HCM0503 EATON | Alldatasheet

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Technical content

High current power inductors Product features

  • High current carrying capacity
  • Low core losses
  • Magnetically shielded, low EMI
  • Frequency range up to 1 MHz
  • Inductance range from 0.2 μH to 22 μH
  • Current range from 1 .9 A to 22 A
  • 5.5 mm x 5.3 mm footprint surface mount package in a 3.0 mm height
  • Iron powder core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Voltage Regulator Module (VRM)
  • Multi-phase regulators
  • Point-of-Load modules
  • Desktop and server VRMs and EVRDs
  • Base station equipment
  • Notebook and laptop regulators
  • Battery power systems
  • Graphics cards
  • Data networking and storage systems Environmental data
  • Storage temperature range (Component): -55 °C to +125 °C
  • Operating temperature range: -55 °C to +125 °C (ambient + self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE

High current power inductors www.eaton.com/electronics Product Specifications Part Number6 OCL1 (μH) ± 20% FLL2 (μH) minimum Irms (A) Isat (A) DCR (mΩ) typical @ +20 °C DCR (mΩ) maximum @ +20 °C K-factor HCM0503-1R0-R 1.0 0.64 10.1 8.5 10 12 588 HCM0503-1R5-R 1.5 0.96 7.5 7.0 17 19 393 HCM0503-2R2-R 2.2 1.4 6.8 6.5 23 25 325 HCM0503- 3R3-R 3.3 2.1 5.5 6.0 36 41 273 HCM0503-4R7-R 4.7 3.0 4.5 5.5 54 60 226 HCM0503-5R6-R 5.6 3.6 4.3 3.5 63 71 206 HCM0503-100-R 10 6.4 2.8 2.3 122 132 158 HCM0503-150-R 15 9.6 2.4 2.1 138 166 127 HCM0503-220-R 22 14 1.9 1.9 260 270 106 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, @ +25 °C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 Vrms, @ I sat, @ +25 °C 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. Isat: Peak current for approximately 20% rolloff @ +25 °C 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. B p-p: (Gauss), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps). 6. Part Number Definition: HCM0503-xxx-R HCM0503 = Product code and size xxx= inductance value in μH, R= decimal point , If no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) Part marking: xxx=inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wly=date code, R=revision level All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are ±0.2 millimeters unless stated otherwise DCR measured from point “a” to point “b” Color: Grey Do not route traces or vias underneath the inductor Recommended Pad Layout Schematic 5.15 ±0.35 3.0 max 5.10 ±0.2 1.0 ±0.3 1.5 ±0.30 3.15 typ. 2.2 2.2 2.051 2112 XXX wly R a b

High current power inductors www.eaton.com/electronics Packaging information (mm) Supplied in tape and reel packaging, 2,000 parts per 13” diameter reel 1.5 dia 3.2 SECTION A – A 2.9 4.0 2.0 5.25.7 2.0 5.4 8.0 1 1.75 7.5 1.5 dia A A 16.0 ±-0.3 User direction of feed T emperature rise vs. total loss Temperature Rise (°C) Total Loss (W)

High current power inductors www.eaton.com/electronics Core loss vs. Bp-p Inductance characteristics 25kHz 50kHz 100kHz 200kHz 300kHz 500kHz 0.1 1.0 10.0 100.0 1000.0 10000.0 100 1000 10000 Core Loss (mW) Bp-p (Gauss) 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 01 21 41 61 82 02 22 42 62 83 0 IDC(Amps) HCM0503-R20-R 40% 50% 60% 70% 80% 90% 100% 110% 02468 10 12 14 16 18 20 22 24 26 % of OCL HCM0503-R35-R IDC(Amps) % of OCL

High current power inductors www.eaton.com/electronics Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 110% 02468 10 12 14 16 18 20 22 24 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 01 21 41 61 82 0 40% 50% 60% 70% 80% 90% 100% 110% 0246 81 01 21 41 6 40% 50% 60% 70% 80% 90% 100% 110% 0 2468 10 12 40% 50% 60% 70% 80% 90% 100% 110% 0123456789 10 11 12 40% 50% 60% 70% 80% 90% 100% 110% 01234567891 01 1 IDC(Amps) HCM0503-R47-R % of OCL HCM0503-R75-R % of OCL% of OCL % of OCL% of OCL % of OCL IDC(Amps) IDC(Amps) IDC(Amps) IDC(Amps) IDC(Amps) HCM0503-1R0-R HCM0503-1R5-R HCM0503-2R2-R HCM0503-3R3-R

High current power inductors www.eaton.com/electronics Inductance characteristics 40% 50% 60% 70% 80% 90% 100% 110% 0123456789 10 40% 50% 60% 70% 80% 90% 100% 110% 0123456789 40% 50% 60% 70% 80% 90% 100% 110% 40% 50% 60% 70% 80% 90% 100% 110% 40% 50% 60% 70% 80% 90% 100% 110% IDC(Amps) HCM0503-4R7-R % of OCL HCM0503-5R6-R % of OCL% of OCL % of OCL% of OCL IDC(Amps) IDC(Amps) IDC(Amps) IDC(Amps) HCM0503-100-RH CM0503-150-R HCM0503-220-R

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4430 BU-SB15267 June 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4430 Effective June 2015 HCM0503 High current power inductors Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C