HD74AC153 RENESAS | Alldatasheet
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 7
Technical content
Features
- Outputs Source/Sink 24 mA
- Ordering Information Part Name Package Type Package Code Package Abbreviation Taping Abbreviation (Quantity) HD74AC153FPEL SOP-16 pin (JEITA) FP-16DAV FP EL (2,000 pcs/reel) HD74AC153RPEL SOP-16 pin (JEDEC) FP-16DNV RP EL (2,500 pcs/reel) Notes: 1. Please consult the sales office for the above package availability. 2. The packages with lead-free pins are distinguished from the conventional products by adding V at the end of the package code. Pin Arrangement E a I3a I2a I1a Za I0a GND VCC Eb I3b I2b I1b I0b Zb (Top view)
Rev.2.00, Jul.16.2004, page 2 of 6 Logic Symbol Ea Za Zb I0a I1a I2a I3a I0b I1b I2b I3b Eb Pin Names I0a to I3a Side A Data Inputs I0b to I3b Side B Data Inputs S0, S1 Common Select Inputs Ea Side A Enable Input Eb Side B Enable Input Za Side A Output Zb Side B Output Functional Description The HD74AC153 is a dual 4-input multiplexer. It can select two bits of data from up to four sources under the control of the common Select inputs (S0, S1). The two 4-input multiplexer circuits have individual active-Low Enables (Ea, Eb) which can be used to strobe the outputs independently. When the Enables (Ea, Eb) are High, the corresponding outputs (Za, Zb) are forced Low. The HD74AC153 is the logic implementation of a 2-pole, 4-position switch, where the position of the switch is determined by the logic levels supplied to the two Select inputs. The logic equations for the outputs are shown below. Z a = Ea•(I0a•S1•S0 + I1a•S1•S0 + I2a•S1•S0 + I3a•S1•S0) Zb = Eb•(I0b•S1•S0 + I1b•S1•S0 + I2b•S1•S0 + I3b•S1•S0) Truth Table Select Inputs Input (a or b) Output S0 S1 EEEE I0 I1 I2 I3 Z X X HXXXXL L L LLXXXL L L LHXXXH H L LXLXXL HL L X H X X H L H LXXLXL L H LXXHXH H H LXXXLL HH L X X X H H H : High Voltage Level L : Low Voltage Level X : Immaterial
Rev.2.00, Jul.16.2004, page 3 of 6 Logic Diagram I0a I1a I2a I0b I1b I2b I3b EbEa I3a S1 Za Zb Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Absolute Maximum Ratings Item Symbol Ratings Unit Condition Supply voltage V CC –0.5 to 7 V –20 mA V I = –0.5VDC input diode current I IK 20 mA V I = Vcc+0.5V DC input voltage V I –0.5 to Vcc+0.5 V –50 mA V O = –0.5VDC output diode current I OK 50 mA V O = Vcc+0.5V DC output voltage V O –0.5 to Vcc+0.5 V DC output source or sink current I O ±50 mA DC VCC or ground current per output pin I CC, IGND ±50 mA Storage temperature Tstg –65 to +150 °C Recommended Operating Conditions Item Symbol Ratings Unit Condition Supply voltage V CC 2 to 6 V Input and output voltage V I, VO 0 to VCC V Operating temperature Ta –40 to +85 °C VCC = 3.0V VCC = 4.5 V Input rise and fall time (except Schmitt inputs) V IN 30% to 70% VCC tr, tf 8 ns/V VCC = 5.5 V
Rev.2.00, Jul.16.2004, page 4 of 6 DC Characteristics Ta = 25°°°°C Ta = –40 to +85°°°°C Item Sym- bol Vcc (V) Unit Condition VIH VOUT = 0.1 V or VCC –0.1 V Input Voltage VIL V VOUT = 0.1 V or VCC –0.1 V VIN = VIL or VIH IOUT = –50 µA 3.0 2.58 — — 2.48 — I OH = –12 mA 4.5 3.94 — — 3.80 — I OH = –24 mA VOH VIN = VIL or VIH IOH = –24 mA VIN = VIL or VIH IOUT = 50 µA 3.0 — — 0.32 — 0.37 I OL = 12 mA 4.5 — — 0.32 — 0.37 I OL = 24 mA Output voltage VOL V VIN = VIL or VIH IOL = 24 mA Input leakage current IIN 5.5 — — ±0.1 — ±1.0 µAV IN = VCC or GND IOLD 5 . 5 ———8 6—m A V OLD = 1.1 VDynamic output current* I OHD 5.5 — — — –75 — mA V OHD = 3.85 V Quiescent supply current I CC 5.5 — — 8.0 — 80 µAV IN = VCC or ground *Maximum test duration 2.0 ms, one output loaded at a time. AC Characteristics: HD74AC153 Ta = +25°C CL = 50 pF Ta = –40°C to +85°C CL = 50 pF Item Symbol V CC (V)*1 Min Typ Max Min Max Unit Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V Voltage Range 5.0 is 5.0 V ± 0.5 V
Rev.2.00, Jul.16.2004, page 5 of 6 Capacitance Item Symbol Typ Unit Condition Input capacitance C IN 4.5 pF V CC = 5.5 V Power dissipation capacitance C PD 65.0 pF V CC = 5.0 V
Rev.2.00, Jul.16.2004, page 6 of 6 Package Dimensions Package Code JEDEC JEITA Mass (reference value) FP-16DAV Conforms 0.24 g *Ni/Pd/Au plating *0.20 ± 0.05 *0.40 ± 0.06 0.12 0.15 M
2.20 Max
5.5 10.06
0.80 Max
10.5 Max
+ 0.20 – 0.307.80 0.70 ± 0.20 0˚ – 8˚ 0.10 ± 0.10 1.15 1.27 As of January, 2003 Unit: mm Package Code JEDEC JEITA Mass (reference value) FP-16DNV Conforms Conforms 0.15 g *Ni/Pd/Au plating 1.27 16 9 1 8 0.15 0.25 M 1.75 Max 3.95 *0.20 ± 0.05 9.9 0˚ – 8˚
10.3 Max
+ 0.10 – 0.306.10 + 0.67 – 0.20 0.60 + 0.11 – 0.040.14 *0.40 ± 0.06 0.635 Max 1.08 As of January, 2003 Unit: mm
Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan http://www.renesas.com Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 RENESAS SALES OFFICES © 2004. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .1.0