HD1530FX STMICROELECTRONICS | Alldatasheet
Document overview
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Technical content
Features
■ STATE-OF-THE-ART TECHNOLOGY: DIFFUSED COLLECTOR “ENHANCED GENERATION“ EHVS1 ■ WIDER RANGE OF OPTIMUM DRIVE CONDITIONS ■ LESS SENSITIVE TO OPERATING TEMPERATURE VARIATION ■ FULLY INSULATED POWER PACKAGE WHICH IS U.L COMPLIANT
Applications
■ HORIZONTAL DEFLECTION OUTPUT FOR DIGITAL TV, HDTV, AND HIGH -END MONITORS
Description
The device uses a Diffused Collector in Planar technology which adopts ”Enhanced High Voltage Structure” (EHVS1) that was developed to fit High-Definition CRT displays. The new HD product series features improved silicon efficiency, bringing updated performance to Horizontal Deflection output stages. Order Codes Internal Schematic Diagram ISOWATT218FX Part Number Marking Package Packing HD1530FX HD1530FX ISOWATT218FX TUBE rev.3
1 Absolute Maximum Ratings HD1530FX
1 Absolute Maximum Ratings
Table 1. Absolute Maximum Ratingsn
1.1 Thermal Data
Table 2. Thermal Data
2 Electrical Characteristics
Table 3. Electrical Characteristics (TCASE = 25°C; unless otherwise specified) Note: 1 Pulsed duration = 300 μs, duty cycle ≤1.5%.
3 Package Mechanical Data HD1530FX
3 Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
Table 4. ISOWATT218FX Mechanical Data Figure 1. ISOWATT218FX Drawing
4 Revision History HD1530FX
4 Revision History
05-July-2005 1 Initial release. 25-July-2005 2 New Template, no content change 19-Aug-2005 3 New ECOPACK® label
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the con sequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publicatio n are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics produ cts are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectron ics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Ital y - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America