HCM1103 EATON | Alldatasheet

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Technical content

High current power induc tors Product features

  • 11.5 x 10.3 x 3.0 mm maximum surface mount package
  • Iron powder core material
  • Magnetically shielded, low EMI
  • High current carrying capacity, low core losses
  • Inductance range from 0.12 µH to 22.0 µH
  • Current range from 3.0 A to 75 A
  • Halogen free, lead free, RoHS compliant

Applications

  • Voltage Regulator Module (VRM)
  • Multi-phase regulators
  • Point-of-load modules
  • Desktop and server VRMs and EVRDs
  • Base station equipment
  • Notebook and laptop regulators
  • Battery power systems
  • Graphics cards
  • Data networking and storage systems Environmental Data
  • Storage temperature range (Component): -55 °C to +125 °C
  • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE

High current power inductors www.eaton.com/electronics Product Specifications Dimensions (mm) Part OCL1 FLL min.2 Irms3 Isat4 @ +25 °C Number6 ±20% (µH) (µH) (A) (A) DCR (mΩ) @ +20 °C Typical DCR (mΩ) @ +20 °C Maximum K-Factor5 HCM1103-R12-R 0.12 0.07 30 75 0.55 0.61 1200 HCM1103-R36-R 0.36 0.26 23 28 1.10 1.30 711 HCM1103-R47-R 0.47 0.33 20 26 1.50 2.00 515 HCM1103-R68-R 0.68 0.38 21 23 2.90 3.40 510 HCM1103-1R0-R 1.0 0.56 15 21 5.50 6.00 377 HCM1103-2R2-R 2.2 1.2 13 16 8.40 9.00 264 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc @ +25 °C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 Vrms, Isat @ +25 °C. 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. Isat: Peak current for approximately 30% rolloff at +25 °C 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (peak-to-peak ripple current in Amps). 6. Part Number Definition: HCM1103-xxx-R HCM1103 = Product code and size xxx= Inductance value in µH, R = decimal point, if no R is present then third character = number of zeros. -R suffix = RoHS compliant Top View HCM1103-R36-R & HCM1103-R47-R Top View HCM1103-R12-R & HCM1103-R68-R to HCM1103-220R Side View Bottom View Recommended Pad Layout Schematic Part Marking: xxx = Inductance value in uH, R = decimal point, if no R is present then third character = # of zeros. wlyy = (Date code), R = Revision Level All soldering surfaces to be coplanar within 0.10 millimeters. Tolerances are ±0.3 millimeters unless stated otherwise. HCM1103-R36-R and HCM1103-R47-R Color: Top Grey HCM1103-R12-R and HCM1103-R68-R to HCM1103-220-R Color : Top Grey Do not route traces or vias underneath the inductor wlyy R wlyy R

www.eaton.com/electronics HCM1103 High current power inductors Packaging information (mm) Supplied in tape and reel packaging, 1000 parts per 13” diameter reel. T emperature rise vs. total loss 6 0 .0 5 0 .0 4 0 .0 HCM1103-R12-R HCM1103-R36-R HCM1103-R47-R 3 0 .0 HCM1103-R68-R HCM1103-1R0-R HCM1103-2R2-R HCM1103-3R3-R 2 0 .0 HCM1103-4R7-R HCM1103-8R2-R HCM1103-100-R 1 0 .0 HCM1103-150-R HCM1103-220-R 0 .0 Temperature Rise (°C) 0.8 Total Loss (W) wlyy R wlyy R

High current power inductors www.eaton.com/electronics Core loss vs. Bp-p 25K 50K 100K 200K 300K 0.1 100 1000 10000 10 100 1000 10000 Core Loss (mW) Bp-p (Gauss) 25K 50K 100K 200K 300K 500K 0.1 1.0 10.0 100.0 1000.0 10000.0 10 100 1000 10000 Core Loss (mW) Bp-p (Gauss) HCM1103-; R36-R and R47-R HCM1103-; R12-R, R68-R through 220-R

www.eaton.com/electronics HCM1103 High current power inductors Inductance characteristics 110% 100% 90% 80% 70% 60% 50% 40% 30% 0 10 20 30 40 50 60 70 80 Idc (A) % of OCL HCM1103-R12-R 110% 100% 90% 80% 70% 60% 50% HCM1103-R36-R 40% HCM1103-R47-R 30% 0 5 10 15 20 25 30 35 40 45 Idc (A) % of OCL HCM1103-; R36-R, R47-R 110% 100% 90% 80% 70% 60% 50% 40% HCM1103-R68-R HCM1103-1R0-R 30% 0 5 10 15 20 25 30 35 40 Idc(A) % of OCL HCM1103-; R68-R, 1R0-R 110% 100% 90% 80% 70% 60% 50% 40% HCM1103-2R2-R HCM1103-3R3-R 30% 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Idc (A) % of OCL HCM1103-; 2R2-R, 3R3-R HCM1103-4R7-R 110% 100% 90% 80% 70% 60% 50% 40% 30% 0 0 0 0 2 4 6 8 10 12 14 16 18 Idc (A) % of OCL 110% 100% 90% 80% 70% 60% 50% HCM1103-8R2-R 40% HCM1103-100-R 30% 0 0 0 0 2 10 12 14 Idc (A) % of OCL 4 6 8 HCM1103-; 8R2-R, 100-R

High current power inductors www.eaton.com/electronics Inductance characteristics 110% 100% 90% 80% 70% 60% 50% HCM1103-150-R 40% HCM1103-220-R 30% 0 2 4 6 8 10 12 Idc (A) % of OCL

© 2017 Eaton All Rights Reserved Printed in USA Publication No. 4449 BU-SB12434 July 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. HCM1103 High current power inductors Technical Data 4449 Effective July 2017 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Lif e support systems are devices which supp ort or sustain life, and whose failure to per form, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C