL7588.
• Pull-up signals such as I/Os
• Supply the digital transistors driving LEDs The VGPIO output is available when the AirPrime HL7548 and HL7588 module is switched ON.

Table 10. VGPIO Electrical Characteristics

If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator. Table 11. BAT_RTC Electrical Characteristics Sierra Wireless recommends adding a 10µF capacitor to the BAT_RTC pad. for dual SIM application with an external SIM switch. recommendations concerning SIM functions.

• UIM1_VCC: power supply
• UIM1_CLK: clock
• UIM1_DATA: I/O port
• UIM1_RESET: reset
• UIM1_DET: SIM detection

Table 12. UIM1 Pad Description

64 UIM1_DET UIM1 Detection GPIO3

Table 13. Electrical Characteristics of UIM1 UIM1_DET transitions from logic 1 to logic 0. The AirPrime HL7548 and HL7588 have one USB interface. Table 14. USB Pad Description

12 USB_D- I/O USB Data Negative

13 USB_D+ I/O USB Data Positive

16 USB_VBUS I USB VBUS

Note: When a USB supply is not available, connect USB_VBUS to VBATT to supply the USB interface. USB_VBUS will have a voltage range of 3.3V to 4.5V when connected to VBATT.

electrical characteristics of each digital interface.

• Group 1 (6mA current drain limit) ▪ GPIO2, GPIO3, GPIO4, GPIO6, GPIO8, GPIO10, GPIO11, GPIO13, GPIO14, GPIO15
• Group 2 (1mA current drain limit) ▪ GPIO1, GPIO5, GPIO7 ▪ UART1 ▪ JTAG ▪ PCM

Table 15. Digital I/O Electrical Characteristics The AirPrime HL7548 and HL7588 modules provide 13 GPIOs, 3 of which have multiplexes. Table 16. GPIO Pad Description

• TX data (UART1_TX)
• RX data (UART1_RX)
• Request To Send (UART1_RTS)
• Clear To Send (UART1_CTS)
• Data Terminal Ready (UART1_DTR)
• Data Set Ready (UART1_DSR)
• Data Carrier Detect (UART1_DCD)
• Ring Indicator (UART1_RI) Note: Signal names are according to PC view. UART1_DTR, UART1_DSR, UART1_DCD and UART1_RI are not available on the HL7548. UART1 pad description is summarized in the table below.

Table 17. UART1 Pad Description 2 UART1_RI** O Signal incoming calls (data only), SMS, etc.

3 UART1_RTS I Request to send

4 UART1_CTS O AirPrime HL7548 or HL7588 is ready to receive AT

5 UART1_TX I Transmit data

6 UART1_RX O Receive data

7 UART1_DTR** I (active low)

8 UART1_DCD** O Signal data connection in progress

9 UART1_DSR** O Signal UART interface is ON

** This signal is not available on the HL7548. A low-level signal should be provided to switch the AirPrime HL7548 and HL7588 module ON. will be enabled and so the PWR_ON_N signal is by default at high level. The PWR_ON_N signal’s characteristics are listed in the table below. Table 18. PWR_ON_N Electrical Characteristics VGPIO is an output from the module that can be used to check if the module is active.

• When VGPIO = 0V, the module is OFF
• When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode) Note: PWR_ON_N signal cannot be used to power the module off. To power the module off, use AT command AT+CPWROFF. 3.11. Reset Signal (RESET_IN_N) To reset the module, a low-level pulse must be sent on the RESET_IN_N pad for 20ms. This action will immediately restart the AirPrime HL7548 or HL7588 module with the PWR_ON_N signal at low level. (If the PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally pulled up, an open collector or open drain transistor should be used to control this signal. The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well , for the next power on. Note: As RESET_IN_N is referenced to the VRTC (200kΩ pull-up resistor to VRTC 1.8V) an open collector or open drain transistor has to be used to control this signal.

Table 19. RESET_IN_N Electrical Characteristics module. This converter is a 10-bit resolution ADC ranging from 0 to 1.2V. The following table describes the pad description of the ADC interface. Table 20. ADC Interface Pad Description

24 ADC1 I Analog to digital converter

OFF an external supply in case of overvoltage. Table 21. ADC Electrical Characteristics The AirPrime HL7548 and HL7588 modules support two digital clock interfaces. The following table describes the pad description of the clock out interfaces. Table 22. Clock Interface Pad Description

Guide and [3] AirPrime HL7588 AT Commands Interface Guide. Note: This interface is only available on the HL7588. for example, to connect an external audio codec. The programmability of this interface allows addressing a large range of audio peripherals.

• PCM_SYNC: The frame synchronization signal delivers an 8 kHz/16 kHz frequency pulse that synchronizes the frame data in and the frame data out.
• PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral.
• PCM_OUT: The frame “data out” relies on the selected configuration mode.
• PCM_IN: The frame “data in” relies on the selected configuration mode. The PCM interface is a high speed full duplex interface that can be used to send and receive digital audio data to external audio ICs. The Digital Audio Interface also features the following:
• PCM master or slave
• 16 bits data word length, linear mode
• MSB first
• Configurable PCM bit clock rate on 256kHz, 384kHz, 512kHz, 768kHz or 1024kHz
• Long frame sync The following table describes the pad description of the PCM interface.

Table 23. PCM Interface Pad Description

33 PCM_OUT O PCM data out

34 PCM_IN I PCM data in

35 PCM_SYNC I/O PCM sync out

36 PCM_CLK I/O PCM clock

Refer to the following table for the electrical characteristics of the digital audio interface.

Table 24. PCM Electrical Characteristics The following figure shows the PCM timing waveform. Figure 4. PCM Timing Waveform The AirPrime HL7548 and HL7588 modules provide 2 interfaces for a powerful debug system. instruction and data trace of the modem core. Table 25. Trace Debug Pad Description

2 TRACE_DATA3 Trace data 3

8 TRACE_DATA1 Trace data 1

9 TRACE_DATA0 Trace data 0

10 TRACE_DATA2 Trace data 2 GPIO2

41 TRACE_CLK Trace clock GPIO8

Note: It is strongly recommended to provide access to this interface through Test Points. JTAG signals are accessible through solder-able test points. Table 26. JTAG Pad Description

236 JTAG_RESET JTAG RESET

237 JTAG_TCK JTAG Test Clock

238 JTAG_TDO JTAG Test Data Output

239 JTAG_TMS JTAG Test Mode Select

240 JTAG_TRST JTAG Test Reset

241 JTAG_TDI JTAG Test Data Input

242 JTAG_RTCK JTAG Returned Test Clock

interface has a 50Ω nominal impedance. Table 27. RF Main Connection Table 28. RF Diversity Connection

RF performances are compliant with 3GPP recommendation TS 36.101. Table 29. Conducted RX Sensitivity (dBm) Note: This feature is not available on the HL7548. signal and its status signal depends on the module transmitter state. Table 30. TX_ON Indicator Pad Description Table 31. TX_ON Characteristics Figure 5. TX_ON State During Transmission

Figure 6. Mechanical Drawing

Figure 7. Footprint

AT command interface is available in about 7 seconds after PWR_ON_N for either UART1 or USB. Figure 8. PWR_ON_N Sequence with VGPIO Information the valid power on trigger is detected, the PWR_ON_N pad status can be left open. The maximum inrush current is 1.3 A and lasts less than 1.5 ms.

Figure 9. Power OFF Sequence for PWR_ON_N, VGPIO Note: PWR_ON_N is internally pulled up by 100kΩ to 1.8V. only be used in emergency situations if the system freezes (not responding to AT commands). AT command AT+KSLEEP enables sleep mode configuration.

• The module is active when DTR signal is active (low electrical level).
• When DTR is deactivated (high electrical level), the module immediately enters sleep mode after inactivity.
• On DTR activation (low electrical level), the module wakes up. Note: AT+KSLEEP=0 is not available on the HL7548.

• The module determines when it enters sleep mode (when no more tasks are running).
• “0x00” character on the serial link wakes the module up. AT+KSLEEP=2: The module never enters sleep mode. 5.4.2. Using USB Use AT+KSLEEP=1 to allows the module to automatically enter sleep mode while the USB interface is in use. 5.5. Power Supply Design The AirPrime HL7548 and HL7588 modules should not be supplied with voltage over 4.5V even temporarily or however briefly. If the system’s main board power supply unit is unstable or if the system’s main board is supplied with over 4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier may be severely damaged. To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as simple as a Zener diode with decoupling capacitors as shown in the diagram below. Power Supply VBATT/VBATT_PA D404 0.5 pF D405 C404 1.5 mF + C405 150 µF C407 100 nF

Figure 10. Voltage Limiter Example A typical schematic including SIM detection is provided below.

1. Reliability Specification

Reliability Specification defined below. compliant with the following requirements. Table 32. Standards Conformity The following tests the AirPrime HL7548 and HL7588 module product performance. Table 33. Life Stress Test

• Temperature: ▪ Class A: -30°C to +70°C ▪ Class B: -40°C to +85°C ▪ Rate of temperature change: ± 3°C/min
• Recovery time: 3 hours Operating conditions: Powered Duration: 14 days

The following tests the AirPrime HL7548 and HL7588 module resistance to extreme temperature. Table 34. Environmental Resistance Stress Tests

• Temperature: -40°C
• Temperature variation: 1°C/min Operating conditions: Powered ON with a power cycle of 1 minute ON and 2 minutes OFF Duration: 3 days Resistance to Heat Test RH Standard: IEC 680068-2-2, Test Bb Special conditions:
• Temperature: +85°C
• Temperature variation: 1°C/min Operating conditions: Powered ON with a power cycle of 15 minutes ON and 15 minutes OFF Duration: 50 days 6.2.3. Corrosive Resistance Stress Tests The following tests the AirPrime HL7548 and HL7588 module resistance to corrosive atmosphere.

Table 35. Corrosive Resistance Stress Tests

• Temperature: +65°C
• RH: 95%
• Temperature variation: 3 ± 0.6°C/min Operating conditions: Powered on, DUT is powered up for 15 minutes and OFF for 15 minutes Duration: 10 days

• Test method: Dip and Look Test with Steam preconditioning 8 h ±15min. dip for 5 +0/-0.5 seconds Operating conditions: Un-powered Duration: 1 day Moist Heat Cyclic Test MHCT Standard: IEC 60068-2-30, Test Db Special conditions:
• Upper temperature: +40 ± 2°C
• Lower temperature: +25 ± 5°C
• RH: ▪ Upper temperature: 93% ▪ Lower temperature: 95%
• Number of cycles: 21 (1 cycle/24 hours)
• Temperature Variation: 3 ± 0.6°C/min Operating conditions: Powered ON for 15 minutes during each 3 hours ramp up and 3 hours ramp down (in middle) for every cycle Duration: 21 days 6.2.4. Thermal Resistance Cycle Stress Tests The following tests the AirPrime HL7548 and HL7588 module resistance to extreme temperature cycling.

Table 36. Thermal Resistance Cycle Stress Tests

• Temperature: -30°C to +80°C
• Temperature Variation: less than 30s
• Number of cycles: 600
• Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 9 days Temperature Change TCH Standard: IEC 60068-2-14, Test Nb Special conditions:
• Temperature: -40°C to +90°C
• Temperature Variation: 3 ± 0.6°C/min
• Number of cycles: 400
• Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 29 days

Table 37. Mechanical Resistance Stress Tests

• Frequency range: 16 Hz to 1000 Hz
• Displacement: 0.35mm (peak-peak)
• Acceleration: ▪ 5G from 16 to 62 Hz ▪ 3G from 62 to 200 Hz ▪ 1G from 200 to 1000 Hz
• Sweep rate: 1 octave / cycle
• Number of Sweep: 20 sweeps/axis
• Sweep direction: ±X, ±Y, ±Z Operating conditions: Un-powered Duration: 2 days Random Vibration Test RVT Standard: IEC 60068-2-64, Test Fh Special conditions:
• Frequency range: 10 Hz – 2000 Hz
• Power Spectral Density in [(m/s²)²/Hz] ▪ 0.1 g2/Hz at 10Hz ▪ 0.01 g2/Hz at 250Hz ▪ 0.005 g2/Hz at 1000Hz ▪ 0.005 g2/Hz at 2000Hz
• Peak factor: 3
• Duration per Axis: 1 hr / axis Operating conditions: Un-powered Duration: 1 day Mechanical Shock Test MST Standard: IEC 60068-2-27, Test Ea Special conditions:
• Shock Test 1: ▪ Wave form: Half sine ▪ Peak acceleration: 30g ▪ Duration: 11ms ▪ Number of shocks: 8 ▪ Direction: ±X, ±Y, ±Z
• Shock Test 2: ▪ Wave form: Half sine ▪ Peak acceleration: 100g ▪ Duration: 6ms ▪ Number of shocks: 3 ▪ Direction: ±X, ±Y, ±Z Operating conditions: Un-powered Duration: 72 hours

Table 38. Handling Resistance Stress Tests

• HBM (Human Body Model): 1KV (Class 1C)
• MM (Machine Model): 200V
• CDM (Charged Device Model): 250V (Class II) Operating conditions: Powered Duration: 3 days ESD Test Standard: IEC 61000-4-2 Special conditions:
• Contact Voltage: ±2kV, ±4kV, ±6kV
• Air Voltage: ±2kV, ±4kV, ±8kV Operating conditions: Powered Duration: 3 days Free Fall Test FFT 1 Standard: IEC 60068-2-32, Test Ed Special conditions:
• Number of drops: 2 drops per unit
• Height: 1m Operating conditions: Un-powered Duration: 6 hours

4116369 Rev 9.0 September 04, 2017 48 7. Legal Information 7.1. FCC Regulations The HL7548 and HL7588 modules have been granted modular approval for mobile applications. Integrators may use the HL7548 or HL7588 modules in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. 2. To comply with FCC regulations limiting both maximum RF output power and hu man exposure to RF radiation, the maximum antenna gain including cable loss in a mobile -only exposure condition must not exceed: ▪ For HL7548: ▪ 9.01 dBi in LTE Band 2 ▪ 6.00 dBi in LTE Band 4 ▪ 10.42 dBi in LTE Band 5 ▪ 9.73 dBi in LTE Band 17 ▪ For HL7588: ▪ 7.51 dBi in Band 2 ▪ 5.78 dBi in Band 4 ▪ 9.72 dBi in Band 5 ▪ 10.17 dBi in Band 13 ▪ 9.74 dBi in Band 17 3. The HL7548 and HL7588 modules must not transmit simultaneously with other collocated radio transmitters within a host device. 4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic impedance. Basically, the characteristic impedance depends on the dielectric, the track width and the ground plane spacing. In order to respect this constraint, Sierra Wireless recommends using MicroStrip or StripLine structure and computing the Tracks width with a simulation tool (like AppCad shown in the figure below and that is available free of charge at http://www.agilent.com).

4116369 Rev 9.0 September 04, 2017 49 Product Technical Specification Legal Information If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply). If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure . An example of proper routing is shown in the figure below. Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some vias along the RF path. It is recommended to use Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (micro - controllers, etc.) may degrade the reception performances. The antenna connector is intended to be directly connected to a 50Ω antenna and no matching is needed. 5. A label must be affixed to the outside of the end product into which the HL7548 or HL7588 module is incorporated, with a statement similar to the following: This device contains FCC ID: <FCC ID as listed in the table below> Embedded Module FCC ID HL7548 N7NHL7548 HL7588 N7NHL7588 6. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded HL7548 or HL7588 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093. 7.2. IC Statement This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 1. l’appareil ne doit pas produire de brouillage; 2. l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.

Canada to operate with the antenna types listed below with the maximum permissible gain indicated. type, are strictly prohibited for use with this device. maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Table 39. IC IDs Table 40. Approved Antenna Types

Table 41. Ordering Information

4116369 Rev 9.0 September 04, 2017 52 9. Terms and Abbreviations Abbreviation Definition ADC Analog to Digital Converter AGC Automatic Gain Control AT Attention (prefix for modem commands) CDMA Code Division Multiple Access CF3 Common Flexible Form Factor CLK Clock CODEC Coder Decoder CPU Central Processing Unit DAC Digital to Analog Converter DTR Data Terminal Ready EGNOS European Geostationary Navigation Overlay Service EMC Electromagnetic Compatibility EMI Electromagnetic Interference EN Enable ESD Electrostatic Discharges ETSI European Telecommunications Standards Institute FDMA Frequency-division multiple access GAGAN GPS aided geo augmented navigation GLONASS Global Navigation Satellite System GND Ground GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GSM Global System for Mobile communications Hi Z High impedance (Z) IC Integrated Circuit IMEI International Mobile Equipment Identification I/O Input / Output LED Light Emitting Diode LNA Low Noise Amplifier MAX Maximum MIN Minimum MSAS Multi-functional Satellite Augmentation System N/A Not Applicable PA Power Amplifier PC Personal Computer PCB Printed Circuit Board PCL Power Control Level PLL Phase Lock Loop PWM Pulse Width Modulation QZSS Quasi-Zenith Satellite System

4116369 Rev 9.0 September 04, 2017 53 Product Technical Specification Terms and Abbreviations Abbreviation Definition RF Radio Frequency RFI Radio Frequency Interference RMS Root Mean Square RST Reset RTC Real Time Clock RX Receive SCL Serial Clock SDA Serial Data SIM Subscriber Identification Module SMD Surface Mounted Device/Design SPI Serial Peripheral Interface SW Software PSRAM Pseudo Static RAM TBC To Be Confirmed TBD To Be Defined TP Test Point TX Transmit TYP Typical UART Universal Asynchronous Receiver-Transmitter UICC Universal Integrated Circuit Card USB Universal Serial Bus UIM User Identity Module VBATT Main Supply Voltage from Battery or DC adapter VSWR Voltage Standing Wave Ratio WAAS Wide Area Augmentation System