HDG1105W STANLEY | Alldatasheet
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Product GuideProduct GuideProduct Guide I Electro-Optical Characteristics Part No. Water Clear TYP . IF Wavelength Spectral Line Half Width Forward Voltage VF TYP. MAX. I F Reverse CurrentIR MAX. V R Viewing Angle (2 θ 1/2) Green Bluish-Green Blue 140 140 522 502 467 525 505 470 3.3 3.3 3.3 3.8 3.8 3.8 100 100 100 InGaN/SiC InGaN/SiC InGaN/SiC HDG1105W HDC1105W HDB1105W Units mcd mA nm mA mA µA V Deg. V MIN. ∆λλ TYP. Peak λλp TYP. Dominant λλd TYP. IF Luminous Intensity IV Lens Color Emitted Color 40° I Outline Dimensions I Features High brightness (InGaN/SiC) die material Available in green (525nm), bluish-green (505nm) and blue (470nm) colors Reflow and dip soldering compatible Available for both standard and reverse mounting 1000V minimum ESD protection I Applications Automotive indicator display Various other backlight uses Anode Polarity Mark PCB CathodeCathode Mark 0.5 3.2 0.6 0.6 1.6 0.5 1.55 R0.8 0.3 1.6 (1.6) (2) (4.6) 2.3+0.05 1.6 HOLE 1.5 2.1 + 0.05 1.5 HD_1105W Series, Dome Lens Type InGaN/SiC SMT LEDHD_1105W Series, Dome Lens Type InGaN/SiC SMT LED Material Unit: mm Tolerance + 0.1 (Ta=25°C) I Recommended Solder Pad on a Surface Mount I Recommended Solder Pad on a reverse mount
I Absolute Maximum Ratings Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Symbol Pd IF IFM VR Topr Tstg ∆IF Blue HDB mW mA mA V mA/°C * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. 0.28 (DC) 0.69 (Pulse) UnitsItem -40 to +85 -40 to +100 I Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) Reflow Soldering: 2. Cleaning: If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGHD1105W-0301 Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 •• Tel: 800-LED-LCD1 (533-5231) •• Fax: 949-222-0555
Website: www.stanley-electric.com Operation Heating Pre-heating LED Surface Temperature Temperature rise: 5°C/sec. Cooling: —5 °C/sec. 60 to 120 sec. 5 sec. max 120 150 240 °C~ (Ta=25°C) I Operation Current Derating Chart (DC) DG, DC, DB, I Spatial Distribution I Taping Specifications (3.45) (0.25) (2.1) Center Hole Center Hole (1.85) 4+0. 1 φ 1.5 +0.1 8+0.2 2+0.05 4+0.1 3.5+0.05 1.75+0.1 φ 1.1)( Quantity on tape: 2000 pieces per reel φ 21+0.8 9+0.3 11.4+1 φ 13+0.2 φ 180+0 φ 60 +1 φ 13+0.2 2+0.5 I Taping Specifications φ 1.5 (1.8) (0.25) (0.5) (2.2) (3.5) +0.1 4+0.1 4+0.1 2+0.05 1.75 +0.13.5+0.05 8+0.2 Center Hole φ 1.1)( Quantity on tape: 2000 pieces per reel Cathode RR Direction to pull Cathode TR Direction to pull for Reverse Mount Type for Standard Mount Type