HDF307AS4 SHOULDER | Alldatasheet
Document overview
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- PDF pages: 7
Technical content
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@ shoulder.cn Page 1 of 7 规格书编号 S PEC N O : 产 产 品 品 规 规 格 格 书 书 S S P P E E C C I I F F I I C C A A T T I I O O N N CUSTOMER 客 户 ： PRODUCT 产 品 ： SAW FILTER MODEL NO 型 号 ： HDF 30 7 A SMD - 4 M ARKING 印 字 ： HDF434 6 PREPARED 编 制 ： CHECKED 审 核 ： APPROVE D 批 准 ： D A T E 日 期 ： 20 10 - 12 - 24 无锡市好达电子有限公司 Shoulder Electronics Limited 客户确认 C USTOMER RECEIVED: 审核 C HECKED 批准 APPROVED 日期 D ATE
SAW FILTER HDF 30 7 A SMD - 4 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@ shoulder.cn Page 2 of 7 1 . ELECTRICAL SPECIFICATION DC V oltage VDC 10V AC V oltage Vpp 10V50Hz/60Hz Operation temperature - 45 ℃ to +85 ℃ Storage temperature - 45 ℃ to +85 ℃ RF Power Dissipation 0dBm Electronic Characteristics 1 - 1.Typical frequencyr esponse 1 - 2.Electrical characteristics U nit Minimum Typical Maximum Center Frequency MHz - 307.075 - Insertion Loss (In Fc +/ - 2.95 MHz) dB 2.0 3.0 Amplitude Ripple (In Fc +/ - 2.95 MHz) dB 1.0 1.5 Relative Attenuation
0.3 MHz ~ Fc - 25 MHz
Fc - 25 MHz ~293.5 MHz
319.7 MHz ~Fc+25 MHz
Fc+25 MHz ~ 800 MHz dB Input/Output Impedance Ohms 50
SAW FILTER HDF 30 7 A SMD - 4 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@ shoulder.cn Page 3 of 7 2 . TEST CIRCUIT 3 . DIMENSION Marking ： HDF HD: Brand F : Filter 4 : SMD - 4 346 : No.
SAW FILTER HDF 30 7 A SMD - 4 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@ shoulder.cn Page 4 of 7 4 . ENVIRONMENTAL CHARACTERISTICS 5 - 1 High temperature exposure Subject the device to +85 ℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fu lfill the specifications in table 1. 5 - 2 Low temperature exposure Subject the device to - 20 ℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1. 5 - 3 Tem perature cycling Subject the device to a low temperature of - 40 ℃ for 30 minutes. Following by a high temperature of +80 ℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the me a surement. It shall meet the specifications in table 1. 5 - 4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 ℃ ± 10 ℃ for 10 ± 1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in table 1. 5 - 5 Solderability Subject the device terminals into the solder bath at 245 ℃ ± 5 ℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in table 1. 5 - 6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in table 1. 5 - 7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1. 5 - 8 Lead fatigue 5 - 8 - 1 Pulling test Weight along with the direction of lead without an shock 1 kg . The device shall satisfy all the initial Characteristics. 5 - 8 - 2 Bending test Lead shall be subject to withstand against 90 ℃ bending with 450g weight in the d i rection of thickness. This operation shall be done toward both direction. The device shall show no evidence of damage and shall satisfy all the initial electrical characterist ics.
SAW FILTER HDF 30 7 A SMD - 4 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@ shoulder.cn Page 5 of 7 5 . REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause det e rioration &destruction of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause det e ri oration & dest ruction of the component. Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be solded. Please avoid soldering another part of component. 6 . Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1 (2) Reel: Figure 2 (3) T he product shall be packed properly not to be damaged during transportation and storage.
7.2 Reeling Quantity
1000 pcs/reel 7’’ 3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown belo w.
SAW FILTER HDF 30 7 A SMD - 4 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@ shoulder.cn Page 6 of 7 (2) Label Device Name User Product Name Quantity Lot No. (3) Leader part and vacant position specifications. 7 . TAPE SPECIFICATIONS 8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
8.2 Top Cover Tape Adhesion ( See the below figure)
(1) pull off angle: 0~15 º (2) speed: 300mm/min. (3) force: 20~70g
SAW FILTER HDF 30 7 A SMD - 4 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@ shoulder.cn Page 7 of 7 [Figure 1] Carrier Tape Dimensions [Unit:mm] W F E P0 P1 P2 D0 D1 t1 t2 A B 12.00 ±0.30 5.50 ±0.10 1.75 ±0.10 4.00 ±0.10 8.00 ±0.10 2.00 ±0.10 Ø1.50 Ø1.0 ± 0.25 0.25 ±0.05 1.65 ±0.10 4.04 ±0.10 4.10 ±0.10 [Figure 2] [Unit:mm] A B C D E W t r Ø 330 ± 1.0 Ø 100 ± 0.5 Ø 13 ± 0.5 Ø 21 ± 0.8 ± 0.5 ± 0.3 max. 1.0 max.