HDF302AS3 SHOULDER | Alldatasheet
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- PDF pages: 8
Technical content
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 1 of 8 规格书编号 S PEC N O : 产 产 品 品 规 规 格 格 书 书 S S P P E E C C I I F F I I C C A A T T I I O O N N CUSTOMER 客 户 ： PRODUCT 产 品 ： SAW FILTER MODEL NO 型 号 ： HDF 3 0 2 A SMD - 3 PREPARED 编 制 ： CHECKED 审 核 ： APPROVED 批 准 ： D A T E 日 期 ： 2008 - 12 - 24 无锡市好达电子有限公司 Shoulder Electronics Limited 客户确认 C USTOMER RECEIVED: 审核 C HECKED 批准 APPROVED 日期 D ATE
SAW FILTER HDF 3 0 2 A SMD - 3 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 2 of 8 更改历史记录 History Record 更改日期 Date 规格书编号 Spec . No . 产品型号 Part No . 客户产品型号 Customer No . 更改内容描述 Modify Content 备注 Remark
SAW FILTER HDF 3 0 2 A SMD - 3 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 3 of 8 1. SCOPE This specification shall cover the characteristics of SAW filter With HDF30 2 A used for the page system. 2. ELECTRICAL SPECIFICATION DC V ol tage VDC 10V AC V oltage Vpp 10V50Hz/60Hz Operation temperature - 4 0 ℃ to +85 ℃ Storage temperature - 45 ℃ to +85 ℃ RF Power Dissipation 0dBm Electronic Characteristics 2 - 1.Typical frequency response 2 - 2.Electrical characteristics PART NUMBER HDF30 2 A UNIT NOMINAL CENTERREQUENCY(Fo) 3 0 2 .0 MHz INSERTION LOSS: 1. Fo - 100MHz TO – 39.5MHz 2. Fo±2.0 MHz 3. Fo+39.5 TO +100MHz
50.0 MIN
4.0 MIN
RIPPLE (WITH PASSBAND) 2.0 MAX dB INPUT AND OUTPUT IMPEDANCE 50/0 Ω /pF
SAW FILTER HDF 3 0 2 A SMD - 3 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 4 of 8 3. TEST CIRCUIT 4. DIM ENSION 5. ENVIRONMENTAL CHARACTERISTICS 5 - 1 High temperature exposure Subject the device to +85 ℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2 - 2 . 5 - 2 Low temperature exposure Subject the device to - 4 0 ℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2 - 2 . 5 - 3 Temperature cycling Subject the device to a lo w temperature of - 40 ℃ for 30 minutes. Following by a high temperature of +8 5 ℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the me a surement. It shall meet the specifications in 2 - 2 . 5 - 4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 ℃ ± 10 ℃ for 10 ± 1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in 2 - 2 . 5 - 5 Solderability 1. Ground 2. Input/output 3. Ground 4. Ground 5. Ground 6. Input/output 7. Ground 8. Ground
SAW FILTER HDF 3 0 2 A SMD - 3 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 5 of 8 Subject the device terminals into the solder bath at 245 ℃ ± 5 ℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in 2 - 2 . 5 - 6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2 - 2 . 5 - 7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2 - 2 . 6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause det e rioration &destruction of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause det e ri oration & destruction of the component. Pl ease avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of component. 7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1 (2) Reel: Figure 2 (3) The product shall be packed properly not to be damaged during transportation and storage.
7.2 Reeling Quantity
1000 pcs/reel 7’’ 3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
SAW FILTER HDF 3 0 2 A SMD - 3 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 6 of 8 (2) Labe l Device Name User Product Name Quantity Lot No. (3) Leader part and vacant position specifications. 8. TAPE SPECIFICATIONS 8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
8.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15 º (2) speed: 300mm/min.
SAW FILTER HDF 3 0 2 A SMD - 3 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 7 of 8 (3) force: 20~70g [Figure 1] Carrier Tape Dimensions [Unit:mm] W F E P0 P1 P2 D0 D1 t1 t2 A B 12.0 ± 0.3 5.5 ± 0.05 1.75 ± 0.1 4.0 ± 0.1 8.0 ± 0.1 2.0 ± 0.05 Ø 1.5 ± 0.1 Ø 1.0 ± 0.25 0.3 ± 0.05 2.10 ± 0.1 6.40 ± 0.1 5.20 ± 0.1 [Figure 2]
SAW FILTER HDF 3 0 2 A SMD - 3 www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 8 of 8 [Unit:mm] A B C D E W t r Ø 330 ± 1.0 Ø 100 ± 0.5 Ø 13 ± 0.5 Ø 21 ± 0.8 ± 0.5 ± 0.3 max. 1.0 max.