HDSM-441W BOARDCOM | Alldatasheet
Document overview
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Features
0.39” digit height Low current operation Excellent characters appearance Available in CA and CC 500 pieces per reel Moisture Sensitivity Level: Level 3 RoHS compliant Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±0.25 mm (0.01”), unless otherwise specified. Max. CAUTION: LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing.
- 2 - HDSM-441W/HDSM-443W Data Sheet Pin Connection (Common Anode) Pin No. Connection
1 CATHODE G
2 CATHODE DP
3 CATHODE A
4 CATHODE F
5 COMMON ANODE DIG2
6 CATHODE D
7 CATHODE E
8 CATHODE C
9 CATHODE B
10 COMMON ANODE DIG1
Pin Connection (Common Cathode) Pin No. Connection
1 ANODE G
2 ANODE DP
3 ANODE A
4 ANODE F
5 COMMON CATHODE DIG2
6 ANODE D
7 ANODE E
8 ANODE C
9 ANODE B
10 COMMON CATHODE DIG1
(Common Anode) Internal Circuit Diagram (Common Cathode)
- 3 - HDSM-441W/HDSM-443W Data Sheet Absolute Maximum Ratings at T A = 25°C Parameter White Unit Power Dissipation Per Segment 39 mW Peak Forward Current Per Segment (1/10 Duty Cycle, 0.1 ms pulse width) 80 mA Continuous Forward Current Per Segment Derating Linearly From 25°C Per Segment 10 mA 0.083 mA/°C Reverse Voltage Per Segment Not designed for reverse bias V Operating Temperature Range –40°C to +85°C Storage Temperature Range –40°C to +85°C Electrical/Optical Characteristics at T A = 25°C White Parameter Symbol Min. Typ. Max. Unit Test Conditions Average Luminous Intensity IV 24 40 — mcd IF = 5 mA Chromaticity Coordinates (x,y) See Figure 1 IF = 5 mA Forward Voltage, Per Segment VF — 2.95 3.8 V IF = 5 mA Reverse Current, Per Segment [1] IR — — 100 µA VR = 5V Luminous Intensity Matching Ratio IV-m — — 2:1 — IF = 5 mA Note 1: Indicates production final test condition only. Long-term reverse biasing is not recommended.
- 5 - HDSM-441W/HDSM-443W Data Sheet SMT Soldering Profile Pb-Free Reflow Soldering Profile 245°C TIME TEMPERATURE 6°C/SEC. MAX. 100 SEC. MAX.60 - 120 SEC. 3°C/SEC. MAX. 3°C/SEC. MAX. 10 - 30 SEC. 150°C 200°C 217°C (Acc. to J-STD-020C) Recommended Soldering Pattern Tape Specification 2.54 x 4 = 10.16 Recommended stencil window opening is 80% Notes: 1. The peak temperature refers to the peak package body temperature. 2. Number of reflow process shall be limited to maximum 2 times only. Cooling process to normal temperature is required between first and second soldering process. Note: Units in mm. Note: Units in mm.
For product information and a complete list of distributors, please go to our web site: www.broadcom.com. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, the A logo, and R2Coupler are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries and/or the EU. Broadcom Proprietary and Confidential. Copyright © 2017 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Limited and/or its subsidiaries. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. AV02-1643EN – April 11, 2017