HD01 MCC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

Features

  • Surface Mount Package
  • Rating to 1000V PRV
  • Ideal for Printed Circuit Board
  • Lead tin Plated Copper Maximum Ratings MCC Catalog Number Device Marking Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage HD01 HD01 100V 70V 100V HD02 HD02 200V 140V 200V HD04 HD04 400V 280V 400V HD06 HD06 600V 420V 600V HD08 HD08 800V 560V 800V HD10 HD10 1000V 700V 1000V Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current I F(AV) 0.8 A TA = 40°C Peak Forward Surge Current I FSM 30A 8.3ms, half sine Maximum Instantaneous Forward Voltage V F 1.0V IFM = 0.4A; TA = 25°C Maximum DC Reverse Current At Rated DC Blocking Voltage I R 5µA 0.5mA TJ= 25°C TJ = 125°C Typical Junction Capacitance C J 15pF Measured at 1.0MHz, V R=4.0V *Pulse Test: Pulse Width 300µsec, Duty Cycle 1% HDDF Suggested Solder Pad Layout DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE D HC A E F B G /G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G01/G02 www.mccsemi.com MCC A .177 .193 4.50 4.90 B .091 .106 2.30 2.70 E .091 .106 2.30 2.70 D .142 .157 3.60 4.00 G .020 .031 0.50 0.80 H .028 .043 0.70 1.10 .030”MIN .023”MIN .105” .272”MAX /G01/G02/G03/G04/G05/G06/G07/G05/G08/G08/G09/G04/G03/G02/G0A/G0B/G06/G07omponents

21201 Itasca Street Chatsworth

/G07/G18/G06/G19/G0F/G1A/G0F/G0F /G1B/G15/G05/G1C/G09/G1D/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G1A /G24/G0A/G25/G1D/G06/G06/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G19 I I .006 .014 0.15 0.35 .095”

  • Operating Junction Temperature: -55°C to +150°C
  • Storage Temperature: -55°C to +150°C
  • Typical Thermal Resistance 75°C/W Junction to ambient