HDF446BS4 SHOULDER | Alldatasheet
Document overview
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- PDF pages: 8
Technical content
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 1 of 8 规格书编号 S PEC N O : 产 产 品 品 规 规 格 格 书 书 S S P P E E C C I I F F I I C C A A T T I I O O N N CUSTOMER 客 户 ： PRODUCT 产 品 ： SAW FILTER MODEL NO 型 号 ： HDF 4 46 B S4 M ARKING 印 字 ： HDF4406 PREPARED 编 制 ： CHECKED 审 核 ： APPROVED 批 准 ： D A T E 日 期 ： 200 6 - 5 - 11 无锡市好达电子有限公司 Shoulder Electronics Limited 客户确认 C USTOMER RECEIVED: 审核 C HECKED 批准 APPROVED 日期 D ATE
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 2 of 8 更改历史记录 History Record 更改日期 Date 规格书编号 Spec . No . 产品型号 Part No . 客户产品型号 Customer No . 更改内容描述 Modi fy Content 备注 Remark
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 3 of 8 1. SCOPE This specification shall cover the characteristics of SAW filter With F446B used for the page system. 2. E LECTRICAL SPECIFICATION DC V oltage VDC 10V AC V oltage Vpp 10V50Hz/60Hz Operation temperature - 4 0 ℃ to + 85 ℃ Storage temperature - 45 ℃ to +85 ℃ RF Po wer Dissipation 0dBm Electronic Characteristics 2 - 1.Typical frequency response 2 - 2.Electrical characteristics Part number F446B Unit Nominal center frequency (Fo) 446.00 M Hz Insertion Loss 1.Fo - 25 to Fo - 18 MHz 50min. dB 2.Fo ± 3.0 M Hz 4.0max. 3.Fo +30.0MHz to Fo +200MHz 45min. Ripple (with Fo ± 3.0 MHz) 2.0 dB Input/Output Impedance(Nom inal) 150/0 Ω /pF
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 4 of 8 3. TEST CIRCUIT 4. DIMENSION Marking ： HDF 4406 HD: Brand F : Filter 4 : SMD - 4 406 : No.
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 5 of 8 5. ENVIRONMENTAL CHARACTERISTICS 5 - 1 High temperature exposure Subject the device to +85 ℃ for 16 hours. Then release th e filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2 - 2 . 5 - 2 Low temperature exposure Subject the device to - 40 ℃ for 16 hours. Then release the device into the room conditions for 24 hours prio r to the measurement. It shall fulfill the specifications in 2 - 2 . 5 - 3 Temperature cycling Subject the device to a low temperature of - 40 ℃ for 30 minutes. Following by a high temperature of +8 5 ℃ for 30 Minutes. Then release the device into the room condi tions for 24 hours prior to the me a surement. It shall meet the specifications in 2 - 2 . 5 - 4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 ℃ ± 10 ℃ for 10 ± 1 sec. Then release the device into the room condi tions for 4 hours. The device shall meet the specifications in 2 - 2 . 5 - 5 Solderability Subject the device terminals into the solder bath at 245 ℃ ± 5 ℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifica tions in 2 - 2 . 5 - 6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2 - 2 . 5 - 7 Vibration Subject the device to the vibration for 1 hour each in x,y an d z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2 - 2 . 6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause det e rioration &destruction of the component. Please av oid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause det e rioration & destruction of th e component. Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of component. 7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 6 of 8 (2) Reel: Figure 2 (3) The product shall be packed properly not to be damaged during transportation and storage.
7.2 Reeling Quantity
1000 pcs/reel 7’’ 3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below. (2) Label Device Name User Product Name Quantity Lot No. (3) Leader part and vacant position specifications.
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 7 of 8 8. TA PE SPECIFICATIONS 8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
8.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15 º (2) speed: 300mm/min. (3) force: 20~70g [Figure 1] Carrier Tape Dimensions [Unit:mm] W F E P0 P1 P2 D0 D1 t1 t2 A B 12.00 ±0.30 5.50 ±0.10 1.75 ±0.10 4.00 ±0.10 8.00 ±0.10 2.00 ±0.10 Ø1.50 Ø1.0 ± 0.25 0.25 ±0.05 1.65 ±0.10 4.04 ±0.10 4.10 ±0.10
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 8 of 8 [Figure 2] [Unit:mm] A B C D E W t r Ø 330 ± 1.0 Ø 100 ± 0.5 Ø 13 ± 0.5 Ø 21 ± 0.8 ± 0.5 ± 0.3 m ax. 1.0 max.