HCPL-0530

HCPL2530 HP | Alldatasheet

Document overview

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Technical content

Features

• 15 kV/µs Minimum Common Mode Transient Immunity at V CM = 1500 V (HCPL-4534/0534)
• High Speed: 1 Mb/s
• TTL Compatible
• Available in 8 Pin DIP, SO-8, and 8 Pin DIP – Gull Wing Surface Mount (Option 020) Packages
• High Density Packaging
• 3 MHz Bandwidth
• Open Collector Outputs
• Guaranteed Performance from 0 °C to 70°C
• Safety Approval UL Recognized – 2500 V rms for 1 minute (5000 V rms for 1 minute for Option 020) per UL1577 CSA Approved
• Single Channel Version Available (4502/3, 0452/3)
• MIL-STD-1772 Version Available (55XX/65XX/4N55) Functional Diagram

Applications

• Line Receivers – High Common Mode Transient Immunity (>1000 V/µs) and Low Input-Output Capacitance (0.6 pF)
• High Speed Logic Ground Isolation – TTL/TTL, TTL/ LTTL, TTL/CMOS, TTL/LSTTL
• Replace Pulse Transformers – Save Board Space and Weight
• Analog Signal Ground Isolation – Integrated Photon Detector Provides Improved Linearity over Phototransistor Type
• Polarity Sensing
• Isolated Analog Amplifier – Dual Channel Packaging Enhances Thermal Tracking CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. A 0.1 µF bypass capacitor between pins 5 and 8 is recommended. 4 5 8ANODE 1 CATHODE 1 CATHODE 2 ANODE 2 VCC VO1 VO2 GND TRUTH TABLE (POSITIVE LOGIC) LED ON OFF VO LOW HIGH

Description

These dual channel optocouplers contain a pair of light emitting diodes and integrated photodetec- tors with electrical insulation between input and output. Separate connection for the photodiode bias and output transistor collectors increase the speed up to a hundred times that of a conventional phototransistor coupler by reducing the base- collector capacitance.

These dual channel optocouplers are available in an 8 Pin DIP and in an industry standard SO-8 package. The following is a cross reference table listing the 8 Pin DIP part number and the electrically equivalent SO-8 part number. SO-8

8 Pin DIP Package

“through holes” in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. The HCPL-2530/0530 is for use in TTL/CMOS, TTL/LSTTL or wide bandwidth analog applications. Current transfer ratio (CTR) for the HCPL-2530/0530 is 7% minimum at I F = 16 mA. The HCPL-2531/0531 is designed for high speed TTL/TTL applications. A standard 16 mA TTL sink current through the input LED will provide enough output current for 1 TTL load and a 5.6 kΩ pull-up resistor. CTR of the HCPL-2531/0531 is 19% minimum at I F = 16 mA. The HCPL-4534/0534 is an HCPL-2531/0531 with increased common mode transient immunity of 15,000 V/µs minimum at V CM = 1500 V guaranteed. Selection Guide Widebody Minimum CMR 8-pin DIP (300 Mil) Small-Outline SO-8 (400 Mil) Hermetic Current Dual Single Dual Single Single Single and dV/dt V CM Transfer Channel Channel Channel Channel Channel Dual Channel (V/µs) (V) Ratio (%) Package Package* Package Package* Package* Packages* 1,000 10 7 HCPL-2530 6N135 HCPL-0530 HCPL-0500 HCNW135

19 HCPL-2531 6N136 HCPL-0531 HCPL-0501 HCNW136

HCPL-4502 HCPL-0452 HCNW4502 15,000 1500 19 HCPL-4534 HCPL-4503 HCPL-0534 HCPL-0453 HCNW4503 1,000 10 9 HCPL-55XX HCPL-65XX 4N55 *Technical data for these products are on separate HP publications.

Ordering Information

Specify Part Number followed by Option Number (if desired). Example: HCPL-2531#XXX 020 = UL 5000 V rms/1 Minute Option* 300 = Gull Wing Surface Mount Option† 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information. *For HCPL-2530/1 and HCPL-4534 only. †Gull wing surface mount option applies to through hole parts only. Schematic IF1 HCPL-4534/0534 SHIELD VCC VO1 ICC VF1 IO1 IF2 GND VO2 VF2 IO2 USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED.

8-Pin DIP Package (HCPL-2530/2531/4534) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2530/2531/4534) 0.635 ± 0.25 (0.025 ± 0.010) 12° NOM. 9.65 ± 0.25 (0.380 ± 0.010) 0.635 ± 0.130 (0.025 ± 0.005) 7.62 ± 0.25 (0.300 ± 0.010) 5678 4321 9.65 ± 0.25 (0.380 ± 0.010) 6.350 ± 0.25 (0.250 ± 0.010) 1.016 (0.040) 1.194 (0.047) 1.194 (0.047) 1.778 (0.070) 9.398 (0.370) 9.906 (0.390) 4.826 (0.190) TYP. 0.381 (0.015) 0.635 (0.025) PAD LOCATION (FOR REFERENCE ONLY) 1.080 ± 0.320 (0.043 ± 0.013) 4.19 (0.165)MAX. 1.780 (0.070) MAX.1.19 (0.047) MAX. 2.54 (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 0.254+ 0.076 - 0.051 (0.010+ 0.003) - 0.002) 9.65 ± 0.25 (0.380 ± 0.010) HP XXXXZ YYWW DATE CODE 1.080 ± 0.320 (0.043 ± 0.013) 2.54 ± 0.25 (0.100 ± 0.010) 0.51 (0.020) MIN. 0.65 (0.025) MAX. 4.70 (0.185) MAX. 2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS AND (INCHES). 5678 4321 5° TYP. OPTION CODE* UL RECOGNITION UR 0.254+ 0.076 - 0.051 (0.010+ 0.003) - 0.002) 7.62 ± 0.25 (0.300 ± 0.010) 6.35 ± 0.25 (0.250 ± 0.010)TYPE NUMBER * MARKING CODE LETTER FOR OPTION NUMBERS. "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED.

Small Outline SO-8 Package (HCPL-0530/0531/0534) Note: Use of nonchlorine activiated fluxes is highly recommended. 240 ΔT = 115°C, 0.3°C/SEC ΔT = 100°C, 1.5°C/SEC ΔT = 145°C, 1°C/SEC TIME – MINUTES TEMPERATURE – °C 220 200 180 160 140 120 100 260 12 3 456789 1 0 1 1 1 2 Solder Reflow Temperature Profile (HCPL-0530/0531/0534 and Gull Wing Surface Mount Option Parts) Regulatory Information The devices contained in this data sheet have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. XXX YWW 8765 4321 5.994 ± 0.203 (0.236 ± 0.008) 3.937 ± 0.127 (0.155 ± 0.005) 0.406 ± 0.076 (0.050)BSG 5.080 ± 0.127 (0.200 ± 0.005) 3.175 ± 0.127 (0.060) 45° X 0.432 (0.017) 0.228 ± 0.025 (0.009 ± 0.001) TYPE NUMBER (LAST 3 DIGITS) DATE CODE 0.305 (0.012)MIN. TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. 0.203 ± 0.102 (0.008 ± 0.004) PIN ONE 0 ~ 7°

Parameter Symbol Device Min. Max. Units Note Storage Temperature T S -55 125 °C Operating Temperature T A -55 100 °C Average Forward Input Current I F(AVG) 25 mA (each channel) Peak Forward Input Current (each channel) I F(PEAK) 50 mA (50% duty cycle, 1 ms pulse width) Peak Transient Input Current (each channel) I F(TRANS) 1A (≤ 1 µs pulse width, 300 pps) Reverse LED Input Voltage (each channel) V R 5V Input Power Dissipation (each channel) P IN 45 mW Average Output Current (each channel) I O(AVG) 8m A Peak Output Current I O(PEAK) 16 mA Supply Voltage (Pin 8-5) V CC -0.5 30 V Output Voltage (Pins 7-5, 6-5) V O -0.5 20 V Output Power Dissipation (each channel) P O 35 mW 13 Lead Solder Temperature (Through-Hole Parts Only) 1.6 mm below seating plane, 10 seconds T LS 8 Pin DIP 260 °C Reflow Temperature Profile T RP SO-8 and Option 300 Insulation and Safety Related Specifications 8-Pin DIP (300 Mil) SO-8 Parameter Symbol Value Value Units Conditions Minimum External L(101) 7.1 4.9 mm Measured from input terminals to output to Air Gap (External to output terminals, shortest distance through Clearance) air. Minimum External L(102) 7.4 4.8 mm Measured from input terminals to output Tracking (External terminals, shortest distance path along body. Creepage) Minimum Internal 0.08 0.08 mm Through insulation distance, conductor to Plastic Gap conductor, usually the direct distance (Internal Clearance) between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA mm Measured from input terminals to output Tracking (Internal terminals, along internal cavity. Creepage) Tracking Resistance CTI 200 200 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance with CECC 00802. See Package Outline Drawings section

Electrical Specifications (DC) Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. See note 9. Current CTR HCPL-2530/ 7 18 50 % T A = 25°CI F = 16 mA, 1, 2 1, 2 Transfer 0530 V CC = 4.5 V 4 Ratio 5 V O = 0.5 V HCPL-2531/ 19 24 50 % T A = 25°C 0531 HCPL-4534/ 15 0534 Logic Low V OL HCPL-2530/ 0.1 0.5 V T A = 25°CI O = 1.1 mA I F = 16 mA, 1 1 Output 0530 V CC = 4.5 V Voltage 0.5 I O = 0.8 mA HCPL-2531/ 0.1 0.5 V T A = 25°CI O = 3.0 mA 0531 HCPL-4534/ 0.5 I O = 2.4 mA 0534 Logic High I OH 0.003 0.5 µAT A = 25°CV O = Open I F = 0 mA 6 1 Output V CC = 5.5 V Current

50 T A = 25°CV O = Open

VCC = 15.0 V Logic Low I CCL 100 400 µAI F = 16 mA, VO = Open, Supply V CC = 15 V Current Logic High I CCH 0.05 4 µAI F = 0 mA, VO = Open, Supply V CC = 15 V Current Input V F 1.5 1.7 V T A = 25°C3 1 Forward I F = 16 mA Voltage 1.8 Input BV R 5V I R=10 µA1 Reverse Breakdown Voltage Temperature Δ VF -1.6 mV/ I F = 16 mA Coefficient Δ TA °C of Forward Voltage Input C IN 60 pF f = 1 MHz, V F = 0 V 1 Capacitance *All typicals at TA = 25°C.

Input-Output V ISO 2500 V rms RH < 50%, 3, 10 Momentary With- t = 1 min., stand Voltage** Resistance R I-O 1012 Ω RH ≤ 45% 3 (Input-Output) V I-O = 500 Vdc, t = 5 s Capacitance C I-O 0.6 pF f = 1 MHz, 12 (Input-Output) T A = 25°C Input-Input I I-I 0.005 µA RH ≤ 45%, 4 Insulation t = 5 s, Leakage Current V I-I = 500 Vdc Resistance R I-I 1011 Ω 4 (Input-Input) Capacitance C I-I HCPL-2530/ 0.03 pF f = 1 MHz 4 (Input-Input) 2531/4534 HCPL-0530/ 0.25 *All typicals at TA = 25°C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication number 5963-2203E. Device Propagation t PHL 2530/0530 0.2 1.5 µsT A = 25°CR L = 4.1 kΩ 5, 9, 6, 7 Delay Time 2.0 11 to Logic Low 2531/0531/ 0.2 0.8 T A = 25°CR L = 1.9 kΩ at Output 4534/0534 1.0 Propagation t PLH 2530/0530 1.3 1.5 µsT A = 25°CR L = 4.1 kΩ 5, 9, 6, 7 Delay Time 2.0 11 High to Logic 2531/0531/ 0.6 0.8 T A = 25°CR L = 1.9 kΩ at Output 4534/0534 1.0 Common |CM H| 2530/0530 1 10 kV/ µsR L = 4.1 kΩ IF = 0 mA, 10 5, 6, Mode Transient 2531/0531 1 10 R L = 1.9 kΩ TA = 25°C, 7 Immunity at 4534/0534 15 30 R L = 1.9 kΩ VCM = 10 Vp-p Logic High Level Output Common |CM L| 2530/0530 1 10 kV/ µsR L = 4.1 kΩ IF = 0 mA, 10 5, 6, Mode Transient 2531/0531 1 10 R L = 1.9 kΩ TA = 25°C, 7 Immunity at 4534/0534 15 30 R L = 1.9 kΩ VCM = 10 Vp-p Logic Low Level Output Bandwidth BW 3 MHz R L = 100 kΩ 7, 8 *All typicals at TA = 25°C. Switching Specifications (AC) Over recommended temperature (TA = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specified. HCPL-2530/ Option 020 3, 115000

Figure 4. Current Transfer Ratio vs. Figure 5. Propagation Delay vs. Figure 6. Logic High Output Current vs. Figure 8. Frequency Response. Figure 7. Small-Signal Current Transfer Ratio vs. Quiescent Input Current.

1.6 V dc

0.25 Vp-p ac

Figure 11. Propagation Delay Time vs. Load Resistance. Figure 10. Test Circuit for Transient Immunity and Typical Waveforms. Figure 9. Switching Test Circuit.

5 V 10% DUTY CYCLE

For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright © 1998 Hewlett-Packard Co. Obsoletes 5966-1272E Printed in U.S.A. 5968-1090E (7/98) www.hp.com/go/isolator