HDR915MS6 SHOULDER | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 1 of 8 规格书编号 S PEC N O : 产 产 品 品 规 规 格 格 书 书 S S P P E E C C I I F F I I C C A A T T I I O O N N CUSTOMER 客 户 ： PRODUCT 产 品 ： SAW RESONATOR MODEL NO 型 号 ： HDR 915 M SMD - 6 PREPARED 编 制 ： CHECKED 审 核 ： APPROVED 批 准 ： D A T E 日 期 ： 20 0 6 - 5 - 11 无锡市好达电子有限公司 Shoulder Electronics Limited 客户确认 C USTOMER RECEIVED: 审核 C HECKED 批准 APPROVED 日期 D ATE
SAW RESONATOR HD R 915 M S6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 2 of 8 更改历史记录 History Record 更改日期 Date 规格书编号 Spec . No . 产品型号 Part No . 客户产品型号 Customer No . 更改内容描述 Modify Content 备注 Remark
SAW RESONATOR HD R 915 M S6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 3 of 8 1. SCOPE This specification shall cover the characteristi c s of 1 - port SAW resonator with 915MHz used for remote - control security. 2. ELECTRICAL SPECIFIC ATION DC V oltage VDC 10V AC V oltage Vpp 10V50Hz/60Hz Operation temperature - 4 0 ℃ to +85 ℃ Storage temperature - 45 ℃ to +85 ℃ RF Power Dissipation 0dBm
2.2 Electronic Characteristics
Item Unites Minimum Typical Maximum Ce nter Frequency MHz 91 4.750 915 .0 00 91 5.250 Insertion Loss dB 1.5 3.5 Quality Factor Unload Q 8000 12 800 50 Ω Loaded Q 1000 2000 Temperature Turnover Temperature ℃ 1 0 25 40 Stability Turnover Frequency KHz fo ± 2.7 Freq.temp.Coefficient ppm/ ℃ 2 0.037 Frequency Aging ppm/yr < ± 10 DC. Insulation Resistance M Ω 1.0 Motional Resistance R1 Ω 21.76 26 RF Equivalent Motional Inductance L1 μ H 17.298 RLC Model Motional Capacitance C1 f F 1.749 Pin 1 to Pin 2 Staic Capacitance pF 2 .7 3.1 3.5 Transducer Static Capacitan ce pF 2.3 3. TEST CIRCUIT
SAW RESONATOR HD R 915 M S6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 4 of 8 4. DIMENSION B# , E# Input/Output A # ,C # , F # ,D # Ground 5. ENVIRONMENTAL CHARACTERISTICS 5 - 1 High temperature exposure Subject the device to +85 ℃ for 16 hours. Then release the resonator into the room conditions for 24 hours prior to the measurement. It shall fulfi ll the specifications in 2.2 . 5 - 2 Low temperature exposure Subject the device to - 4 0 ℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2 . 5 - 3 Temperature cycling Subject the device to a low temperature of - 40 ℃ for 30 minutes. Following by a high temperature of +8 5 ℃ for 30 Minutes. Then rele ase the device into the room conditions for 24 hours prior to the me a surement. It shall meet the specifications in 2.2 . 5 - 4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 ℃ ± 10 ℃ for 10 ± 1 sec. Then rele ase the device into the room conditions for 4 hours. The device shall me et the specifications in 2.2 . 5 - 5 Solderability Subject the device terminals into the solder bath at 245 ℃ ± 5 ℃ for 5s, More than 95% area of the terminals must be covered with new s older. It shall me et the specifications in 2.2 . 5 - 6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfi ll the specifications in 2.2 . 5 - 7 Vibration Subject the device to the vibration f or 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall f ulfill the specifications in 2.2 .
SAW RESONATOR HD R 915 M S6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 5 of 8 6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause det e rioration &destruction of th e component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause det e ri oration & destruction of the component. Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of component. 7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1 (2) Reel: Figure 2 (3) The product shall be packed properly not to be damaged during transportation and storage.
7.2 Reeling Quantity
1000 pcs/reel 7 ’’ 3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below. (2) Label Device Name User Product Name Quantity
SAW RESONATOR HD R 915 M S6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 6 of 8 Lot No. (3) Leader part and vacant position spec ifications. 8. TAPE SPECIFICATIONS 8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
8.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15 º (2) speed: 300mm/min. (3) force: 20~70g [Figure 1] Carrier Tape Dimensions
SAW RESONATOR HD R 915 M S6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 7 of 8 [Unit:mm] W F E P0 P1 P2 D0 D1 t1 t2 A B 12.0 ± 0.3 5.5 ± 0.05 1.75 ± 0.1 4.0 ± 0.1 4 .0 ± 0.1 2.0 ± 0.05 Ø 1.5 ± 0.1 Ø 1.0 ± 0.25 0.3 ± 0.05 1.25 ± 0.1 3.3 ± 0.1 3.3 ± 0.1 [Figure 2]
SAW RESONATOR HD R 915 M S6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 8 of 8