HCP0605 EATON | Alldatasheet

Document overview

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  • PDF pages: 4

Technical content

  • High current carrying capacity, high permeability
  • Magnetically shielded, low EMI
  • Frequency range up to 1 MHz
  • 5.3 mm x 6.1 mm footprint surface mount package in a 4.95 mm height
  • Iron powder core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Voltage Regulator Module (VRM)
  • Multi-phase regulators
  • Desktop and server VRMs and EVRDs
  • Point-of-load (POL) modules
  • Notebook regulators
  • Data networking and storage systems
  • Graphics cards
  • Battery power systems Environmental data
  • Storage temperature range (component): -40 °C to +125
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant HCP0605 High current power inductors Pb HALOGEN HFFREE Surface Mount Device

High current power inductors www.eaton.com/electronics 1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.10 Vrms, 0.0 Adc 2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat 3I rms: DC current for an approximate ΔT rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed +125 °C under worst case operating conditions verified in the end application. 4 Isat: Peak current for approximately 30% rolloff at + 25 °C. 5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * Δ I, Bp-p: (Gauss), K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).

6 Part Number Definition: HCP0605-xxx-R

 HCP0605 = Product code and size  xxx= Inductance value in μH, R = decimal point.  “-R” suffix = RoHS compliant Product Specifications OCL1 FLL2 Irms3 Isat4 DCR mΩ@ 20 °C Part Number5 µH ± 15% µH Minimum (A) (A) @25 °C Maximum K-factor 4 HCP0605-R10-R 0.095 0.06 53 20 0.40 120.5 Dimensions - mm Top View Bottom View Front View Reco mme nded P ad Lay out Schem atic 1 1.0 min 5.85 4.73 HCP0 605 ± 0.25 ± 0.22 6.5 xxx wwllyy R 1.60 (2x) 2 2 1.80 5.10 ± 0.25 Part Marking: HCP0605 xxx = Inductance value . in uH, (R = Decimal point) wwllyy = Date code R = Revision level Packaging information - mm 1.5 dia 1.5 dia 4.0 A 2.0 1.75 7.5 16.0 6.2 HCP0605 ± 0.3 xxx wwllyy R 5.35 A 5.0 12.0 Section A-A User direction of feed Supplied in tape-and-reel packaging, 1000 parts per reel, 13” diameter reel.

HCP0605 High current power inductors www.eaton.com/electronics Temperature rise vs. total loss Core loss vs Bp-p Inductance characteristics % of O C L v s I D C 100% 90% 80% 70% 60% 50% % 40% 30% 20% 10% 0 5 10 15 20 25 30 35 D CI (Am ps) of O C L T otal Lo ss (W ) Tem perature Rise (°C) 1000 1M Hz 100 500kHz 300kHz 200kHz 10 100kHz 0.1 0.01 0.001 0. 0001 0. 00001 10 100 1000 10000 Bp- p(G auss) C ore Loss (W )

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4368 EE-PCN16018 May 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4368 Effective May 2017 HCP0605 High current power inductors Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.