HDF900ES6 SHOULDER | Alldatasheet
Document overview
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- PDF pages: 9
Technical content
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoul der.cn Page 1 of 9 规格书编号 S PEC N O : 产 产 品 品 规 规 格 格 书 书 S S P P E E C C I I F F I I C C A A T T I I O O N N CUSTOMER 客 户 ： PRODUCT 产 品 ： SAW FILTER MODEL NO 型 号 ： HDF 90 0 E SMD - 6 M ARKING 印 字 ： HDF6 9 49 PREPARED 编 制 ： CHECKED 审 核 ： APPROVE D 批 准 ： D A T E 日 期 ： 20 11 - 2 - 7 无锡市好达电子有限公司 Shoulder Electronics Limited 客户确认 C USTOMER RECEIVED: 审核 C HECKED 批准 APPROVED 日期 D ATE
SAW FILTER HDF 9 0 0 E SMD - 6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoul der.cn Page 2 of 9 更改历史记录 History Record 更改日期 Date 规格书编号 Spec . No . 产品型号 Part No . 客户产品型号 Customer No . 更改内容描述 Modi fy Content 备注 Remark
SAW FILTER HDF 9 0 0 E SMD - 6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoul der.cn Page 3 of 9 1. SCOPE This specification shall cover the characteristics of SAW filter With HDF 90 0 E used for the page system. 2. ELECTRICAL SPECIFICATION DC V oltage VDC 10V AC V oltage Vpp 10V50Hz/60Hz Operation temperature - 4 0 ℃ to +85 ℃ Storage temperature - 45 ℃ to +85 ℃ RF Power Dissipation 0dBm Electronic Characteristics 2 - 1.Typical frequency response
SAW FILTER HDF 9 0 0 E SMD - 6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoul der.cn Page 4 of 9 2 - 2.Electrical characteristics U nit Minimum Typical Maximum Center Frequency MHz - 9 0 0 - Insertion Loss (In Fc +/ - 12.5 MHz) dB 2. 5 4 .0 Amplitude Rip ple (In Fc +/ - 12.5 MHz) dB 1.0 2.2 Relative Attenuation
650 MHz ~ 845 MHz
945 MHz ~ 1 150 MHz
Input/Output Impedance Ohms 50 3. TEST CIRCUIT
SAW FILTER HDF 9 0 0 E SMD - 6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoul der.cn Page 5 of 9 4. DIMENSION Marking ： HDF 69 49 HD: Brand F : Filter 6 : SMD - 6 9 49 : No.
SAW FILTER HDF 9 0 0 E SMD - 6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoul der.cn Page 6 of 9 5. ENVIRONMENTAL CHARACTERISTICS 5 - 1 High temperature exposure Subject the device to +85 ℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shal l fulfill the specifications in 2 - 2 . 5 - 2 Low temperature exposure Subject the device to - 4 0 ℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2 - 2 . 5 - 3 Tempera ture cycling Subject the device to a low temperature of - 40 ℃ for 30 minutes. Following by a high temperature of +8 5 ℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the me a surement. It shall meet the specifications in 2 - 2 . 5 - 4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 ℃ ± 10 ℃ for 10 ± 1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in 2 - 2 . 5 - 5 Solde rability Subject the device terminals into the solder bath at 245 ℃ ± 5 ℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in 2 - 2 . 5 - 6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2 - 2 . 5 - 7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the speci fications in 2 - 2 . 6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause det e rioration &destruction of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause det e ri o ration & destruction of the component. Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be solded. Please avoid soldering another part of component.
SAW FILTER HDF 9 0 0 E SMD - 6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoul der.cn Page 7 of 9 7 . Packing 7 .1 Dimensions (1) Carrier Tape: Figure 1 (2) Reel: Figur e 2 (3) The product shall be packed properly not to be damaged during transportation and storage. 7 .2 Reeling Quantity 1000 pcs/reel 7’’ 3000 pcs/reel 13’’ 7 .3 Taping Structure (1) The tape shall be wound around the reel in the directio n shown below. (2) Label Device Name User Product Name Quantity Lot No. (3) Leader part and vacant position specifications.
SAW FILTER HDF 9 0 0 E SMD - 6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoul der.cn Page 8 of 9 8 . TAPE SPECIFICATIONS 8 .1 Tensile Strength of Carrier Tape: 4.4N/mm width 8 .2 Top Cover Tape Adhesio n (See the below figure) (1) pull off angle: 0~15 º (2) speed: 300mm/min. (3) force: 20~70g [Figure 1] Carrier Tape Dimensions [Unit:mm] W F E P0 P1 P2 D0 D1 t1 t2 A B 12.00 ±0.30 5.50 ±0.10 1.75 ±0.10 4.00 ±0.10 4.00 ±0.10 2.00 ±0.10 Ø1.50 Ø 1.5 ± 0.25 0.31 ±0.05 1.30 ±0.10 3.4 MAX. 3.4 MAX [Figure 2]
SAW FILTER HDF 9 0 0 E SMD - 6 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoul der.cn Page 9 of 9 [Unit:mm] A B C D E W t r Ø 330 ± 1.0 Ø 100 ± 0.5 Ø 13 ± 0.5 Ø 21 ± 0.8 ± 0.5 ± 0.3 max. 1.0 max.