HDBF14000A61 SHOULDER | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

规格书编号 SPEC NO : www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 1 of 6 产产品品规规格格书书 SSPPEECCIIFFIICCAATTIIOONN CUSTOMER 客 户： PRODUCT 产 品： SAW FILTER MODEL NO 型 号： HDBF14000A61 PREPARED 编 制： C H E C K E D 审 核： Houshihong APPROVED 批 准： CHARLES D A T E 日 期： 2007-01-25 客户确认 CUSTOMER RECEIVED: 审核 CHECKED 批准 APPROVED 日期 DATE 无锡市好达电子有限公司 Shoulder Electronics Limited

www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 2 of 6 更改历史记录 History Record 更改日期 Date 规格书编号 Spec No 产品型号 Part No 客户产品型号 Customer No 更改内容描述 Modify Content 备注 Remark

www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 3 of 6 1. SCOPE This specification shall cover the characteristics of SAW filter BF14000A61 2. ELECTRICAL SPECIFICATION D C V o l t a g e V D C 1 0 V AC V oltage Vpp 10V50Hz/60Hz Operation temperature -10 ℃ to +60℃ Storage temperature -40 ℃ to +85℃ R F P o w e r D i s s i p a t i o n 0 d B m Electronic Characteristics Fo = 140.0 MHz Terminating source impedance: 50 ohm and matching network Terminating load impedance: 50 ohm and matching network Minimum Typical Maximum Center Frequency MHz 139.96 140.0 140.04 Insertion Loss dB - 10.2 12 1dB Bandwidth 3dB Bandwidth 40dB Bandwidth MHz MHz MHz 0.5 0.55 0.86 1.98 2.10 Group Delay Variation (f0 ±250KHz) nsec - 80 200 Passband variation dB - 0.3 0.6 Ultimate Rejection f0 ±2.5MHz f0 ±20MHz dB dB Absolute Delay usec - 1.88 -

www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 4 of 6 3. DIMENSION 4.TEST CIRCUIT

www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 5 of 6 5. ENVIRONMENTAL CHARACTERISTICS 5-1 High temperature exposure Subject the device to +85 ℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1. 5-2 Low temperature exposure Subject the device to -20 ℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1. 5-3 Temperature cycling Subject the device to a low temperature of -40 ℃for 30 minutes. Following by a high temperature of +80 ℃ for 30 Minutes. Then release th e device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in table 1. 5-4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 ℃ ±10℃ for 10±1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in table 1. 5-5 Solderability Subject the device terminals into the solder bath at 245 ℃ ±5℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in table 1. 5-6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in table 1. 5-7 Vibration Subject the device to the vibra tion for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1. 5-8 Lead fatigue 5-8-1 Pulling test Weight along with the direction of lead w ithout an shock 1kg. The device shall satisfy all the initial Characteristics. 5-8-2 Bending test Lead shall be subject to withstand against 90 ℃ bending with 450g weight in the direction of thickness. This operation shall be done toward both direction. The device shall show no evidence of damage and shall satisfy all the initial electrical characteristics.

www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 6 of 6 Typical frequency response 6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterior ation & destruc tion of the component. Please avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be solder ed. Please avoid soldering another part of component.