HL250-030

HL250-020 LEIDITECH | Alldatasheet

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Features：  Radial leaded Devices  Cured,flame retardant epoxy polymer insulating material meets UL94V-0  Bulk packaging,or tape and reel available on most models  Agency recognition:UL、CSA、TUV  ROHS compliant and lead-free Product Dimensions Fig.1 Fig.2 Fig.3 Fig.4 Unit ：mm Model Dimensions mm Lead material Shape A(max) B(max) C(max) D(typ) Tinned matel(mm) Fig HL 250 7.4 12.7 4.5 5.1 22AWG/Φ0.6 HL 250 7.4 12.7 4.5 5.1 22AWG/Φ0.6 HL 250 7.4 12.7 4.5 5.1 22AWG/Φ0.6 HL 250 7.4 12.7 4.5 5.1 22AWG/Φ0.6 HL 250 7.4 12.7 4.5 5.1 22AWG/Φ0.6 HL 250 7.4 12.7 4.5 5.1 22AWG/Φ0.6 HL 250 7.4 12.7 4.5 5.1 22AWG/Φ0.6 HL 250 7.8 12.6 4.5 5.1 22AWG/Φ0.6 HL 250 7.0 12.6 4.5 5.1 22AWG/Φ0.6 HL 250 7.0 12.6 4.5 5.1 22AWG/Φ0.6 HL 250 145 7.0 12.6 4.5 5.1 22AWG/Φ0.6 HL 250 180 10.2 14.5 3.8 5.1 22AWG/Φ0.6 Positive Thermal Coefficent Diodes HL250-020~2000 Series Rev : www.leiditech.com 01.06.2018 1/5

HL250-200 12.0 17.0 4.5 5.1 22AWG/Φ0.6 HL 250 12.0 17.0 4.5 5.1 22AWG/Φ0.6 HL 250 16.0 18.0 4.5 5.1 22AWG/Φ0.6 HL 250 20.0 22.5 4.5 5.1 20 AWG/Φ0.8 HL 250 100 22.5 4.5 5.1 20 AWG/Φ0.8 HL 250 120 4.5 5.1 20 AWG/Φ0.8 HL 250 150 4.5 5.1 20 AWG/Φ0.8 HL 250 200 4.5 10.2 20 AWG/Φ0.8 Note: ① Dimensions A, B, C are the maximum sizes, all typicl valuesof D is rhe l tolerance of ± 0.75mm. Thermal Derating Chart-IH（A） Model Maximum ambient operating temperatures 40℃ 20℃ 25℃ 40℃ 50℃ 60℃ 70℃ HL 250 0.030 0.026 0.023 0.02 0.017 0.015 0.014 0.012 0.009 HL 250 0.044 0.040 0.035 0.03 0.026 0.023 0.020 0.018 0.014 HL250-040 0.059 0.053 0.047 0.040 0.034 0.031 0.027 0.024 0.018 HL250-050 0.074 0.066 0.059 0.050 0.043 0.039 0.034 0.031 0.023 HL250-060 0.089 0.079 0.070 0.060 0.051 0.046 0.041 0.037 0.027 HL250-080 0.118 0.106 0.094 0.080 0.068 0.062 0.054 0.049 0.036 HL250-090 0.133 0.119 0.105 0.090 0.077 0.069 0.061 0.055 0.041 HL250-100 0.148 0.132 0.117 0.100 0.085 0.077 0.068 0.061 0.045 HL250-110 0.163 0.145 0.129 0.110 0.094 0.085 0.075 0.067 0.050 HL250-120 0.178 0.158 0.140 0120 0.102 0.092 0.082 0.073 0.054 HL250-145 0.215 0.191 0.170 0.145 0.123 0.112 0.099 0.088 0.065 HL 250 180 0.266 0.238 0.211 0.180 0.153 0.139 0.122 0.110 0.081 HL 250 0.296 0.264 0.234 0.20 0.170 0.154 0.136 0.122 0.090 HL 250 0.592 0.528 0.468 0.40 0.340 0.308 0.272 0.244 0.180 HL 250 0.888 0.792 0.702 0.60 0.510 0.462 0.408 0.366 0.270 HL 250 1.184 1.056 0.936 0.80 0.680 0.616 0.544 0.488 0.360 HL 250 100 1.480 1.320 1.170 0.850 0.770 0.680 0.610 0.450 HL 250 120 1.776 1.584 1.404 1.020 0.924 0.816 0.732 0.540 HL 250 150 2.220 1.980 1.755 1.275 1.155 1.020 0.915 0.675 HL 250 200 2.960 2.640 2.340 2.0 1.700 1.540 1.360 1.220 0.900 HL250-020~2000 Series Rev : www.leiditech.com 01.06.2018 2/5

I h mA It (mA) Vmax interrupt V Imax A P d W Maximum Time to Trip Resistance (Ω) Current(A) Time(S) R min R max HL 250 250 1.0 0.5 0.5 160 HL 250 250 1.0 0.5 0.5 120 HL 250 250 1.0 0.5 1.5 HL 250 100 250 1.0 0.5 HL 250 120 250 1.0 0.5 HL 250 160 250 1.0 0.5 HL 250 180 250 1.0 0.8 HL 250 100 200 250 1.0 HL 250 110 220 250 1.0 2.0 HL 250 120 240 250 1.0 2.0 HL 250 145 145 290 250 1.0 5.0 3.5 6.5 HL250-180 180 650 250 3 1.8 3.0 1.0 2.2 HL250-200 200 400 250 5 2.4 HL250-400 400 800 250 5 2.8 HL250-600 600 1200 250 5 3.2 0.6 2.0 HL250-800 800 1600 250 5 3.6 0.4 1.0 HL250-1000 1000 2000 250 7 3.6 0.3 0.8 HL250-1200 1200 2400 250 7 3.6 0.2 0.8 HL250-1500 1500 3000 250 7 4.8 7.5 0.2 0.6 HL250-2000 2000 4000 250 10 4.8 0.2 0.4 Ih=Hold current:Maximum current at which the device will not interruptin 25℃ still air. It=Trip current:Minimum current at which the device from low resistance to high resistance in 25℃ still air. Vmax=Maximum continuous voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pd=Typical power dissipation:Typical amount of power dissipated from the device when in 25℃ still air environment. Rmin=Minimum resistance of device at 25℃ prior to tripping. HL250-020~2000 Series Rev : www.leiditech.com 01.06.2018 3/5

Environmental Specifications Soldering method Wave Soldering Soldering Temperature:260℃~270℃ Soldering Time:≤3sec. Soldering Position: Resettable fuse wire and the bottom ≥ 6mm。 Manual soldering Soldering Temperature:250℃~280℃ Soldering Time: ≤3sec. Soldering Position: Resettable fuse wire and the bottom ≥ 6mm。 Test Conditions Resistance change Passive aging +85℃ 1000 h ours ± 8% typical Humidity aging +85℃ 85%R.H.1000 h ours ± 8% typical Thermal shock +125℃ to 55℃ T imes ± 12% typical SolventResistance MIL-STD-202，Method 215F No change Vibration MIL-STD-202，Method 201 No change HL250-020~2000 Series HL Leiditech series productLeiditech series productLeiditech series product Rev : www.leiditech.com 01.06.2018 4/5

The maximum ambient temperature shall not exceed 40℃.Storage temperature higher than 40℃ could result in the deformation of packaging materials.The maximum relative humidity recommended for storage is 70%.High humidity with high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful substancesare present. HL250-020~2000 Series Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2018 5/5