HCM0703 EATON | Alldatasheet

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Technical content

High current power inductors Product features

  • High current carrying capacity
  • Low core losses
  • Magnetically shielded, low EMI
  • Frequency range up to 5 MHz
  • Inductance range from 0.15 μH to 33 μH
  • Current range from 1 .8 A to 52 A
  • 7 .4 mm x 6.8 mm footprint surface mount package in a 3.0 mm height
  • Iron powder core material

Applications

  • Voltage Regulator Module (VRM)
  • Multi-phase regulators
  • Point-of-loadmodules
  • Desktop and server VRMs and EVRDs
  • Base station equipment
  • Laptop and notebook regulators
  • Battery power systems
  • Graphics cards
  • Data networking and storage systems Environmental Data
  • Storage temperature range (Component): -55 °C to +125 °C
  • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 compliant (Latest revision) Pb HALOGEN HFFREE

High current power inductors www.eaton.com/electronics Product Specifications Part Number6 OCL1 (μH) ±20% FLL2 (μH) minimum Irms (A ) Isat (A ) DCR (mΩ) typical @ +20 °C DCR (mΩ) maximum @ +20 °C K-factor HCM0703-R15-R 0.15 0.09 26 52 1.9 2.5 1044 HCM0703-R22-R 0.22 0.13 23 40 2.5 2.8 986 HCM0703-R82-R 0.82 0.49 13 24 6.7 8.0 439 HCM0703- 1R0-R 1.0 0.60 11 22 9.0 10 374 HCM0703- 1R5-R 1.5 0.90 9.0 18 14 15 366 HCM0703- 2R2-R 2.2 1.3 8.0 14 18 20 281 HCM0703- 3R3-R 3.3 2.0 6.0 13.5 28 30 252 HCM0703- 4R7-R 4.7 2.8 5.5 10 37 40 210 HCM0703- 6R8-R 6.8 4.1 4.5 8.0 54 60 151 HCM0703- 8R2-R 8.2 4.9 4.0 7.5 64 68 142 HCM0703- 100-R 10 6.0 3.2 7.0 71 78 132 HCM0703- 150-R 14.9±15% 10.1 2.2 5.0 113 127 105 HCM0703- 220-R 22 14.1 2.3 3.0 135 149 83 HCM0703- 330-R 33 19.8 1.8 2.2 220 242 76 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 V rms, 0.0 Adc, +25°C. 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 V rms, Isat, @ +25 °C. 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. Isat: Peak current for approximately 20% rolloff at +25 °C. 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. B p-p: (Gauss), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps). 6. Part Number Definition: HCM0703-xxx-R HCM0703 = Product code and size -xxx= Inductance value in μH, R = decimal point, if no R is present then last character equals number of zeros. “-R” suffix = RoHS compliant Dimensions (mm) Part marking: XXX=Inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wly=date code, R=revision level All soldering surfaces to be coplanar within 0.10 millimeters Tolerances are ±0.3 millimeters unless stated otherwise Color: Grey

High current power inductors www.eaton.com/electronics Packaging information (mm) Supplied in tape and reel packaging, 1500 parts per 13” diameter reel. T emperature rise vs. total loss 0.0 10.0 20.0 30.0 40.0 50.0 Temperature Rise (°C) Total Loss (W)

High current power inductors www.eaton.com/electronics Core loss vs. Bp-p Inductance characteristics 100 kHz 200 kHz 300 kHz 500 kHz

1 MHz

0.1 100 1000 10000 000010001001 Core Loss (mW) Bp-p (Gauss) 40% 50% 60% 70% 80% 90% 100% 110% 01 02 03 04 05 06 07 0 % of OCL IDC (A) HCM0703-R15-R 40% 50% 60% 70% 80% 90% 100% 110% 01 02 03 04 05 06 07 0 % of OCL IDC (A) HCM0703-R22-R

High current power inductors www.eaton.com/electronics Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 45 50 % of OCL IDC (A) HCM0703-R47-R 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 45 % of OCL IDC (A) HCM0703-R68-R 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 45 % of OCL IDC (A) HCM0703-R82-R 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 % of OCL IDC (A) HCM0703-1R0-R 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 % of OCL IDC (A) HCM0703-1R5-R 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 % of OCL IDC (A) HCM0703-2R2-R

High current power inductors www.eaton.com/electronics Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 01 21 41 61 82 0 % of OCL IDC (A) HCM0703-3R3-R 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 01 21 41 61 82 0 % of OCL IDC (A) HCM0703-4R7-R 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 01 21 4 % of OCL IDC (A) HCM0703-6R8-R 40% 50% 60% 70% 80% 90% 100% 110% 02468 10 12 14 % of OCL IDC (A) HCM0703-8R2-R 40% 50% 60% 70% 80% 90% 100% 110% 0 24681 01 21 4 % of OCL IDC (A) HCM0703-100-R 40% 50% 60% 70% 80% 90% 100% 110% 012345678 91 0 % of OCL IDC (A) HCM0703-150-R

High current power inductors www.eaton.com/electronics Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 110% 012345 % of OCL IDC (A) HCM0703-330-R 40% 50% 60% 70% 80% 90% 100% 110% 0 12345 6 % of OCL IDC (A) HCM0703-220-R

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2016 Eaton All Rights Reserved Printed in USA Publication No. 4085 BU-MC16036 March 2016 Eaton is a registered trademark. All other trademarks are property of their respective owners. HCM0703 High current power inductors Technical Data 4085 Effective March 2016 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100 °C 150 °C

  • Temperature max. (Tsmax) 150 °C 200 °C
  • Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Average ramp up rate Tsmax to Tp 3 °C/ second Max. 3 °C/ second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 seconds 30 seconds** Average ramp-down rate (Tp to Tsmax) 6 °C/ second Max. 6 °C/ second Max. Time 25 °C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 <2.5 mm) 235 °C 220 °C ≥2.5 mm 220 °C 220 °C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm 250 °C 245 °C 245 °C