HKR1105W-TR STANLEY | Alldatasheet

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I Electro-Optical Characteristics Part No. Water Clear TYP . IF Wavelength Forward Voltage VF TYP. MAX. I F Reverse CurrentIR MAX. V R Viewing Angle (2 θ 1/2) Red Red Orange Yellow Yellow-Green Green Pure Green 150 660 660 605 580 570 560 555 647 647 606 590 572 567 558 1.8 1.7 2.2 2.2 2.1 2.1 2.1 2.5 2.0 2.5 2.5 2.5 2.5 2.5 100 100 100 100 100 100 100 HKR1105W HBR1105W HAA1105W HAY1105W HPY1105W HPG1105W HBG1105W GaAlAs GaAlAs GaAsP GaAsP GaP GaP GaP mA nm mA mA µA V Deg. MIN. Spectral Line Half Width ∆∆λλ TYP. Peak λλp TYP. Dominant λλd TYP. IF Luminous Intensity IV Lens Color Emitted Color 40° 30° 50° Material (Ta=25°C) Product GuideProduct GuideProduct Guide I Outline Dimensions I Features  Dome lens provides intensified narrow, bright beam  Available for both standard and reverse mounting  Wider operating temperature: -40° ~ +100°C I Applications  High-beam indicator for automotive use  Backlighting for automotive dashboards  Indoor / outdoor full-color signboards Anode Polarity Mark PCB CathodeCathode Mark 0.5 3.2 0.6 0.6 1.6 0.5 1.55 R0.8 0.3 1.6 (1.6) (2) (4.6) 2.3+0.05 1.6 HOLE 1.5 2.1 + 0.05 1.5 H__1105W Series, Dome Lens Type SMT LEDH__1105W Series, Dome Lens Type SMT LED Unit: mm Tolerance + 0.1 I Recommended Solder Pad on a Surface Mount I Recommended Solder Pad on a reverse mount

I Absolute Maximum Ratings Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Symbol Pd IF IFM VR Topr Tstg ∆IF mW mA mA V mA/°C * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. The current derating for operation applies when the temperature is above 25°C for HBG and 75°C for HVR, HBR, HKR, HAA, HAY, HPY & HPG UnitsItem I Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions:  Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max.  Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)  Reflow Soldering: 2. Cleaning:  If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C.  Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.  Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGH__1105W-0301 I Taping Specifications I Operation Current Derating Chart (DC) HBG HAA, HAY , HPG, HPY , HBR, HKR HKR, HAA, HAY, HPY, HPG, HBG HBR (X & Y) (X & Y) I Spatial Distribution Stanley Electric Sales of America, Inc.

2660 Barranca Parkway, Irvine, CA 92606 •• Tel: 800-LED-LCD1 (533-5231) •• Fax: 949-222-0555

Website: www.stanley-electric.com Operation Heating Pre-heating LED Surface Temperature Temperature rise: 5°C/sec. Cooling: —5 °C/sec. 60 to 120 sec. 5 sec. max 120 150 240 °C~ (3.45) (0.25) (2.1) Center Hole Center Hole (1.85) 4+0. 1 φ 1.5 +0.1 8+0.2 2+0.05 4+0.1 3.5+0.05 1.75+0.1 φ 1.1)( Quantity on tape: 2000 pieces per reel (Ta=25°C) φ 21+0.8 9+0.3 11.4+1 φ 13+0.2 φ 180+0 φ 60 +1 φ 13+0.2 2+0.5 I Taping Specifications φ 1.5 (1.8) (0.25) (0.5) (2.2) (3.5) +0.1 4+0.1 4+0.1 2+0.05 1.75 +0.13.5+0.05 8+0.2 Center Hole φ 1.1)( Quantity on tape: 2000 pieces per reel Cathode RR Direction to pull Cathode TR Direction to pull 1.0 (DC) 2.33 (Pulse) Yellow HAY Green HPG Pure Green HBG Red HBR, HKR 60(HBR),75(HKR) -40 to +100 -40 to +120 -40 to +85 -40 to +100 0.42 (DC) 0.93 (Pulse) for Reverse Mount Type for Standard Mount Type Yellow-Green HPY