HDC2080DMBR

HDC2080 TI1 | Alldatasheet

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Technical content

RH (%RH) Accuracy (r%RH) 0 10 20 30 40 50 60 70 80 90 100 Typical RH Sensor Temperature Sensor Registers Logic Calibration I2C ADC ADC SCL SDA DRDY/INT ADDR HDC2080 VDD MCU VDD GPIO I2C Master GND GND 1.80V Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. HDC2080 SNAS678 –MAY 2018 HDC2080LowPowerHumidityandTemperatureDigitalSensor

1 Features

1• Relative Humidity Range: 0% to 100%

• Humidity Accuracy: ±2% (Typical), ±3% (Maximum)
• Temperature Accuracy: ±0.2°C (Typical), ±0.4°C (Maximum)
• Sleep Mode Current: 50 nA (Typical), 100 nA (Maximum )
• Average Supply Current (1 measurement/second) – 300 nA: RH% Only (11 Bit) – 550 nA: RH% (11 Bit) + Temperature (11 Bit)
• Temperature Range: – Operating: –40°C to 85°C – Functional: –40°C to 125°C
• Supply Voltage Range: 1.62 V to 3.6 V
• Available Auto Measurement Mode
• I2C Interface Compatibility

2 Applications

• Smart Thermostats
• Smart Home Assistants
• Washer/Dryers
• HVAC Systems
• Inkjet Printers Typical Application

3 Description

The HDC2080 device is an integrated humidity and temperature sensor that provides high accuracy measurements with very low power consumption in a small DFN package. The capacitive-based sensor includes new integrated digital features and a heating element to dissipate condensation and moisture. The HDC2080 digital features include programmable interrupt thresholds to provide alerts and system wake-ups without requiring a microcontroller to be continuously monitoring the system. Combined with programmable sampling intervals, a low power consumption, and a support for a 1.8-V supply voltage, the HDC2080 is designed for battery- operated systems. The HDC2080 provides high accuracy measurement capability for a wide range of environmental monitoring and Internet of Things (IoT) applications such as smart thermostats and smart home assistants. For designs where printed-circuit board (PCB) area is critical, a smaller CSP package option is available thru the HDC2010 with complete software compatibility with the HDC2080. For applications with strict power-budget restrictions, Auto Measurement Mode enables the HDC2080 to automatically initiate temperature and humidity measurements. This feature allows users to configure a microcontroller into deep sleep mode because the HDC2080 is no longer dependent upon the microcontroller to initiate a measurement. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) HDC2080 WSON (6) 3.00 mm × 3.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. RH Accuracy (TA = 30°C)

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12.1 Receiving Notification of Documentation Updates 32

13 Mechanical, Packaging, and Orderable

4 Revision History

May 2018 * Initial release.

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5 Description (continued)

Programable temperature and humidity thresholds in the HDC2080 allow the device to send a hardware interrupt to wake up the microcontroller when necessary. In addition, the power consumption of the HDC2080 is significantly reduced, which helps to minimize self-heating and improve measurement accuracy. The HDC2080 is factory-calibrated to 0.2°C temperature accuracy and 2% relative humidity accuracy.

6 Pin Configuration and Functions

NAME NO. SDA 1 I/O Serial data line for I2C, open-drain; requires a pullup resistor to VDD GND 2 G Ground ADDR 3 I Address select pin – leave unconnected or hardwired to VDD or GND. Unconnected slave address: 1000000 GND: slave address: 1000000 VDD: slave address: 1000001 DRDY/INT 4 O Data ready/Interrupt VDD 5 P Positive Supply Voltage SCL 6 I Serial clock line for I2C, open-drain; requires a pullup resistor to VDD

SNAS678 –MAY 2018 www.ti.com Product Folder Links: HDC2080 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings(1)

VDD Input Voltage -0.3 3.9 V GND Input Voltage -0.3 3.9 V ADDR Input Voltage -0.3 3.9 V SCL Input Voltage -0.3 3.9 V SDA Input Voltage -0.3 3.9 V Tstg Storage temperature -65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500

7.3 Recommended Operating Conditions

over operating range (unless otherwise noted) MIN NOM MAX UNIT VDD Voltage Supply 1.62 3.6 V TTEMP Temperature Sensor - Operating free-air temperature -40 125 °C TRH Relative Humidity Sensor - Operating free-air temperature -20 70 °C THEATER Integrated Heater - Operating free-air temperature -40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.4 Thermal Information

THERMAL METRIC(1) HDC2080 UNITPWSON (DMB)

6 PINS

RθJA Junction-to-ambient thermal resistance 56.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 73.6 °C/W RθJB Junction-to-board thermal resistance 24.0 °C/W ΨJT Junction-to-top characterization parameter 3.8 °C/W ΨJB Junction-to-board characterization parameter 24.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 13.0 °C/W (1) I2C read/write communication and pull up resistors current through SCL, SDA not included.

7.5 Electrical Characteristics

at TA = 30°C, VDD = 1.8 V, 20% ≤ RH ≤ 80% (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ELECTRICAL SPECIFICATION VDD Supply Voltage Operating Range 1.62 3.6 V IDD Supply current RH measurement(1) 650 890 µA

www.ti.com SNAS678 –MAY 2018 Product Folder Links: HDC2080 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Electrical Characteristics (continued) at TA = 30°C, VDD = 1.8 V, 20% ≤ RH ≤ 80% (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT (2) Average current consumption while conversion is in progress. (3) Heater operating range: – 40°C to 85°C. (4) Excludes hysteresis and long-term drift. (5) Excludes the impact of dust, gas phase solvents and other contaminants such as vapors from packaging materials, adhesives, or tapes, etc. (6) Limits apply over the humidity operating range 20 to 80% RH (non-condensing) from 0 to 60°C. (7) This parameter is specified by design and/or characterization and is not tested in production. (8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point. (9) Actual response times will vary dependent on system thermal mass and air-flow. (10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity. (11) Recommended humidity operating range is 20 to 80% RH (non-condensing) over 0 to 60°C. Prolonged operation beyond these ranges may result in a shift of sensor reading, with slow recovery time. (12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, outgassing tapes, adhesives, packaging materials, etc. IDD Supply current Temperature measurement(1) 550 730 µA IDD Supply current Sleep Mode 0.05 0.1 µA IDD Supply current Average at 1 measurement/second, RH or temperature only(1) (2) 0.3 µA IDD Supply current Average at 1 measurement/second, RH (11 bit)+temperature (11 bit)(1) (2) 0.55 µA IDD Supply current Average at 1 measurement every 2 seconds, RH (11 bit) + temperature (11 bit)(1) (2) 0.3 µA IDD Supply current Average @ 1 measurement every 10 seconds, RH (11 bit)+temperature (11 bit) 0.105 µA IDD Supply current Startup (average on startup time) 80 µA IDDHEAT Integrated Heater (when enabled)(3) VDD = 3.3 V and TA = -40°C to 85°C 90 mA RELATIVE HUMIDITY SENSOR RHACC Accuracy(4) (5) (6) ±2 ±3 %RH RHREP Repeatability(7) 14 bit resolution ±0.1 %RH RHHYS Hysteresis(8) ±1 %RH RHRT Response Time(9) t63% step(10) 8 sec RHCT Conversion-time(7) 9 bit accuracy 275 µs RHCT Conversion-time(7) 11 bit accuracy 400 µs RHCT Conversion-time(7) 14 bit accurcay 660 µs RHOR Operating range Non-condensing(11) 0 100 %RH RHLTD Long-term Drift(12) ±0.25 %RH/yr TEMPERATURE SENSOR TEMPOR Operating range -40 125 °C TEMPAC C Accuracy(7) 5°C < TA < 60°C ±0.2 ±0.4 °C TEMPRE P Repeatability(7) 14 bit resolution ±0.1 °C TEMPCT Conversion-time(7) 9 bit accuracy 225 µs TEMPCT Conversion-time(7) 11 bit accuracy 350 µs TEMPCT Conversion-time(7) 14 bit accurcay 610 µs

7.6 I2C Interface Electrical Characteristics

At TA = 30°C, VDD = 3.3 V (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIH Input High Voltage 0.7 x VDD V VIL Input Low Voltage 0.3 x VDD V

At TA = 30°C, VDD = 3.3 V (unless otherwise noted). (1) This parameter is specified by design and/or characterization and it is not tested in production. (1) This parameter is specified by design and/or characterization and it is not tested in production.

7.7 I2C Interface Timing Requirements

7.8 Timing Diagram

Figure 1. I2C Timing

7.9 Typical Characteristics

Unless otherwise noted. TA = 30°C, VDD = 1.80 V. Figure 2. RH Accuracy vs. RH Set Point Figure 3. Temperature Accuracy vs. Temperature Set Point

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8 Detailed Description

8.1 Overview

The HDC2080 is a highly integrated digital humidity and temperature sensor that incorporates both humidity- sensing and temperature-sensing elements, an analog-to-digital converter, calibration memory, and an I2C interface that are all contained in a 3.00-mm × 3.00-mm 6-pin WSON package. The HDC2080 provides excellent measurement accuracy with very low power consumption and features programmable resolution for both humidity and temperature:

• Temperature resolution [9, 11, 14]
• Humidity resolution [9, 11, 14] The conversion time during measurements is dependent upon the configured resolution for humidity and temperature, which can be configured for optimal power consumption. The HDC2080 device incorporates a state-of-the-art polymer dielectric to provide capacitive-sensing measurements. As with most relative humidity sensors that include this type of technology, the user must meet certain application requirements to ensure optimal device performance for the sensing element. The user must:
• Follow the correct storage and handling procedures during board assembly. See Humidity Sensor: Storage and Handling Guidelines. (SNIA025) for these guidelines.
• Protect the sensor from contaminants during board assembly and operation.
• Reduce prolonged exposure to both high temperature and humidity extremes that may impact sensor accuracy.
• Follow the correct layout guidelines for best performance. See Optimizing Placement and Routing for Humidity Sensors (SNAA297) for these guidelines.

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Sleep Mode Power Consumption

One key feature of the HDC2080 is the low power consumption of the device, which makes the HDC2080 suitable in battery-powered or energy-harvesting applications. In these applications, the HDC2080 spends most of the time in sleep mode that has a typical current consumption of 50 nA. This minimizes the average power consumption and self-heating. 8.3.2 Measurement Modes: Trigger on Demand vs. Auto Measurement Two types of measurement modes are available on the HDC2080: Trigger on Demand and Auto Mode. Trigger on Demand is when each measurement reading are initiated through an I2C command on an as-needed basis. After the measurement is converted, the device remains in sleep mode until another I2C command is received.

www.ti.com SNAS678 –MAY 2018 Product Folder Links: HDC2080 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Feature Description (continued) Auto Measurement Mode is when the HDC2080 is programmed to perform measurement readings on a periodic basis, thus eliminating the need to initiate a measurement request through an I2C command and improves power consumption. The user can adjust the Soft Reset and Interrupt Configuration register to select one of 7 different sampling rates (the range spans from 1 sample every 2 minutes to 5 samples/second). In Auto Measurement Mode, the HDC2080 wakes up from sleep to measurement mode based on the selected sampling rate.

8.3.3 Heater

The HDC2080 includes an integrated heating element that can be switched on briefly to prevent or remove any condensation that may build up in high humidity environments. Additionally, the heater can be used to verify functionally of the integrated temperature sensor. The operating range of the heater should be limited to –40°C to 85°C. For 3.3-V operation, the heater will have a typical current draw of 90 mA, and 55 mA at 1.8-V operation.

8.3.4 Interrupt Description

When multiple bits are enabled, the DRDY/INT pin can only reflect the status of one interrupt bit at a time. The DRDY/INT pin DOES NOT function as the logical ‘OR’ of interrupt bits that have been enabled. The highest priority is given to TH_ENABLE bit, followed by TL_ENABLE, HH_ENABLE, and HL_ENABLE bits in descending order. Therefore, programming recommendations are provided as below:

• The DRDY/INT will track the HL_ENABLE if enabled and all other ENABLE bits are disabled
• The DRDY/INT will track the HH_ENABLE if enabled and the TH_ENABLE and TL_ENABLE are disabled
• The DRDY/INT will track the TL_ENABLE if enabled and the TH_ENABLE is disabled
• The DRDY/INT will track the TH_ENABLE if enabled and is independent of other ENABLE bit settings

8.3.4.1 DRDY

Figure 8. Data Ready Interrupt - Active High (INT_POL = 1) Figure 9. Data Ready Interrupt - Active Low (INT_POL = 0)

8.3.5 INTERRUPT on Threshold

8.3.5.1 Temperature High

The INT_MODE bit sets the threshold to either comparator mode or a level sensitive alarm. Figure 10. INTERRUPT on Threshold - Temperature High

8.3.5.2 Temperature Low

based on the INT_POL and INT_MODE bits. The INT_MODE bit sets the threshold to either comparator mode or a level sensitive alarm. Figure 11. INTERRUPT on Threshold - Temperature Low

8.3.5.3 Humidity High

The INT_MODE bit sets the threshold to either comparator mode or a level sensitive alarm. Figure 12. INTERRUPT on Threshold - Humidity High

8.3.5.4 Humidity Low

The INT_MODE bit sets the threshold to either comparator mode or a level sensitive alarm. Figure 13. INTERRUPT on Threshold - Humidity Low

8.4 Device Functional Modes

The HDC2080 has two modes of operation: Sleep Mode and Measurement Mode. Configuration registers. After completing the conversion, the HDC2080 returns to Sleep Mode.

8.5 Programming

8.5.1 I2C Serial Bus Address Configuration

To communicate with the HDC2080, the master must first address slave devices through a slave address byte. any activity on the interface occurs and remain constant while the device is powered up. Table 1. HDC2080 I2C Slave Address

8.5.2 I2C Interface

measurement is performed. All data bytes are transmitted MSB first.

8.5.3 Serial Bus Address

To communicate with the HDC2080, the master must first address slave devices through a slave address byte.

8.5.4 Read and Write Operations

operation to the HDC2080 requires a value for the register address (refer to Table 2).

read or write operation with incorrect I2C address returns a NACK after the I2C address. Table 2. Write Single Byte Table 3. Write Multi Byte Table 4. Read Single Byte Table 5. Read Multi Byte

8.6 Register Maps

measurement results, and status information. Table 6. Register Map

8.6.1 Address 0x00 Temperature LSB

Table 7. Address 0x00 Temperature LSB Register Table 8. Address 0x00 Temperature LSB Field Descriptions

8.6.2 Address 0x01 Temperature MSB

Configuration register. The temperature must be read LSB first. Table 9. Address 0x01 Temperature MSB Register Table 10. Address 0x01 Temperature MSB Field Descriptions

8.6.3 Address 0x02 Humidity LSB

Table 11. Address 0x02 Humidity LSB Register Table 12. Address 0x02 Humidity LSB Field Descriptions

8.6.4 Address 0x03 Humidity MSB

Configuration register. The humidity measurement must be read LSB first. Table 13. Address 0x03 Humidity MSB Register Table 14. Address 0x03 Temperature MSB Field Descriptions

8.6.5 Address 0x04 Interrupt DRDY

Table 15. Address 0x04 Interrupt DRDY Register Table 16. Address 0x04 Interrupt DRDY Field Descriptions

7 DRDY_STATUS R/W 0 DataReady bit status

6 TH_STATUS R/W 0 Temperature threshold HIGH Interrupt status

5 TL_STATUS R/W 0 Temperature threshold LOW Interrupt status

4 HH_STATUS R/W 0 Humidity threshold HIGH Interrupt status

3 HL_STATUS R/W 0 Humidity threshold LOW Interrupt status

2 RES 0 Reserved

1 RES 0 Reserved

0 RES 0 Reserved

HUMIDITY_HIGH and HUMIDITY_LOW are read. 0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read. 0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read. 0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read. 0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read. DRDY/INT pin behaves like the STATUS bits based on the 0x0E Configuration register value.

8.6.6 Address 0x05 Temperature MAX

after the power up. Value is reset at power up and/or with soft reset procedure. Table 17. Address 0x05 Temperature MAX Register Table 18. Address 0x05 Temperature Max Field Descriptions

8.6.7 Address 0x06 Humidity MAX

power up. Value is reset at power up and/or with soft reset procedure. Table 19. Address 0x06 Humidity MAX Register Table 20. Address 0x06 Humidity MAX Field Descriptions

8.6.8 Address 0x07 Interrupt Configuration

Table 21. Address 0x07 Interrupt Configuration Register Table 22. Address 0x07 Interrupt Configuration Field Descriptions

7 DRDY_ENABLE R/W 0 DataReady Interrupt enable

6 TH_ENABLE R/W 0 Temperature threshold HIGH Interrupt enable

5 TL_ENABLE R/W 0 Temperature threshold LOW Interrupt enable

4 HH_ENABLE R/W 0 Humidity threshold HIGH Interrupt enable

3 HL_ENABLE R/W 0 Humidity threshold LOW Interrupt enable

8.6.9 Address 0x08 Temperature Offset Adjustment

Table 23. Address 0x08 Temperature Offset Adjustment Register Table 24. Address 0x08 Temperature Offset Adjustment Field Descriptions Figure 14. Temperature Output Calculation

1. Programming TEMP_OFFSET_ADJUST to 00000001 adjusts the reported temperature by +0.16°C
2. Programming TEMP_OFFSET_ADJUST to 00000111 adjusts the reported temperature by +1.12°C
3. Programming TEMP_OFFSET_ADJUST to 00001101 adjusts the reported temperature by +2.08°C
4. Programming TEMP_OFFSET_ADJUST to 11111111 adjusts the reported temperature by -0.16°C
5. Programming TEMP_OFFSET_ADJUST to 11111001 adjusts the reported temperature by -1.12°C
6. Programming TEMP_OFFSET_ADJUST to 11110011 adjusts the reported temperature by -2.08°C

8.6.10 Address 0x09 Humidity Offset Adjustment

Table 25. Address 0x09 Humidity Offset Adjustment Register Table 26. Address 0x09 Humidity Offset Adjustment Field Descriptions Figure 15. Humidity Output Calculation The resulting humidity offset is a summation of the register bits that have been enabled (i.e. programmed to 1).

1. Programming HUM_OFFSET_ADJUST to 00000001 adjusts the reported humidity by +0.20%RH
2. Programming HUM_OFFSET_ADJUST to 00000101 adjusts the reported humidity by +1.00%RH
3. Programming HUM_OFFSET_ADJUST to 00001010 adjusts the reported humidity by +2.00%RH
4. Programming HUM_OFFSET_ADJUST to 11111111 adjusts the reported humidity by -0.10%RH
5. Programming HUM_OFFSET_ADJUST to 11111011 adjusts the reported humidity by -0.90%RH
6. Programming HUM_OFFSET_ADJUST to 11110101 adjusts the reported humidity by -2.10%RH

8.6.11 Address 0x0A Temperature Threshold LOW

Table 27. Address 0x0A Temperature Threshold LOW Register Table 28. Address 0x0A Temperature Threshold LOW Field Descriptions

8.6.12 Address 0x0B Temperature Threshold HIGH

Table 29. Address 0x0B Temperature Threshold HIGH Register Table 30. Address 0x0B Temperature Threshold HIGH Field Descriptions

8.6.13 Address 0x0C Humidity Threshold LOW

Table 31. Address 0x0C Humidity Threshold LOW Register Table 32. Address 0x0C Humidity Threshold LOW Field Descriptions

8.6.14 Address 0x0D Humidity Threshold HIGH

Table 33. Address 0x0D Humidity Threshold HIGH Register Table 34. Address 0x0D Humidity Threshold HIGH Field Descriptions

8.6.15 Address 0x0E Reset and DRDY/INT Configuration Register

Table 35. Address 0x0E Configuration Register Table 36. Address 0x0E Configuration Field Descriptions

7 SOFT_RES R/W 0 0 = Normal Operation mode, this bit is self-clear

3 HEAT_EN R/W 0 0 = Heater off

2 DRDY/INT_EN R/W 0 DRDY/INT_EN pin configuration

1 INT_POL R/W 0 Interrupt polarity

0 INT_MODE R/W 0 Interrupt mode

8.6.16 Address 0x0F Measurement Configuration

Table 37. Address 0x0F Measurement Configuration Register Table 38. Address 0x0F Measurement Configuration Field Descriptions

3 RES R/W 0 Reserved

0 MEAS_TRIG R/W 0 Measurement trigger

8.6.17 Manufacturer ID Low

Table 39. Manufacturer ID Low Register Table 40. Address 0xFC Manufacturer ID Low Field Descriptions

8.6.18 Manufacturer ID High

Table 41. Manufacturer ID High Register Table 42. Address 0xFD Manufacturer ID High Field Descriptions

8.6.19 Device ID Low

Table 43. Device ID Low Register Table 44. Address 0xFE Device ID Low Field Descriptions

8.6.20 Device ID High

These registers contain a factory-programmable identification value that identifies this device as a HDC2080. Table 45. Device ID High Register Table 46. Address 0xFF Device ID High Field Descriptions

9 Application and Implementation

validate and test their design implementation to confirm system functionality.

9.1 Application Information

system. The collected data are then shown on a display that can be easily controlled by the microcontroller. environment at the customer-defined preferred conditions.

9.2 Typical Application

Figure 16. Typical Application Schematic HVAC

9.2.1 Design Requirements

9.2.2 Detailed Design Procedure

When a circuit board layout is created from the schematic shown in Figure 16, a small circuit board is possible. which can improve measurement response time and accuracy.

9.2.3 Application Curve

Figure 17. RH% Readings of Chamber and HDC2080 vs. Time

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10 Power Supply Recommendations

The HDC2080 requires a voltage supply within 1.62 V and 3.60 V. TI recommends a multilayer ceramic bypass X7R capacitor of 0.1 µF between the VDD and GND pins.

11 Layout

11.1 Layout Guidelines

The HDC2080’s relative humidity-sensing element is located on the top side of the package. TI recommends that the user eliminate the copper layers below the device (GND, VDD) and create slots in the PCB around the device to enhance the thermal isolation of the HDC2080. To ensure the temperature sensor performance, TI highligh recommends that the user follow the Land Pattern, Solder Mask, and Solder Paste examples depicted in the Mechanical, Packaging, and Orderable Information.

11.1.1 Guidelines for HDC2080 Storage and PCB Assembly

11.1.1.1 Storage and Handling

As with all humidity sensors, the HDC2080 must follow special guidelines regarding handling and storage that are not common with standard semiconductor devices. Long exposure to UV and visible light, or exposure to chemical vapors for prolonged periods, should be avoided as it may affect RH% accuracy. Additionally, the device should be protected from out-gassed solvent vapors produced during manufacturing, transport, operation, and package materials (that is, adhesive tapes, stickers, bubble foils). For further detailed information, see Humidity Sensor: Storage and Handling Guidelines (SNIA025)

11.1.1.2 Soldering Reflow

For PCB assembly, standard reflow soldering ovens may be used. The HDC2080 uses the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures at 260°C. When soldering the HDC2080, it is mandatory to use no-clean solder paste, and the paste must not be exposed to water or solvent rinses during assembly because these contaminants may affect sensor accuracy. After reflow, it is expected that the sensor will generally output a shift in relative humidity, which will reduce over time as the sensor is exposed to typical indoor ambient conditions. These conditions include 30-40% RH at room temperature during a duration of several days. Following this re-hydration procedure allows the polymer to correctly settle after reflow and return to the calibrated RH accuracy.

11.1.1.3 Rework

TI recommends to limit the HDC2080 to a single IR reflow with no rework, but a second reflow may be possible if the following guidelines are met:

• The exposed polymer (humidity sensor) is kept clean and undamaged.
• The no-clean solder paste is used and the process is not exposed to any liquids, such as water or solvents.
• The Peak soldering temperature does not exceed 260°C.

11.1.1.4 High Temperature and Humidity Exposure

Long exposure outside the recommended operating conditions may temporarily offset the RH output. The recommended humidity operating range is 20 to 80% RH (non-condensing) over 0 to 60°C. Prolonged operation beyond these ranges may shift the sensor reading with a slow recovery time.

11.1.1.5 Bake/Re-Hydration Procedure

Prolonged exposure to extreme conditions or harsh contaminants may impact sensor performance. In the case that permanent offset is observed from contaminants, the following procedure is suggested, which may recover or reduce the error observed in sensor performance: 1. Baking: 100°C, at less than 5%RH, for 5 to 10 hours 2. Re-hydration: Between 20°C to 30°C, 60%RH to 75%RH, for 6 to 12 hours

11.2 Layout Example

Figure 18. HDC2080 PCB Layout Example

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12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 30-May-2018 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples HDC2080DMBR ACTIVE WSON DMB 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 3C HDC2080DMBT ACTIVE WSON DMB 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 3C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

www.ti.com 30-May-2018 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 27-May-2018 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) HDC2080DMBR WSON DMB 6 3000 335.0 335.0 32.0 HDC2080DMBT WSON DMB 6 250 336.6 336.6 41.3 PACKAGE MATERIALS INFORMATION www.ti.com 27-May-2018 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 6X 0.45 0.35 2.4 0.1 6X 0.5 0.3 1.5 0.1 4X 1

0.8 MAX

0.05 0.00 (1.2) (1.3) B 3.1 2.9 A 3.1 2.9 (0.2) TYP (0.45) (0.22) WSON - 0.8 mm max heightDMB0006A PLASTIC SMALL OUTLINE - NO LEAD 4221225/B 08/2016 PIN 1 INDEX AREA PICK AREA NOTE 4 SEATING PLANE0.08 C 3 4 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 4. Pick and place nozzle 0.9 mm or smaller recommended. SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MIN

0.07 MAX

(1.5) 4X (1) (2.8) 6X (0.4) 6X (0.6) (2.4) (R0.05) TYP ( 0.2) TYP (0.95) TYP (1) TYP WSON - 0.8 mm max heightDMB0006A PLASTIC SMALL OUTLINE - NO LEAD 4221225/B 08/2016 SYMM SYMM LAND PATTERN EXAMPLE SCALE:20X NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METALSOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED)

www.ti.com EXAMPLE STENCIL DESIGN 6X (0.4) 6X (0.6) 4X (1) 2X (1.06) 2X (1.38) (0.63) (2.8) (R0.05) TYP WSON - 0.8 mm max heightDMB0006A PLASTIC SMALL OUTLINE - NO LEAD 4221225/B 08/2016 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 7: 81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X SYMM SYMM METAL TYP

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