6N139 HP | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 16

Technical content

Features

  • High Current Transfer Ratio – 2000% Typical (4500% Typical for HCNW139/138)
  • Low Input Current Requirements – 0.5 mA
  • TTL Compatible Output –

0.1 V V

  • Performance Guaranteed over Temperature 0°C to 70°C
  • Base Access Allows Gain Bandwidth Adjustment
  • High Output Current – 60 mA
  • Safety Approval UL Recognized – 2500 V rms for 1 Minute and 5000 V rms* for 1 Minute per UL 1577 CSA Approved VDE 0884 Approved with V IORM = 1414 V peak for HCNW139 and HCNW138 BSI Certified (HCNW139 and HCNW138)
  • Available in 8-Pin DIP or SOIC-8 Footprint or Widebody Package
  • MIL-STD-1772 Version Available (HCPL-5700/1)

Description

These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetec- tor to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in TTL compatible saturation voltages and high speed operation. Where desired the V CC and VO terminals may be tied together to achieve conven- tional photodarlington operation. A base access terminal allows a gain bandwidth adjustment to be made. 6N139 6N138 HCPL-0701 HCPL-0700 HCNW139 HCNW138 CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. *5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only. A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended. Functional Diagram 4 5 8NC ANODE CATHODE NC VCC VO GND TRUTH TABLE LED ON OFF VO LOW HIGH VB

The 6N139, HCPL-0701, and CNW139 are for use in CMOS, LSTTL or other low power appli- cations. A 400% minimum current transfer ratio is guaranteed over 0 to 70°C operating range for only 0.5 mA of LED current. The 6N138, HCPL-0700, and HCNW138 are designed for use mainly in TTL applications. Current Transfer Ratio (CTR) is 300% minimum over 0 to 70°C for an LED current of 1.6 mA (1 TTL Unit load ). A 300% minimum CTR enables operation with 1 TTL Load using a 2.2 kΩ pull-up resistor. Selection for lower input current down to 250 µA is available upon request. The HCPL-0701 and HCPL-0700 are surface mount devices packaged in an industry standard SOIC-8 footprint. The SOIC-8 does not require “through holes” in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. The HCNW139 and HCNW138 are packaged in a widebody encapsulation that provides creep- age and clearance dimensions suitable for safety approval by regulatory agencies worldwide. Selection Guide Widebody 8-Pin DIP Package Hermetic (300 Mil) Small Outline SO-8 (400 mil) Single and Dual Single Dual Minimum Absolute Dual Single Channel Channel Channel Single Input ON Maxi- Channel Channel Package Package Package Channel Current Minimum mum Packages Package HCPL- HCPL- HCPL- Package (I F) CTR V CC HCPL- 6N139 2731 [1] 0701 0731 HCNW139 0.5 mA 400% 18 V 6N138 2730 [1] 0700 0730 HCNW138 1.6 mA 300% 7 V HCPL-4701[1] 4731[1] 070A[1] 073A[1] 40 µA 800% 18 V 0.5 mA 300% 20 V 5701 [1] 5700[1] 5731[1] 5730[1] Note: 1. Technical data are on separate HP publications.

Ordering Information

Specify Part Number followed by Option Number (if desired). Example: 6N139#XXX 020 = 5000 V rms/1 Minute UL Rating Option* 300 = Gull Wing Surface Mount Option† 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information. *For 6N139 and 6N138 only. †Gull wing surface mount option applies to through hole parts only. Schematic

9.65 ± 0.25 (0.380 ± 0.010) HP XXXXZ YYWW DATE CODE 1.080 ± 0.320 (0.043 ± 0.013) 2.54 ± 0.25 (0.100 ± 0.010) 0.51 (0.020) MIN. 0.65 (0.025) MAX. 4.70 (0.185) MAX. 2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS AND (INCHES). 5678 4321 5° TYP. OPTION CODE* UL RECOGNITION UR 0.254+ 0.076 - 0.051 (0.010+ 0.003) - 0.002) 7.62 ± 0.25 (0.300 ± 0.010) 6.35 ± 0.25 (0.250 ± 0.010) TYPE NUMBER *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED. Package Outline Drawings 8-Pin DIP Package (6N139/6N138) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138) 0.635 ± 0.25 (0.025 ± 0.010) 12° NOM. 9.65 ± 0.25 (0.380 ± 0.010) 0.635 ± 0.130 (0.025 ± 0.005) 7.62 ± 0.25 (0.300 ± 0.010) 5678 4321 9.65 ± 0.25 (0.380 ± 0.010) 6.350 ± 0.25 (0.250 ± 0.010) 1.016 (0.040) 1.194 (0.047) 1.194 (0.047) 1.778 (0.070) 9.398 (0.370) 9.906 (0.390) 4.826 (0.190) TYP. 0.381 (0.015) 0.635 (0.025) PAD LOCATION (FOR REFERENCE ONLY) 1.080 ± 0.320 (0.043 ± 0.013) 4.19 (0.165)MAX. 1.780 (0.070) MAX.1.19 (0.047) MAX. 2.54 (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 0.254+ 0.076 - 0.051 (0.010+ 0.003) - 0.002) JEDEC Registered Data.

Small Outline SO-8 Package (HCPL-0701/HCPL-0700) 8-Pin Widebody DIP Package (HCNW139/HCNW138) 5678 4321 11.15 ± 0.15 (0.442 ± 0.006) 1.78 ± 0.15 (0.070 ± 0.006) 5.10 (0.201)MAX. 1.55 (0.061) MAX. 2.54 (0.100) TYP. DIMENSIONS IN MILLIMETERS (INCHES). 7° TYP. 0.254+ 0.076 - 0.0051 (0.010+ 0.003) - 0.002) 11.00 (0.433) 9.00 ± 0.15 (0.354 ± 0.006) MAX. 10.16 (0.400) TYP. HP HCNWXXXX YYWW DATE CODE TYPE NUMBER 0.51 (0.021) MIN. 0.40 (0.016) 0.56 (0.022) 3.10 (0.122) 3.90 (0.154) XXX YWW 8765 4321 5.994 ± 0.203 (0.236 ± 0.008) 3.937 ± 0.127 (0.155 ± 0.005) 0.406 ± 0.076 (0.050)BSG 5.080 ± 0.127 (0.200 ± 0.005) 3.175 ± 0.127 (0.060) 45° X 0.432 (0.017) 0.228 ± 0.025 (0.009 ± 0.001) TYPE NUMBER (LAST 3 DIGITS) DATE CODE 0.305 (0.012)MIN. TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. 0.203 ± 0.102 (0.008 ± 0.004) PIN ONE 0 ~ 7°

1.00 ± 0.15 (0.039 ± 0.006) 7° NOM. 12.30 ± 0.30 (0.484 ± 0.012) 0.75 ± 0.25 (0.030 ± 0.010) 11.00 (0.433) 5678 4321 11.15 ± 0.15 (0.442 ± 0.006) 9.00 ± 0.15 (0.354 ± 0.006) 1.3 (0.051) 12.30 ± 0.30 (0.484 ± 0.012) 6.15 (0.242)TYP. 0.9 (0.035) PAD LOCATION (FOR REFERENCE ONLY) 1.78 ± 0.15 (0.070 ± 0.006) 4.00 (0.158)MAX. 1.55 (0.061) MAX. 2.54 (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 0.254+ 0.076 - 0.0051 (0.010+ 0.003) - 0.002) MAX. 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138) Note: Use of nonchlorine activated fluxes is highly recommended. Solder Reflow Temperature Profile (HCPL-07XX and Gull Wing Surface Mount Option 300 Parts) 240 ΔT = 115°C, 0.3°C/SEC ΔT = 100°C, 1.5°C/SEC ΔT = 145°C, 1°C/SEC TIME – MINUTES TEMPERATURE – °C 220 200 180 160 140 120 100 260 12 3 456789 1 0 1 1 1 2

The 6N139/138, HCNW139/138, and HCPL-0701/0700 have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. VDE Approved according to VDE 0884/ 06.92 (HCNW139/138 only). BSI Certification according to BS415:1994, (BS EN60065:1994); BS EN60950:1992 (BS7002:1992) and EN41003:1993 for Class II applications (HCNW139/ HCNW138 only.) Insulation and Safety Related Specifications 8-Pin DIP Widebody (300 Mil) SO-8 (400 Mil) Parameter Symbol Value Value Value Units Conditions Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals Air Gap (External to output terminals, shortest Clearance) distance through air. Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals Tracking (External to output terminals, shortest Creepage) distance path along body. Minimum Internal 0.08 0.08 1.0 mm Through insulation distance, Plastic Gap conductor to conductor, usually (Internal Clearance) the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA 4.0 mm Measured from input terminals Tracking (Internal to output terminals, along Creepage) internal cavity. Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance with CECC 00802.

VDE 0884 Insulation Related Characteristics (HCNW139 and HCNW138) Description Symbol Characteristic Units Installation Classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 600 V rms I-IV for rated mains voltage ≤ 1000 V rms I-III Climatic Classification 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 Maximum Working Insulation Voltage V IORM 1414 V peak Input to Output Test Voltage, Method b* VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, V PR 2652 V peak Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VPR = 1.5 x VIORM, Type and Sample Test, V PR 2121 V peak tP = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, t ini = 10 sec) V IOTM 8000 V peak Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 11, Thermal Derating curve.) Case Temperature T S 175 °C Current (Input Current I F, PS = 0) I S,INPUT 400 mA Output Power P S,OUTPUT 700 mW Insulation Resistance at TS, VIO = 500 V R S > 109 Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884) for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.

Absolute Maximum Ratings* (No Derating Required up to 85°C) Parameter Symbol Min. Max. Units Storage Temperature T S -55 125 °C Operating Temperature** T A -40 85 °C Average Forward Input Current I F(AVG) 20 mA Peak Forward Input Current I FPK 40 mA (50% Duty Cycle, 1 ms Pulse Width) Peak Transient Input Current I F(TRAN) 1.0 A (<1 µs Pulse Width, 300 pps) Reverse Input Voltage V R 5V HCNW139/138 3 V Input Power Dissipation P I 35 mW Output Current (Pin 6) I O 60 mA Emitter Base Reverse Voltage (Pin 5-7) V EB 0.5 V Supply Voltage and Output Voltage V CC -0.5 18 V (6N139, HCPL-0701, HCNW139) Supply Voltage and Output Voltage V CC -0.5 7 V (6N138, HCPL-0700, HCNW138) Output Power Dissipation P O 100 mW Total Power Dissipation P T 135 mW Lead Solder Temperature (for Through Hole Devices) 260 °C for 10 sec., 1.6 mm below seating plane HCNW139/138 260 °C for 10 sec., up to seating plane Reflow Temperature Profile See Package Outline Drawings section (for SOIC-8 and Option #300) *JEDEC Registered Data for 6N139 and 6N138. **0°C to 70°C on JEDEC Registration. Recommended Operating Conditions Parameter Symbol Min. Max. Units Power Supply Voltage V CC 4.5 18 V Forward Input Current (ON) I F(ON) 0.5 12.0 mA Forward Input Voltage (OFF) V F(OFF) 0 0.8 V Operating Temperature T A 07 0 °C

0°C ≤ TA ≤ 70°C, 4.5 V ≤ VCC ≤ 18 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified. All Typicals at TA = 25°C. See Note 7. Current Transfer CTR 6N139 400* 2000 5000 % I F = 0.5 mA V CC = 4.5 2, 3 1, 2, Ratio HCPL-0701 V O = 0.4 V 4 HCNW139 400 4500 6N139 500* 1600 2600 I F = 1.6 mA HCPL-0701 HCNW139 500 3000 300 1600 I F = 5.0 mA 200 850 I F = 12 mA 6N138 300* 1600 2600 I F = 1.6 mA HCPL-0700 HCNW138 1500 Logic Low Output V OL 6N139 0.1 0.4 V I F = 0.5 mA, V CC = 4.5 1 2 Voltage HCPL-0701 I O = 2 mA HCNW139 IF = 1.6 mA, IO = 8 mA IF = 5.0 mA, IO = 15 mA

0.2 I F = 12 mA,

IO = 24 mA 6N138 0.1 I F = 1.6 mA, HCPL-0700 I O = 4.8 mA HCNW138 Logic High I OH 6N139 0.05 100 µAV O = VCC = 18 V IF = 0 mA 2 Output Current HCPL-0701 HCNW139 6N138 0.1 250 V O = VCC = 7 V HCPL-0700 HCNW138 Logic Low Supply I CCL 6N138/139 0.4 1.5 mA I F = 1.6 mA, VO = Open, 10 2 Current HCPL-0701/ V CC = 18 V 0700 HCNW139 0.5 2 HCNW138 Logic High I CCH 6N138/139 0.01 10 µAI F = 0 mA, VO = Open, 2 Supply Current HCPL-0701/ V CC = 18 V 0700 HCNW139 1 HCNW138 Input Forward V F 6N138 1.25 1.40 1.7* V T A = 25°CI F = 1.6 mA 4, 8 Voltage 6N139 HCPL-0701 1.75 HCPL-0700 HCNW139 1.0 1.45 1.85 T A = 25°C HCNW138 0.95 1.95 Input Reverse BVR 5.0* V I R = 10 µA, TA = 25°C HCNW139 3.0 I R = 100 µA, TA = 25°C HCNW138 Temperature ΔVF -1.8 mV/ °CI F = 1.6 mA 8 Coefficient of ΔTA Forward Voltage Input C IN 60 pF f = 1 MHz, V F = 0 V Capacitance HCNW139 90 HCNW138 *JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25°C and VCC = 5 V , unless otherwise noted. Breakdown Voltage

Switching Specifications (AC) Over recommended operating conditions (TA = 0 to 70°C), VCC = 5 V, unless otherwise specified. Propagation Delay t PHL 6N139 5 25* µsT A = 25°C 5, 6, 2, 4 30 I F = 0.5 mA, Rl = 4.7 kΩ 6N139 0.2 1* µsT A = 25°C 2I F = 12 mA, Rl = 270 Ω HCNW139 1.1 6N138 1.6 10* µsT A = 25°C IF = 1.6 mA, 15 Rl = 2.2 k Ω HCNW138 11 Propagation Delay t PLH 6N139 18 60* µsT A = 25°C 5, 6, 2, 4 90 I F = 0.5 mA, Rl = 4.7 kΩ HCNW139 115 6N139 2 7* µsT A = 25°C

10 I F = 12 mA,

HCNW139 Rl = 270 Ω HCNW139 1.1 6N138 10 35* µsT A = 25°C IF = 1.6 mA, Rl = 2.2 kΩ 6N138 50 HCPL-0700 HCNW139 70 Common Mode |CM H| 1000 10000 V/ µsI F = 0 mA, 13 5, 6 Transient Immunity T A = 25°C at Logic High Output Rl = 2.2 kΩ |VCM| = 10 Vp-p Common Mode |CM L| 1000 10000 V/ µsI F = 1.6 mA, 13 5, 6 Transient Immunity T A = 25°C at Logic Low Output Rl = 2.2 k Ω |VCM| = 10 Vp-p *JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted. Time to Logic Low at Output HCPL-0701 HCNW139 HCPL-0701 HCPL-0700 HCNW138 Time to Logic High at Output HCPL-0701 HCNW139 HCPL-0701 HCPL-0700 HCNW138 7, 9, 7, 9,

Input-Output Momentary V ISO 2500 V rms RH < 50%, t = 1 min., 3, 8 Withstand Voltage† T A = 25°C Option 020 5000 3, 9 HCNW139 HCNW138 Resistance (Input-Output) R I-O 1012 Ω VI-O = 500 Vdc 3 RH < 45% Capacitance (Input-Output) C I-O 0.6 pF f = 1 MHz 3 **All typicals at T A = 25°C, unless otherwise noted. †The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.” Notes: 1. DC CURRENT TRANSFER RATI0 (CTR) is defined as the ratio of output collector current, I O, to the forward LED input current, IF, times 100%. 2. Pin 7 Open. 3. Device considered a two-terminal device. Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 4. Use of a resistor between pin 5 and 7 will decrease gain and delay time. Significant reduction in overall gain can occur when using resistor values below 47 kΩ . For more information, please contact your local HP Components representative. 5. Common mode transient immunity in a Logic High level is the maximum toler- able (positive) dV CM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., V O > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dV CM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., V O < 0.8 V). 6. In applications where dV/dt may exceed 50,000 V/µ s (such as static discharge) a series resistor, RCC, should be included to protect the detector IC from destructively high surge currents. The recommended value is R CC = 220 Ω . 7. Use of a 0.1 µ F bypass capacitor connected between pins 8 and 5 adjacent to the device is recommended. 8. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 3000 V rms for 1 second (leakage detection current limit, I I-O < 5 µA). This test is per- formed before the 100% production test shown in the VDE 0884 Insulation Related Characteristics Table, if applicable. 9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection current limit, I I-O < 5 µA). This test is per- formed before the 100% production test for partial discharge (method b) shown in the VDE 0884 Insulation Related Characteristics Table, if applicable.

Figure 13. Test Circuit for Transient Immunity and Typical Waveforms.

0 V 10%

10 V tr, tf = 16 ns

For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright © 1998 Hewlett-Packard Co. Obsoletes 5965-3599E Printed in U.S.A. 5968-1085E (7/98) www.hp.com/go/isolator