HD3SS2521_16 TI1 | Alldatasheet
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PRODUCT□PREVIEW Control Logic DP Lane 2 SuperSpeed USB TX SuperSpeed USB RX DP Lane 3 DP Config 1 DP Config 2 USB DP USB DM DockPort_C2_DM DockPort_C1_DP DockPort_L2_TX DockPort_L3_RX HD3SS2521 www.ti.com SLAS941A –APRIL 2013–REVISED MAY 2013 DockPortController Check forSamples: HD3SS2521 1FEATURES
- IdealforDockPort Applications • ESD – Bi-Directional2:1Switch forUSB 2.0 – HBM: 2000V (HS/FS/LS)and HPD Signals – CDM: 500V – Bi-Directional2:1Switch forSuperSpeed USB and DisplayPortSignals APPLICATIONS – IntegratedDockPort ControllerManages • Desktop PCs DockPort Detection,SignalSwitchingand • Notebook PCsPower Switching • Tablets• Supports Host-and Dock-sideApplications • Docking Station• VCC OperatingRange 3.3V± 10%
- SuperSpeed USB I/OSupports Common Mode Voltagefrom 0V to2.2V
- USB 2.0I/OSupports SignalUp to3.6V
- Wide –3dB DifferentialBW on High-bandwidth Path ofover 6 GHz
- ExcellentHigh-bandwidthPath Dynamic Characteristicson (at2.5GHz) – Crosstalk= –39dB – Isolation= –22dB – InsertionLoss = –1.2dB – Return Loss = 12 dB – Max Bit-BitSkew = 8 ps
- 5mm x11mm, 56-PinWQFN Package (RHU) Figure1. DockPort FunctionalDiagram
DESCRIPTION
The HD3SS2521 isan integratedDockPortswitchsolution.Itprovidesindependent2:1passiveswitchingforthe SuperSpeed USB and DisplayPortsignalsas wellas fortheUSB 2.0(HS/FS/LS)and I2C necessarytosupport DockPortapplications.Inaddition,a firmwareupgradableintegratedDockPortcontrollerisprovidedtomanage hostand dock sideDockPortdetection,signalswitchand power configuration. The HD3SS2521 isofferedin56-pinWQFN package and isspecifiedtooperatefroma singlesupplyvoltageof 3.3Voverthetemperaturerangeof0°C to70°C . Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCT PREVIEW informationconcerns products in the Copyright© 2013,Texas InstrumentsIncorporatedformativeordesignphase ofdevelopment.Characteristicdataand otherspecificationsare designgoals.Texas Instrumentsreserves therighttochange ordiscontinuetheseproductswithoutnotice.
PRODUCT□PREVIEW HD3SS2521 SLAS941A –APRIL 2013–REVISED MAY 2013 www.ti.com This integratedcircuitcan be damaged by ESD. Texas Instrumentsrecommends thatallintegratedcircuitsbe handled with appropriateprecautions.Failuretoobserveproperhandlingand installationprocedurescan cause damage. ESD damage can rangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmay be more susceptibletodamage because verysmallparametricchanges couldcause thedevicenottomeet itspublishedspecifications.
ORDERING INFORMATION
PART NUMBER PART MARKING PACKAGE HD3SS2521RHUR HD3S2521 56-PinWQFN (ReelLarge) HD3SS2521RHUT HD3S2521 56-PinWQFN (ReelSmall)
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PRODUCT□PREVIEW A0P A0N A1P A1N B0P B0N B1P B1N C0P C0N C1P C1N SEL SS_SEL_IN SEL ADP ADM BDP BDM CDP HS_SEL_IN DP/CONFIG1 DM/CONFIG2 mDP Connector DP Power Enable Block SS_SEL_OUT HS_SEL_OUT SYS_COM_REQ HS_OE#_IN SS_OE#_IN CONFIG1 CONFIG2 HPD_IN CDM SLEEP# CHRG_DELAY CHRG_OFF DigitalControl Logic MODE_LED RST AUX_N DP_2P DP_2N DP_3P DP_3N SSTXP SSTXM SSRXP SSRXM Downstream SSTX Display Port Source CONFIG1_SDA CONFIG2_SCL USB2_DP USB2_DM DP_2P/SSTXP DP_2N/SSTXM DP_3P/SSRXP DP_3N/SSRXM HPD_IN AUX_N AUX_P AUX_N DP_PWR RTN 1920 AUX_N HD3SS2521 SLEEP# SLEEP# DP_0P DP_1P DP_1N DP_0N 9115 3 HS_OE#_OUT Vcc SS_OE#_OUT CONFIG_PU# Dongle_PWREN# CONFIG1 CONFIG2 Vcc Vcc/ GND USB3/xHCI HPD_OUT SYS_COM_REQ HPD_OUT Vcc/ GND Downstream SSRX Downstream USB2 NOTE: Refer to the implementation guide for details on design considerations and configuration options HD3SS2521 www.ti.com SLAS941A –APRIL 2013–REVISED MAY 2013 TYPICAL APPLICATION Figure2. DockPort Host Implementation Copyright© 2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:HD3SS2521
PRODUCT□PREVIEW A0P A0N A1P A1N B0P B0N B1P B1N C0P C0N C1P C1N SEL SS_SEL_IN SEL ADP ADM BDP BDM CDP HS_SEL_IN DP/CONFIG1 DM/CONFIG2 Power Block SS_SEL_OUT HS_SEL_OUT VCTRL_SEL3 VCTRL_SEL2 VCTRL_SEL1 FAULT# HS_OE# SS_OE_IN# Power Switch Block CONFIG1 CONFIG2 HPD_OUT CDM MST_MODE HS_OE#_OUT CHRG_EN# DigitalControl Logic MODE_LED RST PUSH_BUTTON AUX_N DP_2P DP_2N DP_3P DP_3N SSRXP SSRXM SSTXP SSTXM USB3 HUB Upstream SSTX MST_HUB CONFIG1 CONFIG2 USB2_DP USB2_DM DP_2P/SSRXP DP_2N/SSRXM DP_3P/SSTXP DP_3N/SSTXM HPD_OUT AUX_N AUX_P AUX_N 2DP_PWR RTN 19 20 V_CHARGE(5/12/19.5V) 5V_SEL 12V_SEL 19.5V_SEL AUX_N HD3SS2521 Display Ports Ethernet Audio DP Display/ DP HUB USB Peripherals HUB PUSH_BUTTON MST_MODE PUSH_BUTTON MST_MODE DP_0P DP_1P DP_1N DP_0N 17 15 1012 HPD_IN CONFIG2 CONFIG1 Vcc Vcc Vcc Upstream SSRX Upstream USB2 NOTE: Refer to the implementation guide for details on design considerations and configuration options Tethered Cable with mini DP plug HD3SS2521 SLAS941A –APRIL 2013–REVISED MAY 2013 www.ti.com Figure3. DockPort Hub Implementation
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PRODUCT□PREVIEW 1 1 21 22 23 24 25 26 27 28 4952 51 505356 55 54 Thermal Pad VCC A0P A0N NC A1P A1N SS_SEL_IN RSVD HS_OE#_IN ADM ADP HS_SEL_IN VCC VCC MODE_LED HPD_IN HPD_OUT AUX_N HS_SEL_OUT SS_SEL_OUT B0P B0N B1P B1N C1P C0N C1P C1N VCC NC CDP CDM BDM BDP RSVD / PUSH_BUTTON GND HS_OE#_OUT NC RST CONFIG_1 CHRG_OFF / MST_MODECHRG_DELAY / CHRG_EN#SLEEP# / FAULT#NC SYS_COM_REQ / VCTRL_SEL1CONFIG_PU# / VCTRL_SEL2DONGLE_PWR_EN# / VCTRL_SEL3CONFIG_2 NCNCNCV CC GNDNCNCNC HD3SS2521 www.ti.com SLAS941A –APRIL 2013–REVISED MAY 2013 RHU PACKAGE (TOP VIEW) Copyright© 2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:HD3SS2521
PRODUCT□PREVIEW HD3SS2521 SLAS941A –APRIL 2013–REVISED MAY 2013 www.ti.com PIN FUNCTIONS SIGNALDockPort HOST DockPort DEVICE SPEEDPIN I/O PIN NAME (SIGNAL MUX) (SIGNAL DE-MUX) (MAX)
2 I/O A0P DockPortLane 2,PositiveSignal FastLane
(DockPortcablebetween DockPorthostand DockPortdevice) (Up to 5.4Gbps)3 I/O A0N DockPortLane 2,NegativeSignal (DockPortcablebetween DockPorthostand DockPortdevice)
5 I/O A1P DockPortLane 3,PositiveSignal(DockPortcablebetween DockPorthostand
DockPortdevice)
6 I/O A1N DockPortLane 3,NegativeSignal(DockPortcablebetween DockPorthostand
DockPortdevice)
48 I/O B0P DisplayPortLane 2,PositiveSignal FastLane
(Up to47 I/O B0N DisplayPortLane 2,NegativeSignal 5.4Gbps)
46 I/O B1P DisplayPortLane 3,PositiveSignal
45 I/O B1N DisplayPortLane 3,NegativeSignal
44 I/O C0P SuperSpeed USB TX, PositiveSignal SuperSpeed USB RX, Positive FastLane
Signal (Up to 5.4Gbps)43 I/O C0N SuperSpeed USB TX, NegativeSignal SuperSpeed USB RX, Negative Signal
42 I/O C1P SuperSpeed USB RX, PositiveSignal SuperSpeed USB TX, PositiveSignal
41 I/O C1N SuperSpeed USB RX, NegativeSignal SuperSpeed USB TX, Negative
11 I/O ADP DockPortConfig1(DockPortcablebetween DockPorthostand DockPortdevice) SupportsHigh-
speed USB10 I/O ADM DockPortConfig2(DockPortcablebetween DockPorthostand DockPortdevice)
35 I/O BDP CONFIG 1
36 I/O BDM CONFIG 2
37 I/O CDP High-speedUSB D+
38 I/O CDM High-speedUSB D-
7 I SS_SEL_IN DisplayPort/SuperSpeed USB Mux Select(ConnecttoSS_SEL_OUT -Pin20)
12 I HS_SEL_IN DisplayPort/HighSpeed USB Mux Select(ConnecttoHS_SEL_OUT -Pin19)
8 I RSVD N/C N/C
(SS_OE#_IN) Forfuturecompatibility(Connectto Requiresexternal10 kΩ Pull-down. RSVD [SS_OE#_OUT] signal-Pin34)
9 I HS_OE#_IN DisplayPort/HighSpeed USB Mux Enable(ConnecttoHS_OE#_OUT -Pin32)
15 I/O MODE_LED Thissignalissampled atpower on or Thissignalissampled atpower on or
resettodeterminethemode ofoperation:resettodeterminethemode of operation:PulledHighforDockPorthostoperation. (OptionallythroughLED fordebug PulledLow forDockPorthub purposes) (dock/dongle)operation.(Optionally throughLED fordebug purposes)
16 I HPD_IN Hot PlugDetectfromDockPortdevice Hot PlugDetectfromMST Hub/DP
17 O HPD_OUT Hot PlugDetecttoSystem Graphics Hot PlugDetecttoDockPorthost.
18 I/O AUX_N AUX NegativePull-UptoDockPort AUX NegativefromDockPorthost
device(Output) (Input) Thissignalindicatesa connectionevent Thissignalisused todetecta toa DockPortdevice. connectioneventfroma DockPort host.
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PRODUCT□PREVIEW HD3SS2521 www.ti.com SLAS941A –APRIL 2013–REVISED MAY 2013 PIN FUNCTIONS (continued) SIGNALDockPort HOST DockPort DEVICE SPEEDPIN I/O PIN NAME (SIGNAL MUX) (SIGNAL DE-MUX) (MAX)
19 O HS_SEL_OUT DisplayPort/High-speedUSB Mux Select(ConnecttoHS_SEL_IN -Pin12)
ThissignalinconjunctionwithSS_SEL_OUT issampled atpower-onorresetto determinethevoltagelevelsuppliedtoa DockPorthostand must be strappedto correctlogiclevelforthecorrespondingvoltagelevel:5 V,12 V or19 V. RefertothePower DeliveryVoltageSelectiontableforstrappingoptions. Afterpower-on/reset,thissignalisdrivenby DockPorthosttoselectthedevice operationbetween DisplayPortand High-speedUSB. MM 0 = DisplayPort MM 1 = High-speedUSB
20 O SS_SEL_OUT DisplayPort/SuperSpeed USB Mux Select(ConnecttoSS_SEL_IN -Pin7)
ThissignalinconjunctionwithHS_SEL_OUT issampled atpower-onorresetto determinethevoltageleveltobe suppliedtoa DockPorthostand must be strappedtocorrectlogiclevelforthecorrespondingvoltagelevel:5 V,12 V or 19 V. RefertothePower DeliveryVoltageSelectiontableforstrappingoptions. Afterpower-on/reset,thissignalisdrivenby DockPorthosttoselectthedevice operationbetween DisplayPortand SuperSpeed USB. MM 0 = DisplayPort MM 1 = SuperSpeed USB
28 I/O CONFIG_2 DisplayPortCONFIG2/CEC
29 I/O CONFIG_1 DisplayPortCONFIG1/CAD
21 O CHRG_OFF Thissignalcontrolsthepower delivery —
circuit. MST_MODE — MST Mode InputfromMST HUB whichindicates2/4DisplayPortlane switch. 0 = 2-lane(external10 kΩ Pull-down) 1 = 4-lane(external10 kΩ Pull-up)
22 O CHRG_DELAY Thissignalcontrolsthepower delivery —
circuit. CHRG_EN# — Thissignalisthepower delivery enablefora DockPorthub.
23 I SLEEP# ConnecttotheDockPorthostsleepstate —
signal. FAULT# — Connecttothefaultindicatorofthe power management circuit 25 I SYS_COM_REQ External100K Pull–down required.This signalisa sampled atpower on orreset todetermineifthesystemisina FW updatemode. Afterpower on reset,thesignalisused forcommunicationrequestviaa GPIO in a DockPorthostforcommunication request O VCTRL_SEL1 — Power enablefor5 V power delivery Inadditon,thissignalissampled at power on orresettodeterminethe mode ofoperation: 0 = DockPorthub (external10 kΩ Pull-down) 1 = DockPortdongle(external10 kΩ Pull-up) Copyright© 2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:HD3SS2521
PRODUCT□PREVIEW HD3SS2521 SLAS941A –APRIL 2013–REVISED MAY 2013 www.ti.com PIN FUNCTIONS (continued) SIGNALDockPort HOST DockPort DEVICE SPEEDPIN I/O PIN NAME (SIGNAL MUX) (SIGNAL DE-MUX) (MAX)
26 O CONFIG_PU# ConnecttoFET switchtocontrolpull-up —
CONFIG1/CONFIG2 forDockPort communication. VCTRL_SEL2 — Power enablefor12 V power delivery
27 O Dongle_PWREN# Power enablefor5 V DockPortdongle —
VCTRL_SEL3 — Power enablefor19 V power delivery
34 O RSVD N/C —
(SS_OE#_OUT) Forfuturecompatibility(Connectto RSVD [SS_OE#_IN] signal-Pin8) I PUSH_BUTTON — External5.6kΩPull-uprequired. Push buttoninputtoDockPorthub and MST HUB for2-lane/4-lane switching 32 O HS_OE#_OUT DisplayPort/High-speedUSB Mux Enable.(ConnecttoHS_OE#_IN -Pin9) An external10 kΩ Pull-downtogroundisrequired.
30 I/O RST Reset
33 GND GND ConnecttoSupplyGround
24 NC NC No Connect
1 Supply VCC 3.3VPositivepower supplyvoltage
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PRODUCT□PREVIEW HD3SS2521 www.ti.com SLAS941A –APRIL 2013–REVISED MAY 2013 Table1.Power DeliveryVoltageSelection VOLTAGE HS_SEL_OUT SS_SEL_OUT
0 V 0 0
12 V 0 1
19 V 1 0
5 V 1 1
ABSOLUTE MAXIMUM RATINGS (1)(2) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT SupplyVoltageRange (2) VCC –0.3 4 V DifferentialI/O(Highbandwidthsignalpath,AxP/N,BxP/N,CxP/N) –0.5 4 V VoltageRange DifferentialI/O(Low bandwidthsignalpath,ADP/M, BDP/M, CDP/M) -0.5 7 V ControlPinand SingleEnded I/O –0.3 VCC + 0.3 V Human body model(3) ±2000 V Electrostaticdischarge Charged-devicemodel(4) ±500 V Continuouspower dissipation See ThermalTable (1) Stressesbeyond thoselistedunderabsolutemaximum ratingsmay cause permanentdamage tothedevice.These arestressratings onlyand functionaloperationofthedeviceattheseorany conditionsbeyond thoseindicatedunderrecommended operatingconditions isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) Allvoltagevalues,exceptdifferentialvoltages,arewithrespecttonetworkgroundterminal. (3) TestedinaccordancewithJEDEC Standard22,TestMethod A114-B (4) TestedinaccordancewithJEDEC Standard22,TestMethod C101-A Copyright© 2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:HD3SS2521
PRODUCT□PREVIEW HD3SS2521 SLAS941A –APRIL 2013–REVISED MAY 2013 www.ti.com THERMAL INFORMATION HD3SS2521 THERMAL METRIC (1) UNITS RHU (56PIN) θJA Junction-to-ambientthermalresistance 31.6 θJCtop Junction-to-case(top)thermalresistance 15.9 θJB Junction-to-boardthermalresistance 8.5 °C/W ψJT Junction-to-topcharacterizationparameter 0.5 ψJB Junction-to-boardcharacterizationparameter 8.5 spacer (1) Formore informationabouttraditionaland new thermalmetrics,see theIC Package ThermalMetricsapplicationreport,SPRA953 . RECOMMENDED OPERATING CONDITIONS (TypicalvaluesforallparametersareatVcc = 3.3Vand TA = 25°C. Alltemperaturelimitsarespecifiedby design) MIN TYP MAX UNITS VCC Supplyvoltage 3 3.3 3.6 V VIH Inputhighvoltage Control/StatusPins 2 VCC V VIL Inputlowvoltage Control/StatusPins –0.1 0.8 V VI/O_Diff Differential SwitchI/Odiffvoltage(High-bandwidthpathAxP/N,BxP/N,CxP/N) 0 1.8 Vpp voltage VI/O_CM Common voltage SwitchI/Ocommon mode voltage(High-bandwidthpathAxP/N,BxP/N, 0 2 V CxP/N) VI/O Input/ouput Data input/outputvoltage(Low-bandwidthpathADP/M, BDP/M, 0 5.5 V voltage CDP/M) TA Operatingfree-airtemperature 0 70 °C ELECTRICAL CHARACTERISTICS – DEVICE PARAMETERS (underrecommended operatingconditions) PARAMETER CONDITIONS MIN TYP MAX UNITS VCC = 3.6V,HS_SEL_IN/SS_SEL_IN = VCC/GND;ICC SupplyCurrent 4.5 mA HS_OE#_IN = GND; OutputsFloating AUX_N, CONFIG_1, CONFIG_2, FAULT#, HPD_IN, MODE_LED, PUSH_BUTTON, RST, SLEEP#, SYS_COM_REQ, TEST Positive-goinginputthresholdVIT+ 0.45VCC 0.75VCC Vvoltage Negative-goinginputthresholdVIT– 0.25VCC 0.55VCC Vvoltage InputvoltagehysteresisVhys VCC = 3V 0.3 1 V(VIT+ – VIT–) Pullup:VIN = GND,R PULL Pullup/pulldownresistor 20 35 50 kΩPulldown:VIN = VCC ,VCC = 3V C I Inputcapacitance VIN = GND orVCC 5 pF VIN = GND orVCC ,VCC = 3V,Pullup/PulldownILK High-impedanceleakagecurrent ±50 nAdisabled AUX_N, CHRG_DELAY, CHRG_EN, CHRG_OFF, CONFIG_1, CONFIG_2, CONFIG_PU#, Dongle_PWREN#, HPD_OUT, HS_OE#_OUT, HS_SEL_OUT, MODE_LED, MST_MODE, SS_SEL_OUT, RST, TEST, VCTRL_SEL1, VCTRL_SEL2, VCTRL_SEL3 VOH High-levelouptutvoltage IOHmax = –6 mA (1) VCC – 0.3 V VOL Low-levelouptutvoltage IOLmax = 6 mA (1) GND + 0.3 V SS_SEL_IN IIH InputHighCurrent VCC = 3.6V,VIN = VCC 95 µA IIL InputLow Current VCC = 3.6V,VIN = GND 1 (1) The maximum totalcurrent,IOHmax and IOLmax ,foralloutputscombined shouldnotexceed ±48 mA toholdthemaximum voltagedrop specified.
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PRODUCT□PREVIEW HD3SS2521 www.ti.com SLAS941A –APRIL 2013–REVISED MAY 2013 ELECTRICAL CHARACTERISTICS – DEVICE PARAMETERS (continued) (underrecommended operatingconditions) PARAMETER CONDITIONS MIN TYP MAX UNITS IIH InputHighCurrent VCC = 3.6V,VIN = VCC 1 µA IIL InputLow Current VCC = 3.6V,VIN = GND 1 µA AxP/N, BxP/N, CxP/N VCC = 3.6V,VIN = 0V,VOUT = 2V 130(ILK on open outputsPortB and C) ILK High-impedanceleakagecurrent µA VCC = 3.6V,VIN = 0V,VOUT = 2V 4(ILK on open outputsPortA) ADP/DM, BDP/DM, CDP/DM VCC = 3.6V,VIN = 0V,VOUT = 0V to4V,ILK High-impedanceleakagecurrent 1 µAHS_OE#_IN = GND ELECTRICAL CHARACTERISTICS – SIGNAL SWITCH PARAMETERS (underrecommended operatingconditions;RL, Rsc = 50Ω,CL = 10pF unlessotherwisenoted) PARAMETER CONDITIONS MIN TYP MAX UNITS AxP/N, BxP/N, CxP/N HIGH-BANDWIDTH SIGNAL PATH tPD SwitchPropagationDelay Rsc and RL = 50 Ω,See Figure5 85 ps Ton SS_SEL_IN -to-SwitchTon 70 250 Rsc and RL = 50 Ω,See Figure4 ns Toff SS_SEL_IN -to-SwitchToff 70 250 TSK(O) Inter-PairOutputSkew (CH-CH) 20 ps Rsc and RL = 50 Ω,See Figure5 TSK(b-b) Intra-PairOutputSkew (bit-bit) 8 ps C ON OutputsON Capacitance VIN = 0V,OutputsOpen, SwitchON 1.5 pF C OFF OutputsOFF Capacitance VIN = 0V,OutputsOpen, SwitchOFF 1 pF VCC = 3.3V,VCM = 0.5V– 1.5V,R ON OutputON resistance 5 8 ΩIO = –8 mA On resistancematch between channels 2VCC = 3.3V;–0.35V≤ VIN ≤ 1.2V;ΔR ON ΩOn resistancematch between pairsofthe IO = –8 mA 0.7same channel R FLAT_ON On resistanceflatness[RON(MAX) – R ON(MIN)] VCC = 3.3V;–0.35V≤ VIN ≤ 1.2V 1.15 Ω f= 2.5GHz –12 RL DifferentialReturnLoss (VCM = 0V) dB f= 4.0GHz –11 f= 2.5GHz –39 XTALK DifferentialCrosstalk(VCM = 0V) dB f= 4.0GHz –35 f= 2.5GHz –22 O IRR DifferentialOff-Isolation(VCM = 0V) dB f= 4.0GHz –19 f= 2.5GHz –1.1 IL DifferentialInsertionLoss (VCM = 0V) dB f= 4.0GHz –1.5 BW Bandwidth At-3dB 6 GHz ADP/DM, BDP/DM, CDP/DM SIGNAL PATH tPD SwitchPropagationDelay Rsc and RL = 50 Ω,See Figure5 250 ps HS_SEL_IN -to-SwitchTon 30 Ton Rsc and RL = 50 Ω,See Figure4 HS_OE#_IN -to-SwitchTon 17 ns HS_SEL_IN Toff 12 Toff Rsc and RL = 50 Ω,See Figure4 HS_OE#_IN -to-SwitchToff 10 TSK(O) Inter-PairOutputSkew (CH-CH) 10 20 ps Rsc and RL = 50 Ω,See Figure5 TSK(b-b) Intra-PairOutputSkew (bit-bit) 10 20 ps VIN = VCC or0V,OutputsOpen,C ON OutputsON Capacitance 6 7.5 pFSwitchON Copyright© 2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:HD3SS2521
PRODUCT□PREVIEW HD3SS2521 SLAS941A –APRIL 2013–REVISED MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS – SIGNAL SWITCH PARAMETERS (continued) (underrecommended operatingconditions;RL, Rsc = 50Ω,CL = 10pF unlessotherwisenoted) PARAMETER CONDITIONS MIN TYP MAX UNITS VIN = VCC or0V,OutputsOpen,C OFF OutputsOFF Capacitance 3.5 6 pFSwitchOFF VCC = 3V,VIN = 0V,IO = 30 mA 3 6 R ON OutputON resistance Ω VCC = 3V,VIN = 2.4V,IO = –15 mA 3.4 6 VCC = 3V,VIN = 0V,IO = 30 mA 0.2 ΔR ON On resistancematch Ω VCC = 3V,VIN = 1.7V,IO = –15 mA 0.2 VCC = 3V,VIN = 0V,IO = 30 mA 1 WOn resistanceflatnessR FLAT_ON [RON(MAX) – R ON(MIN)] VCC = 3V,VIN = 1.7V,IO = –15 mA 1 XTALK DifferentialCrosstalk(VCM = 0V) RL = 50 W, f= 250 MHz –40 dB O IRR DifferentialOff-Isolation(VCM = 0V) RL = 50 W, f= 250 MHz –41 dB BW Bandwidth RL = 50 W 0.9 GHz
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PRODUCT□PREVIEW 50% 50% 50% 50% tP1 tP2 tSK(O) = Difference between tPD for any two pairs of outputs 50 Ω 50 Ω Bx/Cx(p)Ax(p) 50 Ω 50 Ω Bx/Cx(n)Ax(n) SEL HD3SS2521 Vcc Cx/Bx (p) Cx/Bx (n) 50% tSK(O) tPD = Max(tp1, tp2) t3 t4t1 t2 Bx/Cx(p) Bx/Cx(n) Ax(p) Ax(n) Ax (p) Ax (n) DCx/DBx/DAx (p) Cx/Bx/Ax (n) Cx/Bx/Ax (p) Cx/Bx/Ax (n) NOTES: 1. Measurements based on an ideal input with zero intra-pair skew on the input, i.e. the input at A to B/C or the input at B/C to A 2. Inter-pair skew is measured from lane to lane on the same channel, e.g. C0 to C1 3. Intra-pair skew is defined as the relative difference from the p and n signals of a single lane Intra-pair skew Inter-pair skew VOUT 90% 10% 50 % Ton Toff HS_SEL_IN/SS_SEL_IN HD3SS2521 www.ti.com SLAS941A –APRIL 2013–REVISED MAY 2013 TEST TIMING DIAGRAMS Figure4. SelecttoSwitch Ton and Toff Figure5. PropagationDelay and Skew Copyright© 2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:HD3SS2521
www.ti.com 29-May-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples HD3SS2521RHUR ACTIVE WQFN RHU 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 70 HD3S2521 HD3SS2521RHUT PREVIEW WQFN RHU 56 250 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 21-Apr-2016 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) HD3SS2521RHUR WQFN RHU 56 2000 367.0 367.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 21-Apr-2016 Pack Materials-Page 2
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