HCSM SEI | Alldatasheet

Document overview

  • Manufacturer or author: LCLOUD
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Technical content

Rev Date: 4/18/2022 1 www.seielect.com This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use. HCSM Series High Power Metal Element Current Shunt Resistor Stackpole Electronics, Inc. Resistive Product Solutions Features:

  • 5W power rating in a small chip size 2818 size
  • Excellent long-term stability
  • 100% RoHS compliant and lead free without exemption
  • Halogen free
  • AEC-Q200 compliant
  • REACH compliant Applications:
  • Power modules
  • Frequency converters
  • Inverter control
  • Power management
  • Current sensor for power hybrid sources Power Derating Curve: Operating temperature range of -55ºC to 170ºC. Storage condition: 5ºC ~ 35ºC, humidity of 40% ~ 75%. Mechanical Specifications Electrical Specifications Ohmic Range (Ω) and Tolerance 1% and 5% ± 100 0.002 (*) Other values may be available, but may require higher MOQ. Contact Stackpole. TCR (ppm/ºC) HCSM2818 5 Type/Code Power Rating (W) Type/Code Unit THL W

Rev Date: 4/18/2022 2 www.seielect.com This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use. HCSM Series High Power Metal Element Current Shunt Resistor Stackpole Electronics, Inc. Resistive Product Solutions Environmental Performance Characteristics Function Performance Characteristics Test Test Method Test Specification Test Condition Resistance to Solder Heat MIL-STD-202, Method 210 ΔR: ± (1% + 0.0005 Ω) Mount the chip to test substrate. Apply pressure in direction of arrow unit band width reaches 2 mm (+0.2 / -0 mm) illustrated in the picture below and hold for 10 ± 1 seconds. (JIS-C5202-6.1) Bending Strength ΔR: ± (1% + 0.0005 Ω)JIS-C5202-6.1 Verify marking permanency. (Not required for laser etched parts or parts with no marking). The chip is completely immersed in isopropyl alcohol for 3 (+5/-0) minutes at 25°C ± 5°C.Solvent Resistance MIL-STD-202, Method 215 The chip shall be immersed into the flux specified in the solder bath 260°C ± 5°C for 10 ± 1 seconds. Test Test Method Test Specification Test Condition Short Time Overload JIS-C5202-5.5 ΔR: ± (1% + 0.0005 Ω) 4 times rated power for 5 seconds +25ºC / +125ºC Operating temperature range is -55°C to +170°C The chip (mounted on board) is exposed, -55°C ± 3ºC (30 minutes) / +125 ± 2ºC (30 minutes) for 5 cycles. The following conditions as the figure below. Rapid Change of Temperature JIS-C5202-7.10 JIS-C5202-7.4 Load Life Apply rated power at 70°C ± 2°C for 1000 hours with 1.5 hours ON and 0.5 hour OFF. JIS-5202-5.2 Temperature Coefficient of Resistance (TCR) Refer to Electrical Specifications JIS-C5202-7.2 Damp Heat with Load The chip (mounted on board) is exposed in the heat chamber, 125ºC ± 3°C for 1000 hours High Temperature Exposure The specimens shall be placed in a chamber and subjected to a relative humidity of 90 ~ 95% and a temperature of 40°C ± 2°C for a period of 1000 hours with applied rated power, 1.5 hours ON and 0.5 hour OFF. MIL-STD-202 Method 103 ΔR R x Δt 10=TCR (ppm/ºC) x

Rev Date: 4/18/2022 3 www.seielect.com This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use. HCSM Series High Power Metal Element Current Shunt Resistor Stackpole Electronics, Inc. Resistive Product Solutions Function Performance Characteristics (cont.) Taping Specifications – Embossed Plastic Tape Recommended Pad Layouts Test Test Method Test Specification Test Condition JIS-C5202-6.11 The chip shall be immersed into the flux specified in the solder bath 235°C ± 5°C for 2 ± 0.5 seconds. It shall be immersed to a point 10mm from its root. (Sn96.5/Ag3.0/Cu0.5) Solderability Note: 5W with total solder pad trace size of 500 mm2. The surface temperature of component should be below 100°C. Solder shall cover 95% or more of the electrode area Type/Code Unit Unit t HCSM2818 P0 P1 P2 D0 D1 WA B E F Type/Code a b c d Unit 0.138 0.209 0.020 0.024 inches 3.50 5.30 0.50 0.60 mmHCSM2818

Rev Date: 4/18/2022 4 www.seielect.com This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use. HCSM Series High Power Metal Element Current Shunt Resistor Stackpole Electronics, Inc. Resistive Product Solutions Soldering Recommendations:

  • Peak reflow temperatures and durations ✓ IR Reflow Peak = 260ºC max for 10 seconds ✓ Wave Solder = 260ºC max for 10 seconds
  • Compatible with lead and lead-free solder reflow processes
  • Recommended IR reflow profile: RoHS Compliance Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the various regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances ” (RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the a vailability of our compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament as amended by Directive (EU) 2015/863/EU as regards the list of restricted substances. “Conflict Metals” Commitment We at Stackpole Electronics, Inc. are joined with our industry in opposing the use of metals mined in the “conflict region” of the eastern Democratic Republic of the Congo (DRC) in our products. Recognizing that the supply chain for metals used in the electronics industry is very complex, we work closely with our own suppliers to verify to the extent possible that the materials and products we s upply do not contain metals sourced from this conflict region. As such, we are in compliance with the requirements of Dodd-Frank Act regarding Conflict Minerals. Compliance to “REACH” We certify that all passive components supplied by Stackpole Electronics, Inc. are SVHC (Substances of Very High Concern) free and compliant with the requirements of EU Directive 1907/2006/EC, “The R egistration, Evaluation, Authorization and Restriction of Chemicals”, otherwise referred to as REACH. Contact us for complete list of REACH Substance Candidate List. RoHS Compliance Status HCSM High Current Shunt Resistor SMD YES 100% Copper Always Always Standard Product Series

Description

Mfg. Effective Date (Std Product Series) Lead-Free Effective Date Code (YY/WW)

Rev Date: 4/18/2022 5 www.seielect.com This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use. HCSM Series High Power Metal Element Current Shunt Resistor Stackpole Electronics, Inc. Resistive Product Solutions Environmental Policy It is the policy of Stackpole Electronics, Inc. (SEI) to protect the environment in all localities in which we operate. We continually strive to improve our effect on the environment. We observe all applicable laws and regulations regarding the protection of our environment and all requests related to the environment to which we have agreed. We are committed to the prevention of all forms of pollution. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 H C S M 2 8 1 8 F T 2 0 L 0 Code Tol Code Quantity F 1% T 3500 J 5% 0.004 ohm = 4L00 0.01 ohm = 10L0 Description Size Four characters with "L" used as multiplier of 10-3 for any value under 0.1 ohm 0.015 ohm = 15L0 281813" Reel - Plastic Tape HCSM Product Series Resistance ValueTolerance PackagingSize 2818 How to Order