HCPL-0501

6N135 HP | Alldatasheet

Document overview

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Technical content

Features

• 15 kV/µs Minimum Common Mode Transient Immunity at V CM = 1500 V (4503/0453)
• High Speed: 1 Mb/s
• TTL Compatible
• Available in 8-Pin DIP, SO-8, Widebody Packages
• Open Collector Output
• Guaranteed Performance from Temperature: 0 to 70°C
• Safety Approval UL Recognized – 3750 V rms for 1 minute (5000 V rms for 1 minute for HCNW and Option 020 devices) per UL1577 CSA Approved IEC/EN/DIN EN 60747-5-2 Approved IORM = 630 V peak for HCPL-4503#060 –VIORM = 1414 V peak for HCNW devices
• Dual Channel Version Available (253X/4534/053X/ 0534)
• MIL-PRF-38534 Hermetic Version Available (55XX/ 65XX/4N55)

Applications

• High Voltage Insulation
• Video Signal Isolation
• Power Transistor Isolation in Motor Drives
• Line Receivers
• Feedback Element in Switched Mode Power Supplies
• High Speed Logic Ground Isolation – TTL/TTL, TTL/ CMOS, TTL/LSTTL
• Replaces Pulse Transformers
• Replaces Slow Phototransistor Isolators
• Analog Signal Ground Isolation

Description

These diode-transistor optocoup- lers use an insulating layer between a LED and an integrated photodetector to provide elec- trical insulation between input and output. Separate connections for the photodiode bias and output-transistor collector increase the speed up to a hundred times that of a conven- tional phototransistor coupler by reducing the base-collector capacitance. Functional Diagram 6N135/6 HCNW135/6 HCNW4502/3 HCPL-2502 HCPL-0452/3 HCPL-0500/1 HCPL-4502/3 CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. A 0.1 µF bypass capacitor must be connected between pins 5 and 8. 4 5 8NC ANODE CATHODE NC VCC VB VO GND * NOTE: FOR 4502/3, 0452/3, PIN 7 IS NOT CONNECTED. TRUTH TABLE (POSITIVE LOGIC) LED ON OFF VO LOW HIGH

• NOTE: FOR HCPL-4502/-3, HCPL-0452/3, HCNW4502/3, PIN 7 IS NOT CONNECTED.

Ordering Information

Specify Part Number followed by Option Number (if desired). Example: HCPL-4503#XXXX 020 = UL 5000 V rms/1 Minute Option* 060 = IEC/EN/DIN EN 60747-5-2 V IORM = 630 V peak Option** 300 = Gull Wing Surface Mount Option† 500 = Tape and Reel Packaging Option XXXE = Lead Free Option Option data sheets available. Contact your Agilent sales representative or authorized distributor for information. *For 6N135/6 and HCPL-4502/3 only. **For HCPL-4503 only. Combination of Option 020 and Option 060 is not available. †Gull wing surface mount option applies to through hole parts only. Schematic Selection Guide Widebody Minimum CMR 8-Pin DIP (300 Mil) Small-Outline SO-8 (400 Mil) Hermetic Current Single Dual Single Dual Single Single and dV/dt V CM Transfer Channel Channel Channel Channel Channel Dual Channel (V/µs) (V) Ratio (%) Package Package* Package Package* Package Packages* 1,000 10 7 6N135 HCPL-2530 HCPL-0500 HCPL-0530 HCNW135 19 6N136 HCPL-2531 HCPL-0501 HCPL-0531 HCNW136 HCPL-4502† HCPL-0452† HCNW4502†

15 HCPL-2502

15,000 1500 19 HCPL-4503† HCPL-4534 HCPL-0453† HCPL-0534 HCNW4503† 1,000 10 9 HCPL-55XX HCPL-65XX 4N55 *Technical data for these products are on separate Agilent publications. †Pin 7, transistor base, is not connected. output current for 1 TTL load and a 5.6 kΩ pull-up resistor. CTR for these devices is 19% minimum at I F = 16 mA. The HCPL-4502, HCPL-0452, and HCNW4502 provide the electrical and switching performance of the 6N136, HCPL-0501, and HCNW136 with increased ESD protection. The HCPL-4503, HCPL-0453, and HCNW4503 are similar to the HCPL-4502, HCPL-0452, and HCNW4502 optocouplers but have increased common mode transient immunity of 15 kV/µs minimum at V CM = 1500 V guaranteed. These single channel optocoup- lers are available in 8-Pin DIP, SO-8 and Widebody package configurations. The 6N135, HCPL-0500, and HCNW135 are for use in TTL/ CMOS, TTL/LSTTL or wide bandwidth analog applications. Current transfer ratio (CTR) for these devices is 7% minimum at I F = 16 mA. The 6N136, HCPL-2502, HCPL-0501, and HCNW136 are designed for high speed TTL/TTL applications. A standard 16 mA TTL sink current through the input LED will provide enough Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use “-”

8-Pin DIP Package (6N135/6, HCPL-4502/3, HCPL-2502) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N135/6, HCPL-4502/3) 1.080 ± 0.320 (0.043 ± 0.013) 2.54 ± 0.25 (0.100 ± 0.010) 0.51 (0.020) MIN. 0.65 (0.025) MAX. 4.70 (0.185) MAX. 2.92 (0.115) MIN. 5° TYP. 0.254+ 0.076 - 0.051 (0.010+ 0.003) - 0.002) 7.62 ± 0.25 (0.300 ± 0.010) 6.35 ± 0.25 (0.250 ± 0.010) 9.65 ± 0.25 (0.380 ± 0.010) A XXXXZ YYWW DATE CODE DIMENSIONS IN MILLIMETERS AND (INCHES). 5678 4321 OPTION CODE* UL RECOGNITION UR TYPE NUMBER *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 3.56 ± 0.13 (0.140 ± 0.005) 0.635 ± 0.25 (0.025 ± 0.010) 12° NOM. 9.65 ± 0.25 (0.380 ± 0.010) 0.635 ± 0.130 (0.025 ± 0.005) 7.62 ± 0.25 (0.300 ± 0.010) 5678 4321 9.65 ± 0.25 (0.380 ± 0.010) 6.350 ± 0.25 (0.250 ± 0.010) 1.016 (0.040) 1.27 (0.050) 10.9 (0.430) 2.0 (0.080) LAND PATTERN RECOMMENDATION 1.080 ± 0.320 (0.043 ± 0.013) 3.56 ± 0.13 (0.140 ± 0.005) 1.780 (0.070) MAX.1.19 (0.047) MAX. 2.54 (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 0.254+ 0.076 - 0.051 (0.010+ 0.003) - 0.002)

Small Outline SO-8 Package (HCPL-0500/1, HCPL-0452/3) 8-Pin Widebody DIP Package (HCNW135/6, HCNW4502/3) XXX YWW 8765 4321 5.994 ± 0.203 (0.236 ± 0.008) 3.937 ± 0.127 (0.155 ± 0.005) 0.406 ± 0.076 (0.050)BSC 5.080 ± 0.127 (0.200 ± 0.005) 3.175 ± 0.127 (0.060) 45° X 0.432 (0.017) 0.228 ± 0.025 (0.009 ± 0.001) TYPE NUMBER (LAST 3 DIGITS) DATE CODE 0.305 (0.012)MIN. TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. 0.203 ± 0.102 (0.008 ± 0.004) PIN ONE 0 ~ 7° 7.49 (0.295) 1.9 (0.075) 0.64 (0.025) LAND PATTERN RECOMMENDATION 5678 4321 11.15 ± 0.15 (0.442 ± 0.006) 1.78 ± 0.15 (0.070 ± 0.006) 5.10 (0.201)MAX. 1.55 (0.061) MAX. 2.54 (0.100) TYP. DIMENSIONS IN MILLIMETERS (INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 7° TYP. 0.254+ 0.076 - 0.0051 (0.010+ 0.003) - 0.002) 11.00 (0.433) 9.00 ± 0.15 (0.354 ± 0.006) MAX. 10.16 (0.400) TYP. A HCNWXXXX YYWW DATE CODE TYPE NUMBER 0.51 (0.021) MIN. 0.40 (0.016) 0.56 (0.022) 3.10 (0.122) 3.90 (0.154)

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6, HCNW4502/3) Solder Reflow Temperature Profile TIME (SECONDS) TEMPERATURE ( °C)200 100 50 150 100 200 250 300 SEC. 50 SEC. SEC. 160°C 140°C 150°C PEAK TEMP. 245°C PEAK TEMP. 240°C PEAK TEMP. 230°C SOLDERING TIME 200°C PREHEATING TIME 150°C, 90 + 30 SEC. 2.5°C ± 0.5°C/SEC. 3°C + 1°C/–0.5°C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3 °C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5 °C ± 0.5°C/SEC. 1.00 ± 0.15 (0.039 ± 0.006) 7° NOM. 12.30 ± 0.30 (0.484 ± 0.012) 0.75 ± 0.25 (0.030 ± 0.010) 11.00 (0.433) 5678 4321 11.15 ± 0.15 (0.442 ± 0.006) 9.00 ± 0.15 (0.354 ± 0.006) 1.3 (0.051) 13.56 (0.534) 2.29 (0.09) LAND PATTERN RECOMMENDATION 1.78 ± 0.15 (0.070 ± 0.006) 4.00 (0.158)MAX. 1.55 (0.061) MAX. 2.54 (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 0.254+ 0.076 - 0.0051 (0.010+ 0.003) - 0.002) MAX.

The devices contained in this data sheet have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. Insulation and Safety Related Specifications 8-Pin DIP Widebody (300 Mil) SO-8 (400 Mil) Parameter Symbol Value Value Value Units Conditions Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals Air Gap (External to output terminals, shortest Clearance) distance through air. Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals Tracking (External to output terminals, shortest Creepage) distance path along body. Minimum Internal 0.08 0.08 1.0 mm Through insulation distance, Plastic Gap conductor to conductor, usually (Internal Clearance) the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA 4.0 mm Measured from input terminals Tracking (Internal to output terminals, along Creepage) internal cavity. Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance with CECC 00802. IEC/EN/DIN EN 60747-5-2 Approved under IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (HCNW and Option 060 only) Recommended Pb-Free IR Profile 217 °C RAMP-DOWN 6 °C/SEC. MAX. RAMP-UP 3 °C/SEC. MAX. 150 - 200 °C 260 +0/-5 °C t 25 °C to PEAK 60 to 150 SEC. 20-40 SEC. TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE tp ts PREHEAT 60 to 180 SEC. tL TL Tsmax Tsmin Tp TIME TEMPERATURE NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C

IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCPL-4503 OPTION 060 ONLY) Description Symbol Characteristic Units Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 300 V rms I-IV for rated mains voltage ≤ 450 V rms I-III Climatic Classification 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 Maximum Working Insulation Voltage V IORM 630 V peak Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with t m = 1 sec, V PR 1181 V peak Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and sample test, V PR 945 V peak tm = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, t ini = 10 sec) V IOTM 6000 V peak Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 9, Thermal Derating curve.) Case Temperature T S 175 °C Input Current I S,INPUT 230 mA Output Power P S,OUTPUT 600 mW Insulation Resistance at TS, VIO = 500 V R S ≥ 109 Ω IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW135/6, HCNW4502/3 ONLY) Description Symbol Characteristic Units Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 600 V rms I-IV for rated mains voltage ≤ 1000 V rms I-III Climatic Classification 55/85/21 Pollution Degree (DIN VDE 0110/1.89) 2 Maximum Working Insulation Voltage V IORM 1414 V peak Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with t m = 1 sec, V PR 2652 V peak Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and sample test, V PR 2121 V peak tm = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, t ini = 10 sec) V IOTM 8000 V peak Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 9, Thermal Derating curve.) Case Temperature T S 150 °C Input Current I S,INPUT 400 mA Output Power P S,OUTPUT 700 mW Insulation Resistance at TS, VIO = 500 V R S ≥ 109 Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circu its in application.

Parameter Sy mbol Device Min. Max. Units Note Storage Temperature* T S -55 125 °C Operating Temperature* T A 8-Pin DIP -55 100 °C SO-8 Widebody -55 85 Average Forward Input Current* I F(AVG) 25 mA 1 Peak Forward Input Current* I F(PEAK) 8-Pin DIP 2 (50% duty cycle, 1 ms pulse width) SO-8 50 mA (50% duty cycle, 1 ms pulse width) Widebody 40 Peak Transient Input Current* I F(TRANS) 8-Pin DIP 1 A (≤ 1 µs pulse width, 300 pps) SO-8 Widebody 0.1 Reverse LED Input Voltage* (Pin 3-2) V R 8-Pin DIP 5 V SO-8 Widebody 3 Input Power Dissipation* P IN 8-Pin DIP 45 mW 3 SO-8 Widebody 40 Average Output Current* (Pin 6) I O(AVG) 8m A Peak Output Current* I O(PEAK) 16 mA Emitter-Base Reverse Voltage* V EBR 5V (Pin 5-7, except 4502/3, 0452/3) Supply Voltage (Pin 8-5) V CC -0.5 30 V Output Voltage (Pin 6-5) V O -0.5 20 V Supply Voltage* (Pin 8-5) V CC -0.5 15 V Output Voltage* (Pin 6-5) V O -0.5 15 V Base Current* (Pin 7, except 4502/3, 0452/3) I B 5m A Output Power Dissipation* P O 100 mW 4 Lead Solder Temperature* (Through-Hole Parts Only) 1.6 mm below seating plane, 10 seconds T LS 8-Pin DIP 260 °C up to seating plane, 10 seconds Widebody 260 °C Reflow Temperature Profile T RP SO-8 and Option 300 *Data has been registered with JEDEC for the 6N135/6N136. See Package Outline Drawings section

Parameter Symbol Device Min. Typ.** Max. Units Test Conditions Fig. Note Current CTR* 6N135 7 18 50 % T A = 25°CV O = 0.4 V I F = 16 mA, 1, 2, 5, 11 Transfer Ratio HCPL-0500 V CC = 4.5 V 4 HCNW135 5 19 V O = 0.5 V HCPL-2502 15 22 T A = 25°CV O = 0.4 V 15 25 V O = 0.5 V 6N136 19 24 50 T A = 25°CV O = 0.4 V HCPL-4502/3 HCPL-0501 15 25 V O = 0.5 V HCPL-0452/3 HCNW136 HCNW4502/3 Logic Low V OL 6N135 0.1 0.4 V T A = 25°CI O = 1.1 mA I F = 16 mA, Output Voltage HCPL-0500 V CC = 4.5 V HCNW135 0.1 0.5 I O = 0.8 mA 6N136 0.1 0.4 T A = 25°CI O = 3.0 mA HCPL-2502 HCPL-4502/3 0.1 0.5 I O = 2.4 mA HCPL-0501 HCPL-0452/3 HCNW136 HCNW4502/3 Logic High I OH* 0.003 0.5 µAT A = 25°CV O = VCC = 5.5 V I F = 0 mA 7 Output Current 0.01 1 T A = 25°CV O = VCC = 15 V

50 V O = VCC = 15 V

Logic Low I CCL 50 200 µAI F = 16 mA, VO = Open, VCC = 15 V 13 Supply Current Logic High I CCH* 0.02 1 µAT A = 25°CI F = 16 mA, VO = Open, 13 Supply Current 2 V CC = 15 V Input Forward V F* 8-Pin DIP 1.5 1.7 V T A = 25°CI F = 16 mA 3 Voltage SO-8 1.8 Widebody 1.45 1.68 1.85 T A = 25°CI F = 16 mA 1.35 1.95 Input Reverse BV R* 8-Pin DIP 5 V I R = 10 µA Breakdown SO-8 Voltage Widebody 3 I R = 100 µA Temperature ∆ VF/ 8-Pin DIP -1.6 mV/ °CI F = 16 mA Coefficient of ∆ TA SO-8 Forward Voltage Widebody -1.9 Input C IN 8-Pin DIP 60 pF f = 1 MHz, V F = 0 V Capacitance SO-8 Widebody 90 Transistor DC h FE 8-Pin DIP 150 V O = 5 V , IO = 3 mA Current Gain SO-8 130 V O = 0.4 V , IB = 20 µA Widebody 180 V O = 5 V , IO = 3 mA 160 V O = 0.4 V , IB = 20 µA *For JEDEC registered parts. **All typicals at TA = 25°C. Electrical Specifications (DC) Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. See note 13.

Propagation t PHL* 6N135 0.2 1.5 µsT A = 25°CR L = 4.1 kΩ 5, 6, 8, 9 HCPL-0500 2.0 11 HCNW135 6N136 0.2 0.8 T A = 25°CR L = 1.9 kΩ HCPL-2502 HCPL-4502/3 HCPL-0501 HCPL-0452/3 1.0 HCNW136 HCNW4502/3 Propagation t PLH* 6N135 1.3 1.5 µsT A = 25°CR L = 4.1 kΩ 5, 6, 8, 9 HCPL-0500 2.0 11 HCNW135 6N136 0.6 0.8 T A = 25°CR L = 1.9 kΩ HCPL-2502 HCPL-4502/3 HCPL-0501 HCPL-0452/3 1.0 HCNW136 HCNW4502/3 Common Mode |CM H| 6N135 1 kV/ µsR L = 4.1 kΩ IF = 0 mA, TA = 25°C, 12 7, 8, HCPL-0500 V CM = 10 Vp-p 9 HCNW135 C L = 15 pF 6N136 1 R L = 1.9 kΩ HCPL-2502 HCPL-4502 HCPL-0501 HCPL-0452 HCNW4502 HCPL-4503 15 30 R L = 1.9 kΩ IF = 0 mA, TA = 25°C, HCPL-0453 V CM = 1500 Vp-p, HCNW4503 C L = 15 pF Common Mode |CM L| 6N135 1 kV/ µsR L = 4.1 kΩ IF = 16 mA, TA = 25°C, 12 7, 8, HCPL-0500 V CM = 10 Vp-p 9 HCNW135 C L = 15 pF 6N136 1 R L = 1.9 kΩ HCPL-2502 HCPL-4502 HCPL-0501 HCPL-0452 HCNW4502 HCPL-4503 15 30 R L = 1.9 kΩ IF = 16 mA, TA = 25°C, HCPL-0453 V CM = 1500 Vp-p, HCNW4503 C L = 15 pF Bandwidth BW 6N135/6 9 MHz See Test Circuit 8, 10 10 HCPL-2502 HCPL-0500/1 HCNW135/6 11 *For JEDEC registered parts. **All typicals at TA = 25°C. Switching Specifications (AC) Over recommended temperature (TA = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specified. Delay Time to Logic Low at Output Delay Time to Logic High at Output Transient Immunity at Logic High Level Output Transient Immunity at Logic Low Level Output

Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. Input-Output V ISO 8-Pin DIP 3750 V rms RH < 50%, 6, 14 Momentary SO-8 t = 1 min., Withstand T A = 25°C Voltage** 8-Pin DIP 5000 6, 12, (Option 020) 15 II-O 8-Pin DIP 1 µA 45% RH, t = 5 s, 6, 16 VI-O = 3 kVdc, TA = 25°C Input-Output R I-O 8-Pin DIP 10 12 Ω VI-O = 500 Vdc 6 Resistance SO-8 Widebody 10 12 1013 TA = 25°C

1011 TA = 100°C

Input-Output C I-O 8-Pin DIP 0.6 pF f = 1 MHz 6 Capacitance SO-8 Widebody 0.5 0.6 *All typicals at TA = 25°C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteri stics Table (if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-O utput Endurance Voltage,” publication number 5963-2203E. Widebody 5000 Notes: 1. Derate linearly above 70 °C free-air temperature at a rate of 0.8 mA/°C (8-Pin DIP). Derate linearly above 85°C free-air temperature at a rate of 0.5 mA/°C (SO-8). 2. Derate linearly above 70 °C free-air temperature at a rate of 1.6 mA/°C (8-Pin DIP). Derate linearly above 85°C free-air temperature at a rate of 1.0 mA/°C (SO-8). 3. Derate linearly above 70 °C free-air temperature at a rate of 0.9 mW/°C (8-Pin DIP). Derate linearly above 85°C free-air temperature at a rate of 1.1 mW/°C (SO-8). 4. Derate linearly above 70 °C free-air temperature at a rate of 2.0 mW/°C (8-Pin DIP). Derate linearly above 85°C free-air temperature at a rate of 2.3 mW/°C (SO-8). 5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, I O, to the forward LED input current, IF, times 100. 6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dV CM/dt on the leading edge of the common mode pulse signal, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM/dt on the trailing edge of the common mode pulse signal, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 10. The frequency at which the ac output voltage is 3 dB below its mid-frequency value. 11. The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. Agilent guarantees a minimum CTR of 19%. 12. See Option 020 data sheet for more information. 13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended. 14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second (leakage detection current limit, I I-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table if applicable. 15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table if applicable. 16. This rating is equally validated by an equivalent ac proof test. 6, 15

Figure 2. Current Transfer Ratio vs. Input Current. Figure 3. Input Current vs. Forward Voltage. Figure 1. DC and Pulsed Transfer Characteristics.

8 PIN DIP, SO-8

Figure 6. Propagation Delay Time vs. Load Resistance. Figure 5. Propagation Delay vs. Temperature. Figure 4. Current Transfer Ratio vs. Temperature.

Figure 9. Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per IEC/EN/DIN EN 60747-5-2. Figure 8. Small-Signal Current Transfer Ratio vs. Quiescent Input Current. Figure 7. Logic High Output Current vs. Temperature.

Figure 10. Frequency Response.

Figure 12. Test Circuit for Transient Immunity and Typical Waveforms. Figure 11. Switching Test Circuit.

0 V 10% 90% 90% 10%

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