HDF402AF11 SHOULDER | Alldatasheet
Document overview
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- PDF pages: 5
Technical content
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 1 of 5 规格书编号 S PEC N O : 产 产 品 品 规 规 格 格 书 书 S S P P E E C C I I F F I I C C A A T T I I O O N N CUSTOMER 客 户 ： PRODUCT 产 品 ： SAW FILTER MODEL NO 型 号 ： HDF 40 2 A F11 PREPARED 编 制 ： CHECKED 审 核 ： APPROVED 批 准 ： D A T E 日 期 ： 200 6 - 5 - 11 无锡市好达电子有限公司 Shoulder Electronics Limited 客户确认 C USTOMER RECEIVED: 审核 C HECKED 批准 APPROVED 日期 D ATE
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 2 of 5 更改历史记录 History Record 更改日期 Date 规格书编号 Spec . No . 产品型号 Part No . 客户产品型号 Customer No . 更改内容描述 Modify Content 备注 Remark
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 3 of 5 1. SCOPE This specification shall cover the characteristics of SAW filter With F40 2 A used for the page system. 2. ELECTRICAL SPECIFICATION DC V oltage VDC 10V AC V oltage Vpp 10V50Hz/60Hz Operation temperature - 4 0 ℃ to + 85 ℃ Storage temperature - 45 ℃ to +85 ℃ RF Power Dissipation 0dBm Electronic Characteristics 2 - 1.Typical frequency response 2 - 2.Electrical characteristics Part number F40 2 A Unit Nominal center frequency (Fo) 40 2 MHz Insertion Loss 1.fo - 45.8~fo - 39.8 MHz 50min. dB 2.fo ± 3.0 MHz 4.0max. 3.fo +39.8~ fo +45.8MHz 45min. Ripple (with Fo ± 3.0MHz) 2.0max dB Input/Output Impedance(Nominal) 50//0 Ω /pF
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 4 of 5 3. TEST CIRCUIT 4. DIMENSION
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: i nfo@shoulder.cn Page 5 of 5 5. ENVIRONMENTAL CHARACTERISTICS 5 - 1 High temperature exposure Subject the device to +85 ℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfi ll the specifications in 2 - 2 . 5 - 2 Low temperature exposure Subject the device to - 4 0 ℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2 - 2 . 5 - 3 Temperature cy cling Subject the device to a low temperature of - 40 ℃ for 30 minutes. Following by a high temperature of +8 5 ℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the me a surement. It shall meet the specifications in 2 - 2 . 5 - 4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 ℃ ± 10 ℃ for 10 ± 1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in 2 - 2 . 5 - 5 Solderabilit y Subject the device terminals into the solder bath at 245 ℃ ± 5 ℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in 2 - 2 . 5 - 6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2 - 2 . 5 - 7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specificatio ns in 2 - 2 . 6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause det e rioration &destruction of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause det e ri oration & destruction of the component. Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of component.