HDR433M LUGUANG | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  1. SCOPE This specification shall cover the characteristics of 1-port SA W resonator with 433.92M used for remote-control security. 2. ELECTRICAL SPECIFICATION D C V o l t a g e V D C 1 0 V AC V oltage Vpp 10V50Hz/60Hz Operation temperature -40 ℃ to +85 ℃ Storage temperature -45 ℃ to +85 ℃ R F P o w e r D i s s i p a t i o n 0 d B m 2.2Electronic Characteristics Item Unites Minimum Typical Maximum Center Frequency MHz 433.845 433.920 433.995 Insertion Loss dB 1.5 2.5 Quality Factor Unload Q 8000 12800 50Ω Loaded Q 1000 2000 Temperature Stability Turnover Temperature ℃ 10 25 40 Freq.temp.Coefficient ppm/℃2 0.032 Frequency Aging ppm/yr <±10 DC. Insulation Resistance MΩ 1.0 RF Equivalent RLC Model Motional Resistance R1 Ω 21 26 Motional Inductance L1 μH 95.995 Motional Capacitance C1 fF 1.4014 Pin 1 to Pin 2 Staic Capacitance pF 1.7 2.0 2.3 Transducer Static Capacitance pF 1.95 http://www.luguang.cn mail:lge@luguang.cn HDR433M
  1. TEST CIRCUIT 4. DIMENSION 4-1 Typical dimension(unit: mm) http://www.luguang.cn mail:lge@luguang.cn HDR433M

4-2 Typical circuit board land patter 5. ENVIRONMENTAL CHARACTERISTICS 5-1 Temperature cycling Subject the device to a low temperature of -40 ℃for 30 minutes. Following by a high temperature of +25 ℃ for 5 Minutes and a hi gher temperature of +85 ℃ for 30 Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the measurement. It shall meet the specifications in 2.2. 5-2 Resistance to solder heat Submerge the device terminals into the solder bath at 260 ℃ ±5℃ for 10 ±1 sec. Then release the device into the room conditions for 4 hours. It shall meet the specifications in 2.2. 5-3 Solderability Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the soldering pad must be cove red with new solder. It shall meet the specifications in 2.2. 5-4 Mechanical shock Drop the device randomly onto the c oncrete floor from the height of 1 m 3 times. the resonator shall fulfill the specifications in 2.2. 5-5 Vibration Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. The resonator shall fulfill the specifications in 2.2. http://www.luguang.cn mail:lge@luguang.cn HDR433M

  1. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cau se deterioration & destruction of the component. Please avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be solder ed. Please avoid soldering another part of component. http://www.luguang.cn mail:lge@luguang.cn HDR433M