HL130-010 LEIDITECH | Alldatasheet

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Technical content

Features：  Radial leaded Devices  Cured,flame retardant epoxy polymer insulating material meets UL94V-0  RoHS compliant and lead-free Product Dimensions Fig.1 Fig.2 Unit :mm Model Dimensions mm Lead material Shape A(max) B(max) C(max) D(typ) Tinned metal (mm) Fig HL130-010 7.4 12.7 3.8 5.1 22AWG/Φ0.6 HL130-015 7.4 13.0 3.8 5.1 22AWG/Φ0.6 HL130-017 7.4 13.5 3.8 5.1 22AWG/Φ0.6 HL 130 020 7.6 13.5 3.8 5.1 22AWG/Φ0.6 HL 130 025 7.6 13.5 3.8 5.1 22AWG/Φ0.6 HL 130 030 8.0 14.0 3.8 5.1 22AWG/Φ0.6 HL 130 040 9.4 15.0 3.8 5.1 22AWG/Φ0.6 HL 130 050 10.2 15.2 3.8 5.1 22AWG/Φ0.6 HL 130 065 12.8 18.0 3.8 5.1 22AWG/Φ0.6 HL 130 075 12.8 18.0 3.8 5.1 22AWG/Φ0.6 HL 130 090 14.5 19.6 3.8 5.1 20AWG/Φ0.8 HL 130 110 16.3 21.3 3.8 5.1 20AWG/Φ0.8 HL 130 135 17.0 22.0 3.8 5.1 20AWG/Φ0.8 HL 130 160 3.8 5.1 20AWG/Φ0.8 HL 130 185 3.8 5.1 20AWG/Φ0.8 HL 130 200 3.8 10.2 20AWG/Φ0.8 HL 130 250 3.8 10.2 20 AWG/Φ0.8 Positive Thermal Coefficent Diodes HL130-010~250 Series Note: Dimensions in the A, B, C are the maximum sizes, all typical values of D is at the tolerance of ± 0.75mm. Rev : www.leiditech.com 01.06.2018 1/4

Thermal Derating Chart-IH（A） Model Maximum ambient operating temperatures HL 130 010 0.15 0.13 0.12 0.10 0.085 0.076 0.067 0.060 0.047 HL 130 015 0.22 0.20 0.18 0.15 0.13 0.11 0.10 0.09 0.07 HL 130 017 0.25 0.22 0.20 0.17 0.14 0.13 0.11 0.10 0.08 HL 130 020 0.29 0.26 0.24 0.20 0.17 0.15 0.13 0.12 0.09 HL 130 025 0.37 0.33 0.30 0.25 0.21 0.19 0.17 0.15 0.12 HL 130 030 0.44 0.40 0.35 0.30 0.26 0.23 0.20 0.18 0.14 HL 130 040 0.59 0.53 0.47 0.40 0.34 0.30 0.27 0.24 0.19 HL 130 050 0.74 0.66 0.59 0.50 0.43 0.38 0.34 0.30 0.24 HL 130 065 0.96 0.86 0.77 0.65 0.55 0.49 0.44 0.39 0.31 HL130-075 1.10 0.99 0.89 0.75 0.64 0.57 0.50 0.45 0.35 HL130-090 1.32 1.19 1.06 0.90 0.77 0.68 0.60 0.54 0.42 HL130-110 1.62 1.45 1.30 1.10 0.94 0.84 0.74 0.66 0.52 HL130-135 1.98 1.78 1.59 1.35 1.15 1.03 0.90 0.81 0.63 HL130-160 2.35 2.11 1.89 1.60 1.36 1.22 1.07 0.96 0.75 HL130-185 2.72 2.44 2.18 1.85 1.57 1.41 1.24 1.11 0.87 HL130-200 2.94 2.64 2.36 2.00 1.70 1.52 1.34 1.20 0.94 HL130-250 3.68 3.30 2.95 2.50 2.13 1.90 1.68 1.50 1.18

Electrical Characteristics

I H A I T (A) Vmax V Imax A P d W Maximum Time to t rip Resistance(Ω) Current A Time S Rmin Rmax HL 130 010 0.10 0.20 130 0.8 0.5 2.5 9.0 HL 130 015 0.15 0.30 130 0.8 0.75 5.5 2.5 7.5 HL 130 017 0.17 0.34 130 0.8 0.85 5.2 1.5 7.0 HL 130 020 0.20 0.40 130 0.8 1.0 5.0 1.9 4.0 HL 130 025 0.25 0.50 130 1.0 1.25 4.8 1.45 3.50 HL 130 030 0.30 0.60 130 1.0 1.5 4.5 1.0 3.0 HL 130 040 0.40 0.80 130 1.0 2.0 4.5 0.75 2.0 HL 130 050 0.50 1.0 130 1.0 2.5 5.0 0.50 1.60 HL 130 065 0.65 1.3 130 1.0 3.25 5.2 0.45 1.0 HL130-010~250 Series Rev : www.leiditech.com 01.06.2018 2/4

0.75 1.5 130 1.0 3.75 5.5 0.40 0.90 HL 130 090 0.90 1.8 130 1.5 4.5 5.8 0.30 0.70 HL 130 110 1.10 2.2 130 1.8 5.5 6.3 0.20 0.65 HL 130 135 1.35 2.7 130 1.8 6.75 7.5 0.15 0.60 HL 130 160 1.60 3.2 130 2.0 8.0 0.10 0.50 HL 130 185 1.85 3.7 130 2.0 9.25 0.10 0.40 HL 130 200 2.00 4.0 130 2.2 10.0 0.10 0.30 HL 130 250 2.50 5.0 130 2.5 12.5 0.05 0.25 IH=Hold current:Maximum current at which the device will not interruptin 25℃ still air. IT=Trip current:Minimum current at which the device from low resistance to high resistance in 25℃ still air. Vmax=Maximum continuousvoltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Maximum Time-to-trip:Maximum time to trip at assigned current. Pd=Typical power dissipation:Typical amount of power dissipated from the device when in 25℃ still air environment. Rmin=Minimum resistance of device at 25℃ prior to tripping. Rmax=Maximum resistance of device at 25℃ prior to tripping. Environmental Specifications Test Conditions Resistance change Passive A ging +85℃ 1000h ours ± 8% typical Humidity A ging +85℃ 85%R.H.1000h ou rs ± 8% typical Thermal S hock +125℃ to 55℃ T imes ± 12% typical SolventResistance MIL STD 202 Method 215 F No change Vibration MIL STD 202 Method 201 No change HL130-010~250 Series Marking System HL Leiditech series productLeiditech series productLeiditech series product Rev : www.leiditech.com 01.06.2018 3/4

Soldering Temperature:260℃~270℃ Soldering Time:≤3sec Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm Manual soldering Soldering Temperature:250℃~280℃ Soldering Time: ≤3sec Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm Storage The maximum ambient temperature shall not exceed 40℃.Storage temperature higher than 40℃ could result in the deformation of packaging materials.The maximum relative humidity recommended for storage is 70%.High humidity with high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful substancesare present. HL130-010~250 Series Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2018 4/4