HDF1120A SHOULDER | Alldatasheet

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Http://www.shoulder.cn SHOULDER ELECTRONICS LIMITED Page: 1 SHOULDER ELECTRONICS LIMITED SAW Components Data Sheet PRODUCT 产 品: SAW FILTER MODEL NO 型 号: HDF1120A SMD-7 PREPARED 编 制: CHECKED 审 核: APPROVED 批 准: DATE 日 期: 2007-01-25

  1. SCOPE This specification shall cover the characteristics of SAW filter With F1120AS7 used digital television 2. ELECTRICAL SPECIFICATION Dc voltage VDC> 0V Operation temperature -40°C~+85°C Storage temperature -40°C~+85°C RF Power dissipation 0 dBm(source impedance 200Ω) Electronic Characteristics 2-1.Typical frequency response 2-2.Electrical characteristics Par number HDF1120AS7 Unit Norminal center frequency(Fo) 1120 MHz Insertion loss: 500.00~Fc-85.00MHz Fc-76.00~Fc-68.00MHz Fc-44.00MHz Fc-36.00MHz Fc±4.00MHz Fc+70.00~2000.00MHz 50.0 min. 46.0 min. 50.0 min 50.0 min 6.80 max. 50.0 min. dB Ripple (with Fo ±4.0MHz) 1.5 max. dB Input/Output Impedance 200 ohm Http://www.shoulder.cn SHOULDER ELECTRONICS LIMITED Page: 2
  1. TEST CIRCUIT 4. DIMENSION Http://www.shoulder.cn SHOULDER ELECTRONICS LIMITED Page: 3

Http://www.shoulder.cn SHOULDER ELECTRONICS LIMITED Page: 4 5. ENVIRONMENTAL CHARACTERISTICS 5-1 Temperature cycling Subject the device to a low temperature of -45 ℃for 30 minutes. Following by a high temperature of +25 ℃ for 5 Minutes and a higher temperature of +85 ℃ for 30 Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the measurement. It shall meet the specifications in table 1. 5-2 Resistance to solder heat Submerge the device terminals into the solder bath at 260 ℃ ±5℃ for 10 ±1 sec. Then release the device into the room conditions for 4 hours. It shall meet the specifications in table 1. 5-3 Solderability Submerge the device terminals into the solder bath at 245 ℃ ±5℃ for 5s, More than 95% area of the soldering pad must be covered with new solder. It shall meet the specifications in table 1. 5-4 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the filter shall fulfill the specifications in table 1. 5-5 Vibration Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. The filte r shall fulfill the specifications in table 1. 6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterior ation & destruction of the component. Please avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be soldered. Please avoid soldering another part of component.

  1. Packing

7.1 Dimensions

(1) Carrier Tape: Figure 1 (2) Reel: Figure 2 (3) The product shall be packed properly not to be da maged during transportation and storage.

7.2 Reeling Quantity

1000 pcs/reel 7’’ 3000 pcs/reel 13’’

7.3 Taping Structure

(1) The tape shall be wound around th e reel in the direction shown below. (2) Label Device Name User Product Name Quantity Lot No. (3) Leader part and vacant position specifications. Http://www.shoulder.cn SHOULDER ELECTRONICS LIMITED Page: 5

  1. TAPE SPECIFICATIONS 8.1 Tensile Strength of Carrier Tape: 4.4N/mm width

8.2 Top Cover Tape Adhesion (See the below figure)

(1) pull off angle: 0~15 º (2) speed: 300mm/min. (3) force: 20~70g [Figure 1] Carrier Tape Dimensions [Unit:mm] W F E P0 P1 P2 D0 D1 t1 t2 A B 12.00 ±0.30 5.50 ±0.10 1.75 ±0.10 4.00 ±0.10 4.00 ±0.10 2.00 ±0.10 Ø1.50 Ø1.5 ±0.25 0.31 ±0.05 1.30 ±0.10 3.4 MAX. 3.4 MAX Http://www.shoulder.cn SHOULDER ELECTRONICS LIMITED Page: 6

[Figure 2] [Unit:mm] A B C D E W t r Ø330 ±1.0 Ø100 ±0.5 Ø13 ±0.5 Ø21 ±0.8 ±0.5 ±0.3 max. 1.0 max. Http://www.shoulder.cn SHOULDER ELECTRONICS LIMITED Page: 7