HCM1707-330-R

HCM1707 EATON | Alldatasheet

Document overview

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• PDF pages: 7

Technical content

• High current carrying capacity
• Magnetically shielded, low EMI
• Frequency range up to 1MHz
• Inductance range from 1.5μH to 68.0μH
• Current range from 5.2 to 40.0 amps
• 17.5x17.2mm footprint surface mount package in a 7.0mm height
• Powder iron core material
• Halogen free, lead free, RoHS compliant

Applications

• Voltage Regulator Module (VRM)
• Multi-phase regulators
• Point-of-load modules
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Base station equipment
• Battery power systems Environmental data
• Storage temperature range (Component): -55°C to +125°C
• Operating temperature range: -55°C to +125°C (ambient + self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant Coiltronics HCM1707 Series High current power inductors Technical Data 10295 Effective August 2014 Coiltronics is now part of Eaton Same great products plus even more. The Coiltronics brand of magnetics (formerly of the Bussmann Division of Cooper Industries) is now part of Eaton’s Electrical Group, Electronics Division. HALOGEN HFFREEPb

www.eaton.com/elx Technical Data 10295 Effective August 2014 HCM1707 Series High current power inductors Dimensions - mm Product specifications Part Number6 OCL1 ±20% (μH) FLL min.2 (μH) Irms (amps) Isat (amps) DCR (mΩ) @ 20°C (typical) DCR (mΩ) @ 20°C (maximum) K-factor5 HCM1707-1R5-R 1.5 0.96 40 40 1.85 2.15 124 HCM1707-2R2-R 2.2 1.41 37 34 2.15 2.50 103 HCM1707-4R7-R 4.7 3.01 27 24 4.12 4.72 76 HCM1707-6R8-R 6.8 4.35 20 22 6.55 7.55 60 HCM1707-8R2-R 8.2 5.25 16 20 8.10 8.70 55 HCM1707-100-R 10 6.40 14 18 9.30 10 47 HCM1707-150-R 15 9.60 12 13 14.5 15.5 43 HCM1707-220-R 22 14.1 9.5 11 21 23 37 HCM1707-330-R 33 21.1 9.0 10 35 37 28 HCM1707-470-R 47 30.1 6.8 7.5 41 47 25 HCM1707-680-R 68 43.5 5.2 6.5 74 85 20 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc, +25°C. 2. Full Load Inductance (FLL): Test parameters: 100kHz, 0.25Vrms, Isat, +25°C. 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125°C under worst case operating conditions verified in the end application. 4. I sat: Peak current for approximately 20% rolloff at +25°C. 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p :(Gauss), K: (K-factor from table), L: (Inductance in μH), ∆I (Peak to peak ripple current in amps). 6. Part Number Definition: HCM1707-yyy-R - HCM1707 = Product code and size - yyy= Inductance value in uH, R = decimal point, if no R is present then third character = number of zeros. - “-R” suffix = RoHS compliant All soldering surfaces coplanar within 0.10 millimeters. Part marking: HCM1707; XXX = initial inductance in µH, R = decimal point; if no R is present, last digit equals number of zeros. wwllyy = date code, R = revision level Color: Grey. DCR measured between point “a” and point “b” a b

www.eaton.com/elx HCM1707 Series High current power inductors Technical Data 10295 Effective August 2014 Packaging information - mm Supplied in tape and reel packaging, 350 parts per 13” diameter reel. T emperature rise vs. total loss Temperature Rise (˚C) Total Loss (W )

www.eaton.com/elx Technical Data 10295 Effective August 2014 HCM1707 Series High current power inductors Core loss 25K 50K 100K 200K 300K 500K 1.0 10.0 100.0 1000.0 10000.0 100 1000 10000 Core Loss (mW) Bp-p (Gauss) Core Loss vs Bp-p Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 110% 01 02 03 04 05 06 07 0 % of OCL Idc (Amps) HCM1707-1R5-R 40% 50% 60% 70% 80% 90% 100% 110% 01 02 03 04 05 06 07 0 % of OCL Idc (Amps) HCM1707-2R2-R

www.eaton.com/elx HCM1707 Series High current power inductors Technical Data 10295 Effective August 2014 Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 % of OCL Idc (Amps) HCM1707-4R7-R 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 % of OCL Idc (Amps) HCM1707-6R8-R 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 % of OCL Idc (Amps) HCM1707-8R2-R 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 % of OCL Idc (Amps) HCM1707-100-R 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 01 21 41 61 82 0 % of OCL Idc (Amps) HCM1707-150-R 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 01 21 41 61 82 0 % of OCL Idc (Amps) HCM1707-220-R

www.eaton.com/elx Technical Data 10295 Effective August 2014 HCM1707 Series High current power inductors Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 110% 02468 10 12 14 16 18 % of OCL Idc (Amps) HCM1707-330-R 40% 50% 60% 70% 80% 90% 100% 110% 024681 01 21 4 % of OCL Idc (Amps) HCM1707-470-R 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 01 21 4 % of OCL Idc (Amps) HCM1707-680-R

www.eaton.com/elx Eaton is a registered trademark. All other trademarks are property of their respective owners. Eaton’s Electrical Group Electronics Division 1 14 Old State Road Ellisville, MO 63021 United States www.eaton.com/elx © 2014 Eaton All Rights Reserved Publication No. 10295 — BU-SB14600 August 2014 HCM1707 Series High current power inductors Technical Data 10295 Effective August 2014 Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Table 1 - Standard SnPb Solder (Tc) Volume Volume Packagem m3 mm3 Thickness <350 >_350 <2.5mm 235°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Volume Volume Volume Packagem m3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min.( Tsmin) 100°C 150°C

• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1T able 2 Time (tp) within 5 °C of the specified classification temperature (Tc) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Solder reflow profile North America Eaton’s Electrical Group Electronics Division

1225 Broken Sound Parkway NW

Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Eaton’s Electrical Group Electronics Division P .O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Eaton’s Electrical Group Electronics Division Burton-on-the-Wolds Leicestershire, LE 12 5th UK Phone: +44 (0) 1509 882 600 Fax: +44 (0) 1509 882 786 Eaton’s Electrical Group Electronics Division Avda Santa Eulalia, 290 Terrassa, Barcelona 08223 Spain Phone: +34-93-736-2813 Fax: +34-93-783-5055 Asia Pacific Eaton’s Electrical Group Electronics Division No.2, #06-01 Serangoon North Avenue 5 Singapore 554911 Tel: +65 6645 9888 Fax: +65 6728 3155 The only controlled copy of this Data Sheet is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.