HCLAMP2481ZA

HCLAMP2481ZA SEMTECH | Alldatasheet

Document overview

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Technical content

Features

 Transient protecƟ on for VBus and data lines to  IEC 61000-4-2 (ESD): ±30kV (Contact), ±30kV (Air)  IEC 61000-4-5 (Lightning): 4.5A (tp = 8/20μs)  Ultra-small package  Protects one power or data line  Low ESD clamping voltage  Working voltage: 24V  Capacitance: 5.5pF (maximum)  Low leakage current  Low dynamic resistance: 0.4Ω (typ)  Solid-state silicon-avalanche technology HClamp2481ZA EMIClamp ® 24V ESD, Surge, & EMI Protection Package Dimension Schematic and Pin Configuration DFN 0.60 x 0.30 x 0.25mm-2 Lead (BoƩ om View)Nominal Dimensions in mm 0.300 0.600 0.250 0.160

0.355 BSC

0.220 HClamp2481ZA Preliminary Datasheet: Rev. 2.0 Revision Date: 7/12/2024 HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024

Proprietary & Confidential HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024 semtech.com HClamp2481ZA Absolute Maximum Rating RATING SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20μs) P PK 195 W Peak Pulse Current (tp = 8/20μs) I PP 4.5 A ESD per IEC 61000-4-2 (Contact)(1) VESD ±30 kV ESD per IEC 61000-4-2 (Air)(1) ±30 OperaƟ ng Temperature T J -40 to +85 OC Storage Temperature T STG -55 to +150 OC

Electrical Characteristics

T=25OC unless otherwise specifi ed PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS Reverse Stand-Off Voltage V RWM 24 V Reverse Breakdown Voltage V BR It = 1mA 25 26.6 29 V Reverse Leakage Current I R VRWM = 24V <1 100 nA Trigger Voltage(2) Vtr Itr = 1A, tp = 0.2/100ns 30 V Clamping Voltage(3) VC IPP = 4.5A, tp = 1.2/50μs (Voltage), 8/20μs (Current) CombinaƟ on Waveform, RS = 2 Ω 35.8 43.3 V ESD Clamping Voltage(4) VC ITLP=4A, tp=0.2/100ns (TLP) 26 V ITLP=16A, tp=0.2/100ns (TLP) 31.1 Dynamic Resistance(4),(5) RDYN tp = 0.2/100ns 0.4 Ω JuncƟ on Capacitance C J VR = 0V, f = 1MHz 4.4 5.5 pF Notes: 1) ESD gun return path connected to ESD ground plane. 2) Guaranteed by design, not producƟ on tested. 3) Measured using a 1.2/50μs voltage, 8/20μs current combinaƟ on waveform, R S = 2 Ohms. Clamping is defi ned as the clamping voltage aŌ er the device snaps back to a conducƟ ng state. 4) Transmission Line Pulse Test (TLP) Seƫ ngs: t p = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 5) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A HClamp2481ZA Preliminary Datasheet: Rev. 2.0 Revision Date: 7/12/2024 HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024

Proprietary & Confidential HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024 semtech.com HClamp2481ZA ESD Clamping (8kV Contact per IEC 61000-4-2) TLP CharacterisƟ c (PosiƟ ve Pulse) Capacitance vs. Reverse Voltage ESD Clamping (-8kV Contact per IEC 61000-4-2) TLP CharacterisƟ c (NegaƟ ve Pulse) Clamping Voltage Waveform (tp=1.2/50μs) Typical Characteristics -10 -10 0 10 20 30 40 50 60 70 80 90 Clamping Voltage - VC (V) Time (ns) Waveform IEC61000-4-2 +8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50ΩScope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. 0 5 10 15 20 25 30 35 40 TLP Current (A) TLP Voltage (V) tP = 100ns, tR = 0.2ns tMEAS = 70-90ns 0 3 6 9 12 15 18 21 24 Capacitance - CJ (pF) Reverse Voltage - VR (V) f = 1 MHz -70 -60 -50 -40 -30 -20 -10 -10 0 10 20 30 40 50 60 70 80 90 Clamping Voltage - VC (V) Time (ns) Waveform IEC61000-4-2 -8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50ΩScope Input Impedance, ≥2GHz BW. ESD Gun Return connected to ESD Ground Plane. -35 -30 -25 -20 -15 -10 -40 -35 -30 -25 -20 -15 -10 -5 0 TLP Current (A) TLP Voltage (V) tP = 100ns, tR = 0.2ns tMEAS = 70-90ns Clamping Voltage - VC (V) Peak Pulse Current - IPP (A) Waveform Parameters: 1.2/50μs (Voltage) / 8/20μs (Current) combination waveform with 2Ω source Impedence HClamp2481ZA Preliminary Datasheet: Rev. 2.0 Revision Date: 7/12/2024 HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024

Proprietary & Confidential HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024 semtech.com HClamp2481ZA Typical Characteristics Assembly Guidelines The small size of this device means that care must be taken during the mounƟ ng process to ensure reliable solder joints. The fi gure at the right details Semtech’s recommended mounƟ ng paƩ ern. Recommended assembly guidelines are shown in Table 1. Note that these are only recommendaƟ ons and should serve only as a starƟ ng point for design since there are many factors that aff ect the assembly process. Exact manufacturing parameters will require some experimentaƟ on to get the desired solder applicaƟ on. Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area raƟ o of the stencil aperture will determine how well the stencil will print. The area raƟ o takes into account the aperture shape, aperture size, and stencil thickness. A minimum area raƟ o of 0.66 is preferred for the subject package. The area raƟ o of a rectangular aperture is given as: Area RaƟ o = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil with square aperture and rounded corners for consistent solder release. The stencil should be laser cut with electro-polished fi nish. A stencil thickness of 0.075mm (0.003”) is recommended. A 0.100mm (0.004”) stencil may be used, however the stencil opening may need to be increased slightly to achieve the desired area raƟ o to ensure proper solder coverage on the pad. Recommended MounƟ ng PaƩ ern Assembly Parameter Recommenda Ɵ on Solder Stencil Design Laser Cut, Electro-Polished Aperture Shape Rectangular with Rounded Corners Solder Stencil Thickness 0.075mm (0.003”) or 0.100mm (0.004”) Solder Paste Type Type 4 Size Sphere or Smaller Solder Refl ow Profi le Per JEDEC J-STD-020 PCB Solder Pad Design Solder Mask De fi ned or Non Solder Mask Defi ned PCB Pad Finish OSP or NiAu Table 1 - Assembly Guidelines 0.300 0.270 0.175 0.675 0.250 All Dimensions are in mm. Land Pad. Stencil opening Component 0.600 Component Stencil opening Land Pattern HClamp2481ZA Preliminary Datasheet: Rev. 2.0 Revision Date: 7/12/2024 HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024

Proprietary & Confidential HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024 semtech.com HClamp2481ZA Outline Drawing - DFN 0.60 x 0.30 x 0.25mm-2 Lead Land Pattern - DFN 0.60 x 0.30 x 0.25mm-2 Lead THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: COMPANY'S MANUFACTURING GUIDELINES ARE MET. 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). G X Y Z(C) DIM Y G MILLIMETERS 0.675 0.250 0.175 DIMENSIONS Z X 0.270 (C) (0.425) aaa N E L e DIM A 0.180 0.320 0.140 0.280 0.08 0.160 0.300 0.240 0.265 DIMENSIONS MIN 0.200 NOM 0.235 0.220 0.250 BOTTOM VIEW b D 0.580 0.6200.600 bbb 0.10 D E A B aaa C C A SEATING PLANE e bbb CA B TOP VIEW A1 0.000 0.010 0.050 bxN A1 e/2 2X L R0.025 TYP CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: HClamp2481ZA Preliminary Datasheet: Rev. 2.0 Revision Date: 7/12/2024 HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024

Proprietary & Confidential HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024 semtech.com HClamp2481ZA Marking Code Order Information Tape and Reel Specification PART NUMBER QTY PER REEL REEL SIZE HClamp2481ZA.F 15,000 7" HClamp and EMIClamp are registered trademarks of Semtech CorporaƟ on. Pin 1 Location (Towards Sprocket Holes) User Direction of Feed Note: Device is electrically symmetrical. HClamp2481ZA Preliminary Datasheet: Rev. 2.0 Revision Date: 7/12/2024 HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024

Proprietary & Confidential HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024 semtech.com Important NoticeImportant Notice Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the applicatio n or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and al l sales are made in accordance with Semtech’s standard terms and conditions of sale. Product features listed in this datasheet may be suitable for “non-safety” applications in Automotive use cases. Information in this datasheet for such applications is provided as a guide only. No safety claim is made in respect of the product describ ed in this datasheet when used in Automotive safety systems or security devices, including systems for controlling vehicles and other transportation equipment; responsibility for achieving safety goals belongs solely to the buyer and/or integrators. Semtech is under no obligation to provide any data regarding safety integration to the buyer or any integrator. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN AUTOMOTIVE SAFETY OR SECURITY DEVICES, INCLUDING SYSTEMS FOR CONTROLLING VEHICLES AND OTHER TRANSPORTATION EQUIPMENT, LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2024 HClamp2481ZA HClamp2481ZA Preliminary Datasheet: Rev. 2.0 Revision Date: 7/12/2024 HClamp2481ZA Final Datasheet: Rev. 2.0 Revision Date: 7/12/2024