HCV1206 EATON | Alldatasheet

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Technical content

High current power inductors Product features

  • Flat-wire construction
  • Low DCR, high efficiency
  • Secure 3 terminal mounting
  • 12.7 mm x 10.15 mm footprint surface mount package in a 5.1 mm height
  • Ferrite core material

Applications

  • Compatible with Picor® Cool-Power® ZVS Buckand Buck-Boost Regulator Families (Picor part number series PI37xx and PI35xx) Environmental data
  • Storage temperature range (component): -55 °C to +125 °C
  • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE Picor® and Cool-Power® are trademarks of Vicor Corporation.

High current power inductors www.eaton.com/electronics Product Specifications Part Number4 OCL1 (μH) ±10% Irms (A) Isat (A) DCR (mΩ) @ +20 °C ±10% HCV1206-R42-R 0.42 16 42 3.15 HCV1206-R48-R 0.48 16 37 3.15 HCV1206-R90-R 0.90 14 28 4.6 HCV1206-1R0-R 1.0 14 24.5 4.6 HCV1206-1R5-R 1.5 12 21 6.0 HCV1206-2R0-R 2.0 12 16 6.0 HCV1206-3R0-R 3.0 11 13 7.4 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 3. Isat : Peak current for approximately 5% rolloff @ +25 °C 4. Part Number Definition: HCV1206-xxx-R HCV1206 = Product code and size xxx=Inductance value in μH, -R suffix = RoHS compliant Dimensions- mm Part marking: HCV1206–xxx, xxx=inductance value in μH, R=decimal point, wwllyy= date code, R=revision level Soldering surfaces to be coplanar within 0.1 millimeters Pin 3 is for mounting stability. No connection. Do not route traces or vias underneath the inductor. Recommended Pad Layout Schematic Packaging information- mm Supplied in tape and reel packaging, 550 parts per 13” diameter reel

High current power inductors www.eaton.com/electronics Inductance characteristics 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 % of OCL -55°C Idc (A) +125°C +25°C 30% 40% 50% 60% 70% 80% 90% 100% 110% 00 10 23 00 50 60 7 % of OCL -55°C +125°C +25°C 30% 40% 50% 60% 70% 80% 90% 100% 110% 013 00 4 05 06 % of OCL -55°C +125°C +25°C 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 % of OCL -55°C +125°C +25°C HCV1206-R42-R HCV1206-R48-R HCV1206-R90-R Idc (A) HCV1206-1R0-R II cdcd II cdcd (A) (A) 40 20

High current power inductors www.eaton.com/electronics Inductance characteristics 30% 40% 50% 60% 70% 80% 90% 100% 110% 10 15 20 25 30 35 -55°C +125°C +25°C 30% 40% 50% 60% 70% 80% 90% 100% 246 110% 08 10 12 14 16 18 20 22 24 -55°C +125°C +25°C 30% 40% 50% 60% 70% 80% 90% 100% 110% 06 81 01 21 41 61 82 02 22 4-55°C +125°C +25°C HCV1206-1R5-R % of OCL HCV1206-2R0-R HCV1206-3R0-R Idc (A) Idc (A)I dc (A) % of OCL % of OCL

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 10354-BU-SB15161 October 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. HVC1206 High current power inductors Technical Data 10354 Effective October 2017 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C