HDTF-3-04-S-RA-LC-100 SAMTEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 2
Technical content
- Small form factor and modular design provides significant space-savings and flexibility
- High-performance system
- Up to 84 differential pairs per linear inch
- 3, 4 and 6-pair designs on 4, 6 and 8 columns
- Integrated power, guidance, keying and side walls available
- 85 Ω and 100 Ω options
- Combine any configuration of modules to create one integrated receptacle (BSP Series); corresponding terminal modules are individually mounted to the backplane. Visit samtec.com?BSP or contact HSBP@samtec.com
- Press-fit extraction and insertion tool options; please visit samtec.com/tooling for details KEY SPECIFICATIONS FEATURES & BENEFITS SERIES INSULATOR MATERIAL CONTACT MATERIAL PLATING OPERATING TEMP RANGE CURRENT RATING VOLTAGE RATING HDTM/HDTF LCP Phosphor Bronze (HDTM) Copper Alloy (HDTF) Au or Sn over 50 µ" (1.27 µm) Ni -40 ˚C to + 105 ˚C 1.5 A per contact 48 VAC/ /68 VDC HPTS/HPTT LCP Copper Alloy Au or Sn over 50 µ" (1.27 µm) Ni -40 ˚C to + 105 ˚C 10 A per blade 48 VAC/ /68 VDC HIGH-DENSITY BACKPLANE HEADERS & SOCKETS Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. (Both shown with six 4-pair, 8 column receptacles) Traditional Backplane Up to 76 pairs per linear inch XCede ® HD Up to 84 pairs per linear inch HIGH-DENSITY, SMALL FORM FACTOR Gbps Signal, Power & Keying / Guidance options can be customized in any configuration MODULAR DESIGN (1.80 mm) .071" PITCH F-224 (Rev 05DEC24) samtec.com/XCedeHD
Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. HPTT Mates With: HPTS BODY HEIGHT A B C HDTF Board Mates: HDTM HPTS Mates with: HPTT, BSP View complete specifications at: samtec.com?HPTT View complete specifications at: samtec.com?HPTS Notes: Some lengths, styles and options are non-standard, non-returnable. XCede® is a registered trademark of Amphenol. –3 SHOWN (9.26) .365 (18.69) .736 (13.89) .547 (2.25) .088 (10.13) .399 (14.06) .554 (9.43) .371 (1.70) .067 (4.63) .182 (5.60) .220 (3.20) .126 –6 SHOWN –6 SHOWN –4 SHOWN HDTF - PAIRS PER COLUMN - NO. OF COLUMNS - PLATING - RA - WAFERS - IMPEDANCE = 30 µ" (0.76 µm) Gold on Contact Area, Matte Tin on Tail –LC = Standard –HS = High-Speed –100 = 100 Ω –085 = 85 Ω PAIRS PER COLUMN B C D –3 (12.8) .504 (26.0) 1.02 (9.9) .390 –4 (16.4) .646 (29.4) 1.16 (13.5) .531 –6 (23.6) .929 (36.6) 1.44 (20.7) .815 NO. OF COLUMNS A –04 ( 7.2) .283 –06 (10.8) .425 –08 (14.4) .567 (1.80 mm) .071" PITCH • HIGH-DENSITY BACKPLANE RECEPTACLE B C D A (0.40) .016 (1.50) .059 (1.80) .071 View complete specifications at: samtec.com?HDTF HPTT - BODY HEIGHT - PLATING - POSITION NO. 1 - POSITION NO. 2 - POSITION NO. 3 - POSITION NO. 4 - D - ORIENTATION = Terminal Based on Pair Count of Signal Modules (HDTF, BSP) –3, –4, –6 = Standard Gold on Contact Area, Matte Tin on Tail Contact Wipe Column A & B = (4.5 mm) 0.18" = (5.5 mm) 0.22" Contact Wipe Column A & B = (4.5 mm) 0.18" = (5.5 mm) 0.22" Contact Wipe Column A & B (–4 & –6 Height Only) = (4.5 mm) 0.18" = (5.5 mm) 0.22" Contact Wipe Column A & B (–6 Height Only) = (4.5 mm) 0.18" = (5.5 mm) 0.22" –RA = Right-angle A B (14.74) .580 COLUMN A POS. 1 POS. 2 POS. 3 POS. 4 COLUMN B (7.0) .276 (1.50) .059 (2.05) .081 C HPTS - BODY HEIGHT - PLATING - D - ORIENTATION = Socket Based on Pair Count of Signal Modules (HDTM) –3, –4, –6 = Standard Gold on Contact Area, Matte Tin on Tail –VT = Vertical (3.20 mm) .126" PITCH • POWER MODULES F-224 (Rev 05DEC24)samtec.com/XCedeHD