HDMEZZ SAMTEC | Alldatasheet
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Technical content
The HD Mezz performs at 9.0 GHz/pair at a 20mm stack HD Mezz is a 1.2mm x 2mm grid interconnect system for elevated, high speed board-to- board applications. The high density array’s open pin fi eld design allows both single-end- ed or differential pair routing. When routed differentially, HD Mezz is rated at 9.0 GHz/pair at a 20mm stack height. The HD Mezz is sourced by both Sam- tec and Molex Incorporated. The HDAM/HDAF Series (HD Mezz) is available in: 143, 195, and 299 positions 20mm, 25mm, 30mm, and 35mm standard stack heights Custom heights available Dual wipe contacts provide a reliable mating interface and the 1.2mm grid is ideal for applications where PCB real estate is limited. The HD Mezz has the option to contain lead or a lead-free tin alloy, to meet RoHS compliancy requirements. The HDAM/ HDAF Series also incorporates guide posts as a standard feature to aid in alignment. Final Inch® information is available for the HD Mezz system. Final Inch® is a “reference design” for one of the most diffi cult design issues on the board - the Breakout Region (BOR) around the connector. Samtec can provide empirical TDR and frequency domain data, test boards, and validated elect- rical models for the HD Mezz system. This information is a time saving and unmatch- ed service in the interconnect industry. Visit www.fi nalinch. com for more information. Other high density, high speed array interconnects include: SEARAY™
- DP Array™
- SamArray® Guide posts for alignment 1.2mm x 2mm grid High density elevated board-to-board Elevated stack heights of 20mm, 25mm, 30mm and 35mm *HD Mezz is a trademark of Molex Incorporated.©Samtec, Inc., 2007 143, 195, and 299 positions