HCM1104 EATON | Alldatasheet

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Technical content

High current power inductors Product features

  • High current carrying capacity
  • Low core losses
  • Magnetically shielded, low EMI
  • Frequency range up to 5 MHz
  • Inductance range from 0.2 μH to 22 μH
  • Current range from 5 A to 45 A
  • 11 .5 mm x 10.3 mm footprint surface mount package in a 4.0 mm height
  • Iron powder core material

Applications

  • Voltage Regulator Module (VRM)
  • Multi-phase regulators
  • Point-of-Load modules
  • Desktop and server VRMs and EVRDs
  • Base station equipment
  • Notebook and laptop regulators
  • Battery power systems
  • Graphics cards
  • Data networking and storage systems Environmental data
  • Storage temperature range (Component): -55 °C to +125 °C
  • Operating temperature range: -55 °C to +125 °C (ambient + self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE

High current power inductors www.eaton.com/electronics Product Specifications Part Number7 OCL1 (μH) ± 20% FLL2 (μH) minimum Irms (A) Isat 4,5 (A) DCR (mΩ) typical @ +20 °C DCR (mΩ) maximum @ +20 °C K-factor HCM1104-R20-R 0.20 0.13 32 45 0.63 0.72 411 HCM1104-R36-R 0.36 0.23 30 42 1.04 1.20 269 HCM1104-R45-R 0.45 0.29 29 36 1.07 1.23 219 HCM1104-R56-R 0.56 0.36 25 32 1.56 1.80 230 HCM1104-R90-R 0.90 0.58 22 28 2.17 2.50 236 HCM1104-1R0-R 1.0 0.56 18 28 3.0 3.3 378 HCM1104-1R5-R 1.5 0.84 16 32 3.8 4.2 310 HCM1104-2R2-R 2.2 1.23 12 18 6.0 7.0 253 HCM1104-3R3-R 3.3 1.85 10 16 10.8 11.8 220 HCM1104-4R7-R 4.7 2.63 8.5 15 17 20 175 HCM1104-100-R 10 5.60 7.5 8.5 27 30 116 HCM1104-220-R 22 12.3 5.0 5.5 60 66 92 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, @ +25 °C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 Vrms, @ I sat, @ +25 °C 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. I sat: Peak current for approximately 20% rolloff @ +25 °C- HCM1104-R20-R to HCM1104-R90-R 5. Isat: Peak current for approximately 30% rolloff @ +25 °C HCM1104-1R0-R to HCM1104-220-R 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. B p-p: (Gauss), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps). 7. Part Number Definition: HCM1104-xxx-R HCM1104 = Product code and size xxx= inductance value in μH, R= decimal point , If no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) Part marking: xxx=inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wlyy=date code, R=revision level All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are ±0.3 millimeters unless stated otherwise Color: Grey Do not route traces or vias underneath the inductor Recommended pad layout Schematic

High current power inductors www.eaton.com/electronics Packaging information (mm) Supplied in tape and reel packaging, 850parts per 13” diameter reel T emperature rise vs. total loss 0.0 10.0 20.0 30.0 40.0 50.0 Temperature Rise (° C) Total Loss (W) HCM1104-R20-R HCM1104-R36-R HCM1104-R45-R HCM1104-R56-R HCM1104-R90-R 0.0 10.0 20.0 30.0 40.0 50.0 Temperature Rise (° C) Total Loss (W) HCM1104-1R0-R HCM1104-1R5-R HCM1104-3R3-R/ HCM1104- 4R7-R/HCM1104-220-R HCM1104-2R2-R/ HCM1104- 100-R

High current power inductors www.eaton.com/electronics Core loss vs. Bp-p HCM1104-R20-R to HCM1104-R90-R 200KHz 0.1 100 1000 10,000 1000 001 10, 000 Core Loss (mW) B p-p (Gauss) 25 kH z 50 kH z

1 MHz

0.1 100 1000 10,000 1000 001 10, 000 Core Loss (mW) B p-p (Gauss) 25 kH z 50 kH z HCM1104-1R0-R to HCM1104-220-R 200 kHz 300 kHz 500 kHz 1MHz 100 kHz

High current power inductors www.eaton.com/electronics Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 01 02 03 04 05 06 07 08 09 00 01 % of OC L HCM1104-R20-R 40% 50% 60% 70% 80% 100% 90% 1002 03 04 05 06 07 08 09 00 01 % of OC L HCM1104-R36-R 100% 40% IDC (A ) HCM1104-R45-R 50% 60% 70% 80% 90% 1002 03 04 05 06 07 00 8 % of OC L IDC (A ) 100% IDC (A ) HCM1104-R56-R 40% 50% 60% 70% 80% 90% 1002 03 04 05 06 00 7 % of OC L IDC (A ) 40% 50% 60% 70% 80% 90% 100% 01 02 03 04 05 00 6 % of OC L IDC (A ) HCM1104-R90-R 501 01 52 02 53 03 5 40 % of OCL Idc (A) HCM1104-1R0-R 40% 50% 60% 70% 80% 90% 100%

High current power inductors www.eaton.com/electronics Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 05 10 15 20 25 30 35 % of OCL Idc (A) HCM1104-1R5-R 40% 50% 60% 70% 80% 90% 100% 280001 01 21 41 61 82 02 22 42 62 8 % of OCL Idc (A) HCM1104-2R2-R 40% 50% 60% 70% 80% 100% 90% 20001 081 21 41 68 1 % of OCL Idc (A) HCM1104-4R7-R 40% 50% 60% 70% 80% 90% 100 % 21 00008 12 146 1 % of OCL Idc (A) HCM1104-100-R 40% 50% 60% 70% 80% 90% 100% 0002 % of OCL Idc (A) 81 01 21 41 61 82 02 2 HCM1104-3R3-R 4 6 4 6 4 6 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 0 Idc (A) HCM1104-220-R % of OCL

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2018 Eaton All Rights Reserved Printed in USA Publication No. 4370 BU-SB14813 August 2018 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4370 Effective August 2018 HCM1 104 High current power inductors Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C