HCM1305-R22-R

HCM1305 EATON | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

• High current carrying capacity
• Low core losses
• Magnetically shielded, low EMI
• Frequency range up to 5 MHz
• Inductance range from 0.10 µH to 33 µH
• Current range from 5.2 A to 118 A
• 13.8 mm x 12.5 mm footprint surface mount package in a 5.0 mm height
• Iron powder core material

Applications

• Storage temperature range (component): -55 °C to +125 °C
• Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020 (latest revision) compliant HCM1305 High current power inductors
• Voltage Regulator Module (VRM)
• Multi-phase regulators
• Point-of-load modules
• Desktop and server VRMs and EVRDs
• Base station equipment
• Notebook and laptop regulators
• Battery power systems
• Graphics cards
• Data networking and storage systems Environmental data Pb HALOGEN HFFREE

High current power inductors www.eaton.com/electronics Product specifications Part Number6 OCL1 (µH) ± 20% FLL2 Min. (µH) Irms (A) Isat (A) DCR (m1) @ +20 °C ± nominal DCR (m1) @ +20 °C maximum K-factor 5 HCM1305-R10-R 0.10 0.064 55 118 0.52 0.59 848 HCM1305-R22-R 0.22 0.14 51 110 0.63 0.72 843 HCM1305-R33-R 0.33 0.21 42 80 0.80 0.92 506 HCM1305-R47-R 0.47 0.30 38 65 0.80 0.92 506 HCM1305-R56-R 0.56 0.36 36 55 1.15 1.33 500 HCM1305-R68-R 0.68 0.44 34 54 1.15 1.33 500 HCM1305-R82-R 0.82 0.52 31 53 1.40 1.61 358 HCM1305-1R0-R 1.00 0.64 29 50 2.10 2.42 275 HCM1305-1R5-R 1.50 0.96 23 48 2.75 3.16 225 HCM1305-1R8-R 1.80 1.15 21 40 4.00 4.60 216 HCM1305-2R2-R 2.20 1.41 20 32 4.60 5.29 191 HCM1305-3R3-R 3.30 2.11 15 32 7.70 9.20 170 HCM1305-4R7-R 4.70 3.01 12 27 11.0 12.7 161 HCM1305-6R8-R 6.80 4.35 11 21 13.0 15.0 129 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, +25 °C. 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 Vrms, Isat, @ +25 ° 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. Isat: Peak current for approximately 20% rolloff at +25 °C. 5. K-factor: Used to determine Bp-p for core loss (see graph). B p-p = K * L * 6I. Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in µH), 6I (Peak to peak ripple current in amps). 6. Part Number Definition: HCM1305-yyy-R - HCM1305 = Product code and size yyy= Inductance value in µH, R = decimal point, if no R is present then third character = number of zeros. “-R” suffix = RoHS compliant

3www.eaton.com/electronics Technical Data 4371 Effective September 2017 HCM1305 High current power inductors Dimensions- mm xxx wlyy R Part Marking: xxx = Inductance value in µH, R = decimal point, if no R is present, third character = number of zeros, wlyy = (Date Code), R = (Revision Level) All soldering surfaces to be coplanar within 0.10 millimeters. Tolerances are ±0.3 millimeters unless stated otherwise. Color: Grey. Do not route traces or vias underneath the inductor Top View Side View Bottom View Recommended Pad Layout Schematic 4.0±0.5 2.54±0.3 7.7 typ. 4.9 5.0 max. 8.5 typ. 13.3±0.5 12.2±0.3 3.3 14.2 Packaging information - mm Supplied in tape and reel packaging, 400 parts per 13” diameter reel.

High current power inductors 4 www.eaton.com/electronics Technical Data 4371 Effective September 2017 Temperature rise vs. total loss Core loss vs. Bp-p 1MHz 100 1000 10000 100 1000 10000 Core Loss (mW ) Bp-p (Gauss) 100KH z 200KH z 300KH z 500KH z 0.0 10.0 20.0 30.0 40.0 50.0 Temperature Rise (˚ C) Total Loss (W )

High current power inductors Inductance characteristics 5www.eaton.com/electronics 40% 50% 60% 70% 80% 90% 100% 110% 0 20 40 60 8 0 1 00 120 140 % of OCL HCM1305-R33-R 40% 50% 60% 70% 80% 90% 100% 110% 0 20 4 0 60 80 100 120 % of OCL HCM1305-R47-R 40% 50% 60% 70% 80% 90% 100 110% 0 20 40 60 80 100 120 % of OCL HCM1305-R56-R 40% 50% 60% 70% 80% 90% 100% 110% 0 1 0 20 30 40 50 60 7 0 8 0 % of OCL HCM1305-R68-R 40% 50% 60% 70% 80% 90% 100% 110% 0 10 20 3 0 40 50 60 70 80 % of OCL HCM1305-R82-R 40% 50% 60% 70% 80% 90% 100% 110% 0 10 20 30 40 50 6 0 70 % of OCL HCM1305-1R0-R Idc (A ) Idc (A) Idc (A) Idc (A) Idc (A) Idc (A)

High current power inductors 6 www.eaton.com/electronics Technical Data 4371 Effective September 2017 Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 110% 0 5 10 15 20 25 30 35 40 45 50 55 60 % of OCL HCM1305-1R5-R 40% 50% 60% 70% 80% 90% 100% 110% 0 5 10 15 20 25 30 35 40 45 50 55 60 % of OCL Idc (A) HCM1305-1R8-R 40% 50% 60% 70% 80% 90% 100% 110% 0 5 10 15 20 25 30 35 40 45 50 % of OCL HCM1305-2R2-R 40% 50% 60% 70% 80% 90% 100% 110 0 5 10 15 20 25 30 35 40 45 50 % of OCL HCM1305-3R3-R 40% 50% 60% 70% 80% 90% 100% 110% 0 5 10 15 20 25 30 35 % of OCL HCM1305-4R7-R 40% 50% 60% 70% 80% 90% 100% 110% 0 5 10 15 20 25 30 % of OCL Idc (A) HCM1305-5R6-R Idc (A) Idc (A) Idc (A )Idc (A)

High current power inductors Inductance characteristics 7www.eaton.com/electronics 40% 50% 60% 70% 80% 90% 100% 110% 0 5 10 15 20 25 30 % of OCL dc (A) HCM1305-6R8-R 40% 50% 60% 70% 80% 90% 100% 110% 0 2 4 6 8 10 12 14 16 18 20 22 24 26 % of OCL HCM1305-7R8-R 40% 50% 60% 70% 80% 90% 100% 110% 0 2 4 6 8 10 12 14 16 18 20 22 24 26 % of OCL Idc (A) HCM1305-8R2-R 40% 50% 60% 70% 80% 90% 100% 110% 0 2 4 6 8 10 12 14 16 18 20 22 24 26 % of OCL Idc (A) HCM1305-100-R 40% 50% 60% 70% 80% 90% 100% 110% 0 2 4 6 8 10 12 14 16 18 20 22 % of OCL HCM1305-150-R 40% 50% 60% 70% 80% 90% 100% 110% 0 2 4 6 8 10 12 14 16 18 % of OCL HCM1305-220-R Idc (A )Idc (A) Idc (A )I

High current power inductors Technical Data 4371 Effective September 2017 Inductance characteristics 8 www.eaton.com/electronics 40% 50% 60% 70% 80% 90% 100% 110% 0 2 4 6 8 10 12 14 16 18 % of OCL Idc (A) HCM1305-330-R

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4371 BU-SB14459 September 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Technical Data 4371 Effective September 2017 HCM1305 High current power inductors