HCP0805 EATON | Alldatasheet

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Technical content

High current power inductors Product description

  • High current carrying capacity
  • Magnetically shielded, low EMI
  • Frequency range up to 2MHz
  • Inductance range from 0.40uH to 2.2uH
  • Current range from 10 to 32 amps
  • 7.9 x 7.6 mm footprint surface mount package in a 5.0mm height
  • Iron powder core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Multi-phase regulators
  • Voltage Regulator Modules (VRMs)
  • Distributed power systems DC-DC converters
  • Desktop and server VRMs and EVRDs
  • Point-of-Load (POL) modules
  • Field Programmable Gate Array (FPGA) DC-DC converters
  • Battery power systems
  • High current power supplies
  • Data networking and storage systems Environmental data
  • Storage temperature range (Component): -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE

High current power inductors www.eaton.com/elx Product specifications Part Number6 OCL1 (uH) ±20% FLL2 (uH) minimum Irms (amps) Isat (amps) DCR (mΩ) ±6.0% @ 20°C K-factor5 HCP0805-R40-R 0.40 0.26 20 32 3.1 376 HCP0805-R68-R 0.68 0.44 17.5 25 4.5 292 HCP0805-1R0-R 1.0 0.64 14.5 22 5.8 239 HCP0805-1R5-R 1.5 0.96 13.3 18 6.8 202 HCP0805-2R2-R 2.2 1.41 10 14 11.2 175 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc @ +25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.10Vrms, @ Isat, @ +25°C 3. I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is neces - sary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. I sat: Peak current for approximately 20% rolloff @ +25°C 5. K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L* ∆I, B p-p:(Gauss), K: (K factor from table), L: (Inductance in μH), ∆I (Peak to peak ripple current in Amps). 6. Part number definition: HCP0805-xxx-R HCP0805 = Product code and size XXX = Inductance value in uH, R = decimal point, If no R is present then last character equals number of zeroes -R suffix indicates RoHS compliant Dimensions (mm) Part marking:HCP0805, XXX= Inductance value in uH, R=decimal point, If no R is present then last character equals number of zeros wwllyy = date code, R = revision level Tolerances are ±0.25 millimeters unless stated otherwise PCB tolerances are ±0.1 millimeters unless stated otherwise DCR measured from point “a” to point “b” Do not route traces or vias underneath the inductor Dimensions Part Number A (mm) B (mm) HCP0805-R40-R 1.3 ±0.2 1.70 HCP0805-R68-R 1.1 ±0.2 1.50 HCP0805-1R0-R 1.1 ±0.2 1.50 HCP0805-1R5-R 1.1 ±0.2 1.50 HCP0805-2R2-R 0.8 ±0.2 1.20

www.eaton.com/elx Technical Data 4349 Effective January 2016 HCP0805 High current power inductors T emperature rise vs. total loss Packaging information (mm) Supplied in tape and reel packaging, 700 parts per 13” diameter reel. Temperature Rise (° C) Total Loss (W)

High current power inductors www.eaton.com/elx Inductance characteristics Core loss vs Bp-p 100kHz 200kHz 300kHz 500kHz 1MHz 0.001 0.01 0.1 100 1001 0001 0000 Core Loss (W) Bp-p (Gauss) % of OCL vs. % of Isat 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0% 20%4 0% 60% 80% 100% 120% 140% 160% 180% 200% % of Isat % of OCL

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Cleveland, OH 44122 United States www.eaton.com/elx © 2016 Eaton All Rights Reserved Printed in USA Publication 4349 BU-MC16003 January 2016 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Technical Data 4349 Effective January 2016 HCP0805 High current power inductors Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C