HD01 SAMYANG | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- UL recognition,file #E313149
- Ideal for automated placement
- High surge current capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Typical Applications General purpose use in AC/DC bridge full wave rectification for power supply, lighting ballast, battery charger, home appliances, office equipment, and telecommunication applications. Mechanical Data
- Package: MBS Molding compound meets UL 94 V-0 flammability rating, RoHS-compliant
- Terminals: Tin plated leads, solderable per J-STD-002 and JESD22-B102
- Polarity: As marked on body ■Maximum Ratings (Ta=25℃ Unless otherwise specified) PARAMETER SYMBOL UNIT HD01 HD 02 HD04 HD06 HD08 HD10 Device marking code HD01 HD02 HD04 HD06 HD08 HD10 Repetitive peak reverse voltage VRRM V 100 200 400 600 800 1000 Average rectified output current @60Hz sine wave, R-load, Ta=40℃ On alumina substrate IO A 0.8 On glass-epoxi substrate 0.5 Surge(non-repetitive)forward current @60Hz half sine wave, 1 cycle, Tj=25℃ IFSM A 30 Current squared time @1ms≤t≤8.3ms Tj=25℃,rating of per diode I t A2S 3.7 Storage temperature Tstg ℃ -55 ~+150 Junction temperature Tj ℃ -55 ~+150 ■Electrical Characteristics(Ta=25℃ Unless otherwise specified) PARAMETER SYMBOL UNIT TEST CONDITIONS HD01 HD02 HD04 HD06 HD08 HD10 Maximum instantaneous forward voltage drop per diode VF V IFM=0.4A 1.00 Maximum DC reverse current at rated DC blocking voltage per diode IRRM μA VRM=VRRM 5 SAM YANG HD01 --- HD10SAMYANG ELECTRONICS All d ata sheet.com
www.diode.co.kr ■Thermal Characteristics (Ta=25℃ Unless otherwise specified) PARAMETER SYMBOL UNIT HD01 HD02 HD04 HD06 HD08 HD10 Thermal Resistance Between junction and ambient, On alumina substrate RθJ-A ℃/W 76.0 Between junction and ambient, On glass- epoxi substrate RθJ-A 134.0 Between junction and lead RθJ-L 20.0 ■Ordering Information (Example) PREFERED P/N PACKING CODE UNIT WEIGHT(g) MINIIMUM PACKAGE(pcs) INNER BOX QUANTITY(pcs) OUTER CARTON QUANTITY(pcs) DELIVERY MODE HD01 - HD10 F1 Approximate 0.12 2500 5000 40000 13 ’ reel ■ Characteristics(Typical) 0.01 0.02 0.05 FIG3: Forward Voltage 0.1 0.5 Ta=25℃ Instantaneous Forward Current (A) Instantaneous Forward Voltage (V) 0 20 40 60 80 100 0.01 0.1 1.0 100 Tj=150℃ Tj=25℃ FIG4:Typical Reverse Characteristics ) A u ( t n e r r u C e s r e v e R s u o e n a t n a t s n I Percent of Rated Peak Reverse Voltage (%) 0.2 FIG1:Io-Ta Curve 16040 80 120 0.4 0.6 0.8 1.0 1.2 ① ② soldering land 1mm×1mm 1mm×1mm conductor layer 35um 20u m substrate thickness 0.64m m ①.on glass-epoxi substrate ②.on alumina substrate Average Forward Output Current(A) Ambient Temperature(°C) 2 5 10 20 50 100 half sine wave non-repetitive Tj=25℃ FIG2:Surge Forward Current Capability Number of Cycles 0 8.3ms 1cycle IFSM 8.3ms d r a w r o F k a e P ) A ( t n e r r u C e g r u S SAM YANG HD01 --- HD10SAMYANG ELECTRONICS All d ata sheet.com
www.diode.co.kr ■ Outline Dimensions ■ Suggested pad layout Dim Min P1 6.00 P2 2.40 Q1 1.84 Q2 1.20 MBS Dim Min Max A 3.60 4.00 B 7.00 Max C 2.20 2.60 D 4.50 4.90 E 2.30 2.70 F 3.00 Max G 0.56 0.84 H 0.15 0.35 I 1.10 2.12 J 0.20 Max K 0.70 1.10 L 0.95 1.53 Dimensions in millimeters A B C D G H I J E F K L MBS Dimensions in millimeters SAM YANG HD01 --- HD10SAMYANG ELECTRONICS All d ata sheet.com