HDF152BF11 SHOULDER | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 5
Technical content
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 1 of 5 规格书编号 S PEC N O : 产 产 品 品 规 规 格 格 书 书 S S P P E E C C I I F F I I C C A A T T I I O O N N CUSTOMER 客 户 ： PRODUCT 产 品 ： SAW FILTER MODEL NO 型 号 ： HDF 15 2B F11 PREPARED 编 制 ： CHECKED 审 核 ： APPROVED 批 准 ： D A T E 日 期 ： 200 6 - 5 - 1 1 无锡市好达电子有限公司 Shoulder Electronics Limited 客户确认 C USTOMER RECEIVED: 审核 C HECKED 批准 APPROVED 日期 D ATE
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 2 of 5 更改历史记录 History Record 更改日期 Date 规格书编号 Spec . No . 产品型号 Part No . 客户产品型号 Customer No . 更改内容描述 Modify Content 备注 Remark
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 3 of 5 1. SCOPE This specification shall cover the characteristics of SAW filter With F152B used for the page system. 2. ELECTRICAL SPECIFICATION DC V oltag e VDC 10V AC V oltage Vpp 10V50Hz/60Hz Operation temperature - 4 0 ℃ to +85 ℃ Storage temperature - 45 ℃ to +85 ℃ RF Power Dissipation 0dBm 2 - 1.Typcal frequency response 2 - 2.Electrical characteristics Part number HDF152B Nominal cent er frequency (Fo) 152.5 MHz Insertion Loss 1. fo - 10.7~fo - 21.4MHz 2. fo ± 1.5 MHz 3. fo +21.4~ fo +100MHz 45min. 4.5max. 55min. dB Passband width( - 3dB) 6(type) MHz Ripple (with Fo ± 1.0MHz) 2.0max dB Input/Output Impedance(Nominal) 150//0 Ω /pF
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 4 of 5 3. TEST CIRCUIT 4. DIMENSION
www.shoulder.cn Tel:0755 - 82916880 Fax:0755 - 82916881 E - mail: info@shoulder.cn Page 5 of 5 5. ENVIRONMENTAL CHARACTERISTICS 5 - 1 High temperature exposure Subject the device to +85 ℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2 - 2 . 5 - 2 Low temperature exposure Subject the device to - 4 0 ℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2 - 2 . 5 - 3 Temperature cycling Subject the device to a low temperature of - 40 ℃ for 30 minutes. Following by a high temperature of +8 5 ℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the me a surement. It shall meet the specifications in 2 - 2 . 5 - 4 Resistance to sold er heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 ℃ ± 10 ℃ for 10 ± 1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in 2 - 2 . 5 - 5 Solderability Subject the device te rminals into the solder bath at 245 ℃ ± 5 ℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in 2 - 2 . 5 - 6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2 - 2 . 5 - 7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specificatio ns in 2 - 2 . 6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deteri oration & destruction of the compo nent. Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of component.