HDMI2C1-6C1_V01 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Features

  • For HDMI 1.4 application, operating temperature from -40 to 85 °C
  • 8 kV contact ESD protection on the connector side (IEC 61000-4-2 level 4)
  • Supports direct connection to low-voltage HDMI ASIC and/or CEC driver (down to 1.8 V)
  • High integration level in one package
  • DDC (I2C) link protection, bidirectional signal conditioning circuit, and dynamic pull-up
  • CEC bus protection, bidirectional level-shifter, backdrive protection, and independent structure from main power supply
  • HEAC link protection and line matching
  • HPD pulls down, signal conditioning with level shifter and backdrive protection
  • Short-circuit protection on 5V output
  • Proposed in 500 µm pitch QFN 18L 3.5 x 3.5
  • Benefits: – Minimal PCB footprint in tablet, set top box, game console, and other consumer application – Protection of ultra-sensitive HDMI ASICs – Wake-up from standby through CEC bus – Ultralow power consumption in standby mode – Improved HDMI interface ruggedness and user experience – Long and/or poor quality cable support with dynamic pull-up on DDC bus
  • Complies with the following standards: – Dedicated for HDMI 1.4 version – IEC 61000-4-2 level 4 – JESD22-A114D level 2

Applications

Consumer and computer electronics HDMI source device such as:

  • Tablet, smartphone, and notebook
  • HD set-top boxes
  • Game console
  • DVD and blu-ray disk systems
  • PC graphic cards

Description

The HDMI2C1-6C1 is an integrated ESD protection and signal conditioning device for control links of HDMI transmitters (source). This device is a simple solution that provides HDMI designers with an easy and fast way to reach full compliance with the stringent HDMI CTS on a wide temperature range. HDMI logo and high-definition multimedia interface are trademarks or registered trademarks of HDMI licensing LLC. QFN_18L 3.5 x 3.5 pitch 0.5 mm VDD_5V VDD_IC FAULT HPD_IC VDD_CEC_IC CEC_IC 5V_OUT HPD CEC VDD_CEC Utility HEAC - HEAC+ matching SCL_IC SDA_IC SDA SCL I2C driver Booster OTP Driver UVLO UVLO UVLO HDMI2C1 -6C1 Product status link HDMI2C1-6C1 ESD protection and signal booster for HDMI source control stage interface HDMI2C1-6C1 Datasheet DS9943 - Rev 4 - August 2022 For further information contact your local STMicroelectronics sales office.

1 Functional description

from standby mode (all power supply off, except the CEC power supply). Figure 1. Pin configuration (bump side) pin out, top view

2 Application information

2.1 CEC line description

The CEC bus is described in the HDMI standards as the consumer electronics control. It provides control functions between all the various audiovisual equipment chained in the user's environment. The CEC block integrated in the HDMI2C1-6C1 implements a level shifter, shifting the cable CEC +3.3 V voltage (VDD_CEC) down to the ASIC power supply voltage (VDD_IC) that can be as low as 1.8 V. The Figure 2 shows the functional diagram of the integrated CEC block. Figure 2. CEC link functional diagram mode (open circuit) protecting the circuitry and the application against hazardous backdrive. sink drives the communication. Figure 3. CEC simplified

Application information

HDMI2C1-6C1 keeps the CEC bus working properly while all other outputs are put in high-Z mode. standard, level 4 (8 kV contact).

2.2 DDC bus description

communication channel a key element in the HDMI application. voltage from the cable (V5V_OUT) down to the ASIC voltage level (VDD_IC) that can be as low as 1.8 V. integrated in the HDMI2C1-6C1 device. Figure 4. DDC buffer functional diagram (SCL and SDA lines) VDD_5V = 5 V, VDD_IC = 1.8 V, unless otherwise specified).

Figure 5. Simplified view of the electrical parameters of the DDC block of 750 pF, it is not possible to guarantee a rise time lower than 1µs in the worst case. capacitance, allowing driving any HDMI cable. integrated in the HDMI2C1-6C1 device.

Figure 6. Benefit of the dynamic pull-up on the DDC bus (SDA, SCL, SDA_IC, SCL_IC) must be set to a high level at the same time. IEC61000-4-2 standard, level 4 (8 kV contact).

2.3 HEAC link and HPD line description

Figure 7 shows an overview of the function diagram of the integrated block. Figure 7. HEAC / HPD utility functional block diagram the device to manage separately the HPD and the HEAC links. IEC61000-4-2 standard, level 4 (8 kV contact). device in order to detect if a sink device is connected through an HDMI cable. the ASIC power supply VDD_IC. Otherwise, the CEC_IC pin remains in low state. = 25 °C, VDD_5V = 5 V, unless otherwise specified).

Figure 8. Simplified view of the electrical parameters of the HPD block transmitted through this link. applications over the HDMI cable. necessary to use a coaxial cable from TV to audio amplifier. HEAC in order to ease as much as possible the PCB layout. must be protected against the accidental short circuit that could occur on the cable side. limits the current through the +5 V power supply. If the current is too high (short circuit), the device opens the +5V. the HDMI ASIC that an abnormal situation has been detected (option). enables the +5V_OUT only if the main power supply has reached a minimal value VDD_5V_ON. The Figure 9. 5 V link functional diagram shows the functional diagram of the current limiter block.

Figure 9. 5 V link functional diagram 4 (8 kV contact). The decoupling capacitance is mandatory accordingly to the power management state of the art.

2.5 Application block diagrams

The Figure 10 shows an application block diagram proposal, with all possible options implemented. enhancing the final user experience. Figure 10. Application block diagram Table 1. External component recommendations R6 270 kΩ to 1 MΩ pull up resistance on CEC line, ASIC side. Note: SCL_IC, SDA_IC and CEC_IC have to be driven with an ASIC working with open drain outputs.

Figure 11. Pin numbering

3 Electrical characteristics

Table 2. Absolute maximum ratings (limiting values)

  1. With a 1 µF low ESR capacitor connected to the 5V_OUT pin

Table 3. Power supply characteristics (Tamb = 25 °C)

  1. In order to activate the DDC lines functional block, the three following conditions have to be met:
  • VDD_5V has to reach the VDD_ON threshold
  • The inputs and outputs of the bidirectional level shifters must be set to a high level after the power-on
  • The HPD line has to be activated one time HDMI2C1-6C1

Electrical characteristics

Table 4. CEC electrical characteristics (Tamb = 25 °C, VDD_CEC = 3.3 V, VDD_CEC_IC = 1.8 V, unless otherwise

0 V,VDD_IC = 0 V, VBIAS =

0 V, f = 1 MHz, VOSC = 30

  1. Test conditions are compliant with the worst case CEC specification:
  • Correspond to two 27 kΩ +5% pull-up resistances in parallel (compliant with HDMI CTS)
  • Max capacitance corresponding to nine equipments chained on the CEC bus 2. Maximum capacitance allowed at connector output is 200 pF in the HDMI 1.4 specification.

Table 5. HDMI 5V_OUT current limiter electrical characteristics (Tamb = 25 °C, VDD_5V = 5 V, unless

  1. HDMI 1.4 specification requires a maximum of 100mV voltage-drop.
  2. Maximum allowed output current is 500 mA when a sink is powered off in the HDMI 1.4 specification.

Table 6. HPD, HEAC, and utility line electrical characteristics(Tamb = 25 °C, VDD_5V = 5 V, unless otherwise Table 7. DDC bus (SDA and SCL) line electrical characteristics (Tamb = 25 °C, VDD_5V = 5 V, VDD_IC = 1.8 V,

  1. Maximum load capacitance allowed on an I2C entire link (cable plus connector) is 750pF in the HDMI 1.4 specification.
  2. Two pull-up resistors in parallel (sink 47 kΩ + source 2 kΩ).
  3. Maximum capacitance allowed at connector output is 50pF in the HDMI 1.4 specification.

4 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.

4.1 QFN package information

Figure 18. QFN package outline

Package information

Table 8. QFN package mechanical data Figure 19. QFN footprint recommendation (dimensions in mm)

5 Ordering information

Figure 20. Ordering information scheme Table 9. Ordering information

  • STMicroelectronics 400 micro-meter Flip Chip: package description and recommendation for use HDMI2C1-6C1

Ordering information

Revision history

Table 10. Document revision history 25-Jul-2014 1 Initial release. 10-Aug-2018 2 Minor text changes to improve readability. 15-May-2019 3 Updated Figure 20. Updated Features, Figure 3, Section 2.2 , Table 3, Figure 20 and Table 9. Minor text changes to improve readability.

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