HDF799CF11 SHOULDER | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 1 of 6 规格书编号 S PEC N O : 产 产 品 品 规 规 格 格 书 书 S S P P E E C C I I F F I I C C A A T T I I O O N N CUSTOMER 客 户 ： PRODUCT 产 品 ： SAW FILTER MODEL NO 型 号 ： HDF 799 C F11 PREPARED 编 制 ： CHECKED 审 核 ： APPROVED 批 准 ： D A T E 日 期 ： 200 6 - 5 - 1 1 无锡市好达电子有限公司 Shoulder Electronics Limited 客户确认 C USTOMER RECEIVED: 审核 C HECKED 批准 APPROVED 日期 D ATE
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 2 of 6 更改历史记录 History Record 更改日期 Date 规格书编号 Spec . No . 产品型号 Part No . 客户产品型号 Customer No . 更改内容描述 Modify Content 备注 Remark
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 3 of 6 1. Package Dimension 2. Marking HD F 799 C
2.1 Color: Black or Blue
2.2 799.0 : Center Frequency(MHz) 3.Performance 3.1App lication Low - Loss SAW Filter of cordless system. Center Frequency: 799.0 MHz 3.2Maximum Rating Operation Temperature Range - 4 0 ℃ to + 85 ℃ Storage Temperature Range - 40 ℃ to +85 ℃ DC. Permissive V oltage 0 V DC. max. Maximum Input Power 0 dBm
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3.3 Electronic Characteristics
Center frequency fo 799.000 MHz Insertion Loss: Fo Fo - 100 ~150MHz Fo +120 ~150MHz 6. 0max 45.0min 50.0min dB Ripple(Fo ± 10MHz) 2.0max dB Passband width ±18 max. MH z Input/Output impedance 50//0 Ω //pF
3.4 Frequency Characteristics
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3.5 Test Circuit
- ENVIRONMENTAL CHARACTERISTICS 4 - 1 High temperature exposure Subject the device to +85 ℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 3.3 . 4 - 2 Low temperature exposure Subject the device to - 4 0 ℃ for 16 hours. Then release the device into th e room conditions for 24 hours prio r to the measurement. It shall fulfill the specifications in 3.3 . 4 - 3 Temperature cycling Subject the device to a low temperature of - 40 ℃ for 30 minutes. Following by a high temperature of +8 5 ℃ for 30 Minutes. Then rele ase the device into the room conditions for 24 hours prior to the me a surement. It shall meet the specifications in 3.3 . 4 - 4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 ℃ ± 10 ℃ for 10 ± 1 sec. Then rele ase the device into the room conditions for 4 hours. The device shall meet the specifications in 3.3 . 4 - 5 Solderability Subject the device terminals into the solder bath at 245 ℃ ± 5 ℃ for 5s, More than 95% area of the terminals must be covered with new s older. It shall meet the specifications in 3.3 . 4 - 6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 3.3 . 4 - 7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The devic e shall fulfill the specifications in 3.3 .
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 6 of 6 5. REMARK
5.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage.
5.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & dest ruction of the component. Please avoid ultrasonic cleaning
5.3 Soldering
Only lea ds of component may be soldered . Please avo id soldering another part of component.