HCSA1V1008 EATON | Alldatasheet

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Technical content

Automotive grade dual winding high current inductor Product features

  • AEC-Q200 qualified
  • Magnetically shielded, low EMI
  • Robust molded construction
  • Dual winding, ideal for SEPIC converters
  • Inductance range from 10 μH to 22 μH
  • Current range from 3.3 A to 11 .2 A
  • 11 .35 mm x 10.3 mm footprint surface mount package in a 8.2 mm height
  • Moisture sensitivity level (MSL): 1
  • Alloy powder core material

Applications

  • Body electronics
  • Heating ventilation and air conditioning controllers (HVAC)
  • Headlamps, tail lamps and interior lighting and LED lighting
  • Doors, window lift and seat control
  • Advanced driver assistance systems
  • Basic and smart surround, and rear and front - view camera
  • Adaptive cruise control (ACC)
  • Collision avoidance system
  • Car black box system
  • Infotainment and cluster electronics
  • Audio subsystem: head unit and trunk amp
  • Digital instrument cluster
  • In-vehicle infotainment (IVI) and navigation
  • Engine and powertrain systems
  • Diesel/gasoline engine management
  • Powertrain control module (PCM)/ engine control unit (ECU)
  • Transmission control unit (TCU) Environmental compliance and general specifications
  • Storage temperature range (Component): -55 °C to +155 °C
  • Operating temperature range: -55 °C to +155 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE

Automotive grade dual winding high current inductor www.eaton.com/electronics Part marking: xxx= inductance value in μH, R= decimal point, If no R is present then last character equals number of zeros yyyy= lot code All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are ±0.3 millimeters unless stated otherwise Pad layout tolerances are ±0.1 millimeters unless stated otherwise DCR is measured from point “a” to point “b” Traces or vias underneath the inductor is not recommended Dimensions- mm Product specifications Part number7 OCL1 (μH) ± 20% FLL2 (μH) minimum Irms (A) maximum Isat (A) maximum DCR (mΩ) typical @ +20 °C DCR (mΩ) maximum @ +20 °C Coupling coefficient (K) SCL (μH) typical5 SRF (MHz) typical K-factor6 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 V rms, 0.0 Adc, +25 °C, pins (1 - 3), (2 - 4) 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 V rms, Isat, , +25 °C, pins (1 - 3), (2 - 4) 3. Irms: DC current for an approximate temperature rise of 30 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +155 °C under worst case operating conditions verified in the end application. 4. Isat: Peak current for approximately 30% rolloff @ +25 °C, pins: (1 - 3), (2 - 4) 5. Short circuit inductance (SCL) test parametrs: 100 kHzs, 0.25 Vrms, 0.0 Adc, pins: (1 - 3) short pins (2 - 4) 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps). 7. Part Number Definition: HCSA1V1008-xxx-R HCSA1V1008 = Product code and size xxx= inductance value in μH, R= decimal point, If no R is present then last character equals number of zeros -R suffix = RoHS compliant Part number A B C D E F G H I J Schematic Recommended pad layout

Automotive grade dual winding high current inductor www.eaton.com/electronics Core loss vs Bp-p (per winding) Packaging information- mm Drawing not to scale Supplied in tape and reel packaging, 400 parts per 13” diameter reel (EIA-481 compliant) Dimension Value W 24 ± 0.3 F 11.50 ± 0.1 E1 1.75 ± 0.1 E2 22.25 min P0 4.0 ± 0.1 P1 16.0 ± 0.1 P2 2.0 ± 0.05 D0 1.5 +0.1 -0 D1 1.5 +0.1 -0 A0 10.7 ± 0.1 B0 11.65 ± 0.1 K0 8.50 ± 0.1 T 0.5 ± 0.05

Automotive grade dual winding high current inductor www.eaton.com/electronics Inductance and impedance vs. frequency (per winding) Inductance and temperature rise vs. current (per winding)

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Cleveland, OH 44122 United States Eaton.com/electronics © 2021 Eaton All Rights Reserved Printed in USA Publication No. ELX1085 BU-ELX21095 July 2021 Technical Data ELX1085 Effective July 2021 HCSA1V1008 Automotive grade dual winding high current inductor Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3 <350 Volume mm3 ≥350 <2.5 mm) 235 °C 220 °C ≥2.5 mm 220 °C 220 °C Table 2 - Lead (Pb) free solder (Tc) Package thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm 250 °C 245 °C 245 °C Temperature t tP ts TC -5 °C Time 25 °C to peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. ramp up rate = 3° C/s Max. ramp down rate = 6 °C/s Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information. Reference J-STD-020 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat and soak • Temperature min. (Tsmin) 100 °C 150 °C

  • Temperature max. (Tsmax) 150 °C 200 °C
  • Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Ramp up rate TL to Tp 3 °C/ second max. 3 °C/ second max. Liquidous temperature (Tl) Time (tL) maintained above TL 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)* within 5 °C of the specified classification temperature (T c) 20 seconds* 30 seconds* Ramp-down rate (Tp to TL) 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.