HDBF19900B25 SHOULDER | Alldatasheet
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Technical content
规格书编号 SPEC NO : www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 1 of 6 产产品品规规格格书书 SSPPEECCIIFFIICCAATTIIOONN CUSTOMER 客 户： PRODUCT 产 品： S A W F I L T E R MODEL NO 型 号： HDBF19900B25 PREPARED 编 制： C H E C K E D 审 核： APPROVED 批 准： D A T E 日 期： 客户确认 CUSTOMER RECEIVED: 审核 CHECKED 批准 APPROVED 日期 DATE 无锡市好达电子有限公司 Shoulder Electronics Limited
S A W F I L T E R HDBF19900B25 www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 2 of 6 更改历史记录 History Record 更改日期 Date 规格书编号 Spec No 产品型号 Part No 客户产品型号 Customer No 更改内容描述 Modify Content 备注 Remark
S A W F I L T E R HDBF19900B25 www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 3 of 6 1. SCOPE This specification shall cover th e characteristics of SAW filter with HDBF19900B25 used for the page system. 2. ELECTRICAL SPECIFICATION Maximum incident power in passband +18dBm Max.DC voltage between any 2 terminals 30VDC Storage temperature range -40℃ to +85℃ Operation temperature range -10℃ to +85℃ Suitable for lead-free soldering-Max.soldering profile 260℃ for 30s Electronic Characteristics Parameter Minimum Typical Maximum Unit Center Frequency - 199.0 - MHz Insertion Loss - 5.5 7.0 dB 1dB Bandwidth ±100 ±140 - KHz Amplitude Ripple over f0±100KHz - - 1.0 dB f0-800 to f0-600KHz and f0+600 to f0+800KHz 35 - - dB 119MHz to f0-800KHz 45 - - dB f0+800KHz to278MHz 40 - - dB Group Delay Variation overf0±100KHz - 300 500 nsec Frequency Temperature coefficient 0.32 ppm/°C
S A W F I L T E R HDBF19900B25 www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 4 of 6 3. TEST CIRCUIT
S A W F I L T E R HDBF19900B25 www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 5 of 6 4.DIMENSION mm Dimension min typ max A 18.8 19.0 19.2 B 6.3 6.5 6.7 C 1.58 1.76 1.94 D 2.15 2.3 2.45 E 1.02 H 0.72 0.76 0.80 P 1.905 Pin Configuration
10 Input
5 Output
S A W F I L T E R HDBF19900B25 www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 6 of 6 5. ENVIRONMENTAL CHARACTERISTICS 5-1 Temperature cycling Subject the device to a low temperature of -40 ℃for 30 minutes. Following by a high temperature of +25 ℃ for 5 Minutes and a hi gher temperature of +85 ℃ for 30 Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the measurement. It shall meet the specifications in table 1. 5-2 Resistance to solder heat Submerge the device terminals into the solder bath at 260 ℃ ±5℃ for 10 ±1 sec. Then release the device into the room conditions for 4 hours. It shall meet the specifications in table 1. 5-3 Solderability Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the soldering pad must be cove red with new solder. It shall meet the specifications in table 1. 5-4 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the filter shall fulfill the specifications in table 1. 5-5 Vibration Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in table 1. 6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterior ation & destruction of the component. Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be solder ed. Please avoid soldering another part of component.