HCV1707 EATON | Alldatasheet

Document overview

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Technical content

High current power inductors Product features

  • Flat-wire construction
  • Low DCR, high efficiency
  • Secure 3 terminal mounting
  • 17 .8 mm x 14.35 mm footprint surface mount package in a 6.9 mm height
  • Ferrite core material
  • Moisture Sensitivity Level: 1

Applications

  • Compatible with Picor® Cool-Power® ZVS Buck and Buck-Boost Regulator Families Environmental data
  • Storage temperature range (Component): -55 °C to +125 °C
  • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant
  • Halogen free, lead free, RoHS compliant Pb HALOGEN HFFREE Picor® and Cool-Power® are trademarks of Vicor Corporation.

High current power inductors www.eaton.com/electronics Product specifications Part Number7 OCL1 (µH) ±10% FLL2 (µH) minimum Irms (A) Isat14 (A) Isat25 (A) Isat36 (A) DCR (mΩ) ±10% @ +20 °C HCV1707R1-R48-R 0.48 0.42 32 55 68 47 1.7 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, I sat1, +25 °C 3. I rms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat- ing components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. I sat1: Peak current for approximately 2% rolloff @ +25 °C 5. I sat2: Peak current for approximately 2% rolloff @ -55 °C 6. I sat3: Peak current for approximately 2% rolloff @ +125 °C 7. Part Number Definition: HCV1707Rx-Rxxx-R HCV1707= Product code and size Rx= Version indicator Rxx= Inductance value in μH, R= decimal point, If no R is present last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) Part marking: HCV1707Rx-Rxx, Rxx= inductance value in uH, R= decimal point, if no R is present last character equals number of zeros xxxx=lot code All soldering surface to be coplanar within 0.1 millimeters Tolerances are ±0.15 millimeters unless stated otherwise Pad layout tolerances are ±0.1 millimeters unless stated otherwise Pin NC is for mounting stability. No connection. Do not route traces or vias underneath the inductor Recommended Pad Layout Schematic Part marking: HCV1707Rx-Rxx, Rxx= inductance value in uH, R= decimal point, if no R is present last character equals number of zeros xxxx=lot code Soldering surfaces to be coplanar within 0.1 millimeters Pin NC is for mounting stability. No connection. 3.00 2.00 7.20 9.00 3.70 5.75 14.0 “0.35 17.3 “0.5 6.5 “0.4 7.8 “0.4 14.0 “0.5 2.4 “0.3 9.7 “0.5 1.5 “0.2 3.0 “0.2 HCV1707Rx-xxx xxxx 2.70 Do not route traces or vias underneath the inductor. Tolerances are “0.15 millimeters unless stated otherwise Pad layout tolerances are “0.1 millimeters unless stated otherwise NC

High current power inductors www.eaton.com/electronics Packaging information (mm) T emperature rise vs. total loss Supplied in tape and reel packaging , 350 parts per 13” diameter reel 0 10.5 2 32.5 Temper ature Rise (°C) 51. Power Loss (W)

High current power inductors www.eaton.com/electronics Inductance characteristics Ϭ ϭϬϬ ϮϬϬ ϯϬϬ ϰϬϬ ϱϬϬ ϲϬϬ Ϭϭ ϬϮ Ϭϯ Ϭϰ Ϭϱ Ϭϲ Ϭϳ Ϭϴ Ϭϵ Ϭ ϭϬϬ ϭϭϬ /ŶĚƵĐƚĂŶĐĞ;Ŷ,Ϳ /ĚĐ;Ϳ ,sϭϳϬϳZϭͲZϰϴͲZ ͲϱϱΣ нϮϱΣ нϭϮϱΣ

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 10712 BU-MC17044 September 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Technical Data 10712 Effective September 2017 HCV1707 High current power inductors Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100 °C 150 °C

  • Temperature max. (Tsmax) 150 °C 200 °C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3 °C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183 °C 60-150 Seconds 217 °C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6 °C/ Second Max. 6 °C/ Second Max. Time 25 °C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 <2.5mm) 235 °C 220 °C ≥2.5mm 220 °C 220 °C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260 °C 260 °C 260 °C 1.6 – 2.5mm 260 °C 250 °C 245 °C >2.5mm 250 °C 245 °C 245 °C