HDBL101G_16 TMT | Alldatasheet

Document overview

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Technical content

  • Glass passivated junction - Ideal for printed circuit board - Reliable low cost construction utilizing molded plastic technique - High surge current capability - UL Recognized File # E-326854 - Halogen-free according to IEC 61249-2-21 Molding compound, UL flammability classification rating 94V-0 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test V RRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V IF(AV) A I2t A2s trr ns TJ °C TSTG °C Document Number: DS_D1311010 Version: F15 TJ=25°C TJ=125°C Rating for fusing (t<8.3ms) 10.3 Storage temperature range - 55 to + 150 Note 1: Pulse Test with PW=300μs,1% Duty Cycle Notes 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Typical thermal resistance RθJL RθJA 40 °C/W Operating junction temperature range - 55 to + 150 IR 500 μA Maximum reverse recovery time (Note 2) 50 75 Maximum reverse current @ rated VR Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 50 A Maximum instantaneous forward voltage (Note 1) IF= 1 A VF 1.0 1.3 1.7 V HDBL 107G UNIT Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 1 Weight: 0.36 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL HDBL 101G HDBL 102G HDBL 103G HDBL 104G HDBL 105G HDBL 106G DBL MECHANICAL DATA Case: Molded plastic body Polarity: Polarity as marked on the body Taiwan Semiconductor 1A, 50V - 1000V Glass Passivated High Efficient Bridge Rectifiers

FEATURES

  • Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC

PART NO. Note 1: "x" defines voltage from 50V (HDBL101G) to 1000V (HDBL107G) *: Optional available PART NO. (TA=25°C unless otherwise noted) Document Number: DS_D1311010 Version: F15 HC 1 G AEC-Q101 qualified Green compoundHDBL107GHDBL107GHC1G PACKING C1 G DBL 50 / TUBE PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX

DESCRIPTION

(Note 1) H PACKING CODE PACKING CODE SUFFIX (*) PACKAGE HDBL101G - HDBL107G Taiwan Semiconductor PACKING CODE

ORDERING INFORMATION

RATINGS AND CHARACTERISTICS CURVES 0.5 1.5 0 20 40 60 80 100 120 140 160 AVERAGE FORWARD CURRENT . (A) AMBIENT TEMPERATURE (°C) FIG.1 FORWARD CURRENT DERATING CURVE RESISTIVE OR INDUCTION LOAD 1 10 100 PEAK FORWARD SURGE CURRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms Single Half Sine Wave 0.1 100 1000 0 20 40 60 80 100 120 140 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 4 TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C 0.1 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 2 TYPICAL FORWARD CHARACTERISTICS HDBL101G - HDBL104G HDBL105G HDBL106G - HDBL107G

A 6.20 6.50 0.244 0.256 B 7.24 8.00 0.285 0.315 C 8.12 8.51 0.320 0.335 D 2.40 2.60 0.094 0.102 E 0.89 1.14 0.035 0.045 F 0.46 0.58 0.018 0.023 G 5.00 5.20 0.197 0.205 H 1.39 1.90 0.055 0.075 I 1.27 2.03 0.050 0.080 J 3.81 4.69 0.150 0.185 K 0.22 0.33 0.009 0.013 L 7.600 8.90 0.299 0.350 P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D1311010 Version: F15 MARKING DIAGRAM HDBL101G - HDBL107G Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) DBL 0.1 1 10 100 1000 CAPACITANCE (pF) A REVERSE VOLTAGE (V) FIG. 5 TYPICAL JUNCTION CAPACITANCE HDBL101G - HDBL105G HDBL106G - HDBL107G f=1.0MHz Vsig=50mVp-p

assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1311010 Version: F15 HDBL101G - HDBL107G Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,