HCP0704-3R3-R

HCP0704 COOPER | Alldatasheet

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Technical content

Applications:

• Voltage Regulator Module (VRM)  Multi-phase regulators  Desktop and servers  Base station equipment  Notebook regulators  Data networking and storage systems  Point-of-load modules  Battery power systems  DCR sensing Environmental Data:  Storage temperature range: -40°C to +155°C  Operating temperature range: -40°C to +155°C (Range is application specific)  Solder reflow temperature: J-STD-020D compliant Packaging:  Supplied in tape-and-reel packaging, 1000 parts per reel, 13” diameter reel HALOGEN HFFREE Description:  Halogen free  155°C maximum total temperature operation  6.8 x 6.8 x 4.2mm surface mount package  Powder iron core material  Magnetically shielded, low EMI  High temperature core material eliminates thermal aging issues  High current carrying capacity, low core losses  Controlled DCR tolerance for sensing circuits  Inductance range from 0.40 μH to 4.7μH  Current range from 5.0 to 27 amps  Frequency range up to 2MHz  RoHS compliant High Current, High Frequency, Power Inductors HCP0704 Series

0209 BU-SB09086 Page 1 of 4 Data Sheet: 4348

1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms,I sat1 3I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 155°C under worst case operating conditions verified in the end application. 4I sat: Peak current for approximately 20% rolloff at +25°C. 5 K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ΔI : (Gauss), K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).

6 Part Number Definition: HCP0704-xxx-R

 HCP0704 = Product code and size  xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros  “-R” suffix = RoHS compliant Product Specifications Part Number6 OCL1 ± 25% (μH) FLL 2 Min. (μH) I rms 3 (Amps) I sat 4 @ 25°C (Amps) DCR (m Ω) @ 20°C K-factor 5 HCP0704-R40-R 0.40 0.28 17 27 3.2 ±10% 383.1 HCP0704-R60-R 0.60 0.42 14 21 4.5 ±10% 313.5 HCP0704-1R0-R 1.00 0.7 12 17 6.2 ±10% 265.3

Top View Side View Bottom View Recommended Pad Layout Schematic 21 2 HCP0704 wwllyy R

6.80 Max

3.3±0.3 HCP0704-R40 to 2R3= 1.20 +/- 0.2 HCP0704-3R3 to 4R7= 1.00 +/- 0.2 xxx HCP0704-R40 to 1R0= 4.20 max HCP0704-1R8 to 4R7= 4.00 max 7.60 2.50(2x) 4.00(2x)2 1 DDiimmeennssiioonnss -- mmmm User direction of feedHCP0704-R40 to 1R0= 4.2 HCP0704-1R8 to 4R7= 4.0 Section A-A

1.5 Dia

min. 7.50 6.9 12.0 4.0 2.0 1.5 Dia. +0.1/-0.0 A A 1.75 7.5 16.0 ±0.3 HCP0704 wwllyy R xxx Tota l Los s (W) T empetature Rise( ° C) Part Marking: HCP0704 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros wwllyy = Date code R = Revision level The nominal DCR test point is in the middle of the terminal Supplied in tape-and-reel packaging, 1000 parts per reel, 13” diameter reel. Packaging Information - mm Temperature Rise vs. Total Loss

0209 BU-SB09086 Page 2 of 4 Data Sheet: 4348

0209 BU-SB09086 Page 3 of 4 Data Sheet: 4348

0.001 0.01 0.1 10 100 1000 10000 Co r e Lo ss (W) 1M H z 250k H z 100k H z500k H zC o r e L o ss vs. B p-p B (G aus s )p-p % of OCL vs % of I 20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of I % of OC L 25°C sat sat Inductance Characteristics Core Loss

© 2009 Cooper Bussmann St. Louis, MO 63178 www.cooperbussmann.com

0209 BU-SB09086 Page 4 of 4 Data Sheet: 4348

The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. A ll other copies of this document are by definition uncon- trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will he lp the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution o f any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it sh ould be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in ac cordance with instructions for use provided in the label- ing, can be reasonably expected to result in significant injury to the user. North America Cooper Electronic Technologies

1225 Broken Sound Parkway NW

Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P .O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies

1 Jalan Kilang Timor

#06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) Volume Vol ume Package mm 3 mm3 Thickness <350 > _350 <2.5mm 235° C 220°C >_2.5mm 220° C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Vol ume Vol ume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 2 60°C 260°C 260°C 1.6 – 2.5mm 2 60°C 250°C 245°C >2.5mm 250° C 245°C 245°C Reference JDEC J-STD-020D Profile Feature Standard SnP b Solder Lead (P b) Free Solder Preheat and Soak T emperature min. (Tsmin) 100° C 150°C  Temperature max. (Tsmax) 150° C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3° C/ Second Max. Liquidous temperature (TL) 183° C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1T able 2 Time (tp) within 5 °C of the specified classification temperature (Tc) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature6 Minutes Max. 8 Minut es Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.