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The Multilayer Organic Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLO TM Inductor series of components are based on AVX’s patented multilayer organic technology (US patent 6,987,307). MLO TM Inductors incorporate very low loss organ- ic materials which allow for high Q and high stability over frequency. MLO TM inductors are surface mountable and are expansion matched to FR4 printed wiring boards. MLO TM Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil stan- dards. Finishes are available in RoHS compliant Sn. HL02 Style X Tolerance T Termination Sn100 TR Packaging Tape & Reel

APPLICATIONS

  • Mobile communications
  • Satellite Applications
  • GPS
  • Collision Avoidance
  • Wireless LAN’s

FEATURES

  • High Q
  • High SRF
  • High Frequency
  • High Withstanding Voltage
  • Low DC Resistance
  • Expansion Matched to PCB
  • Surface Mountable
  • 0402 Case Size
  • RoHS Compliant Finishes
  • Available in Tape and Reel SURFACE MOUNT ADVANTAGES
  • Inherent Low Profile
  • Excellent Solderability
  • Low Parasitics
  • Better Heat Dissipation HOW TO ORDER DIMENSIONS QUALITY INSPECTION Finished parts are 100% tested for electrical parameters and visual characteristics. TERMINATION Immersion Sn Finishes. OPERATING TEMPERATURE -55ºC to +125ºCmm (inches) LWTR W L R T XXX Inductance Expressed in nH (2 significant digits + number of zeros) for values <10nH, letter R denotes decimal point. Example: 22nH = 220 4.7nH = 4R7

0402 ELECTRICAL SPECIFICATIONS

450 MHz 900 MHz 1900 MHz 2400 MHz

Test Frequency Test Frequency Test Frequency Test Frequency Available Inductance Tolerance SRF Min Rdc Max Idc Max L (nH) A = ±0.05nH, B = ±0.1nH Q L (nH) Q L (nH) Q L (nH) Q (GHz) (Ω) (mA) 450 MHz C = ±0.2nH, D = ±0.5nH 450 MHz 900 MHz 900 MHz 1900 MHz 1900 MHz 2400 MHz 2400 MHz G = ±2%, H = ±3% J = ±5%, K = ±10% 22 30 24.033 34 44.693 11 n/a n/a 2.2 1.317 180 27 29 30.48 30 n/a n/a n/a n/a 1.94 1.621 160 32 28 37.742 27 n/a n/a n/a n/a 1.73 1.935 150 Specifications based on performance of component assembled properly on printed circuit board with 50Ω nominal impedance.

MLOTM INDUCTOR SIMULATIONS 0402 CASE SIZE Frequency (GHz) 2 108641 2 -50 -40 -10 -20 -30 Q Inductance (nH)Inductance (nH) Inductance @ 450MHz 2.0nH Frequency (GHz) 21 0 864 12 -100 -80 -20 -40 -60 100 Q Inductance @ 450MHz 4.7nH 120 SRF 5.65 SRF 10.85 Max Q Frequency (GHz) 0.5 3.5 32.514 -400 -300 -100 -200 300 200 100 Q Inductance (nH) Inductance @ 450MHz 18.2nH 400 21.5 SRF 2.38 Max Q Max Q Typical Performance: 4.7nH Typical Performance: 2.0nH Typical Performance: 18.2nH

The following section describes the guidelines for automated SMT assembly of MLOTM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT packages. Control of solder and solder paste volume is critical for surface mount assembly of MLOTM RF devices onto the PCB. Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO TM devices onto the PCB. Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO TM devices onto the PCB. In all cases, a temperature gradient of 3°C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below. Profile Parameter Pb free, Convection, IR/Convection Ramp-up rate (Tsmax to Tp 3ºC/second max. Preheat temperature (Ts min to Ts max) 150ºC to 200ºC Preheat time (ts) 60 – 180 seconds Time above TL, 217ºC (tL) 60 – 120 seconds Peak temperature (Tp) 260°C Time within 5ºC of peak temperature (tp) 10 – 20 seconds Ramp-down rate 4ºC/second max. Time 25ºC to peak temperature 6 minutes max. Critical Zone TL to Tp Ramp-down Ramp-up Ts max t 25ºC to Peak Ts min ts Preheat Tp tp TL tL Time Temperature Figure A. Typical Lead Free Profile and Parameters