HCC4011B STMICROELECTRONICS | Alldatasheet

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.PROPAGATION DELAY TIME = 60ns (typ.) AT C L = 50pF, VDD = 10V .BUFFERED INPUTS AND OUTPUTS .QUIESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE .INPUT CURRENT OF 100nA AT 18V AND 25°C FOR HCC DEVICE .100% TESTED FOR QUIESCENT CURRENT .5V, 10V AND 15V PARAMETRIC RATINGS .MEETS ALL REQUIREMENTS OF JEDECTEN- TATIVE STANDARD N o. 13A, ”STANDARD SPECIFICATIONS FOR DESCRIPTION OF ”B” SERIES CMOS DEVICES” QUAD 2 INPUT HCC/HCF 4011B DUAL 4 INPUT HCC/HCF 4012B TRIPLE 3 INPUT HCC/HCF 4023B June 1989 The HCC4011B, HCC4012B and HCC4023B (ex- tended temperature range) and HCF4011B, HCF4012B andHCF4023B (intermediate tempera- ture range) are monolithic, integrated circuit, avail- able in 14-lead dual in-line plastic or ceramic package and plastic micropackage. The HCC/HCF4011B, HCC/HCF4012B and HCC/HCF4023B NAND gates provide the system designer with direct implementation of the NAND function and supplement the existing family of COS/MOS gates. All inputs and outputs are buf- fered. PIN CONNECTIONS EY (Plastic Package) F (Ceramic Frit Seal Package) (Micro Package) (Plastic Chip Carrier) ORDER CODES : HCC40XXBF HCF40XXBM1 HCF40XXBEY HCF40XXBC1 4011B 4012B 4023B

Symbol Parameter Value Unit V DD * Supply Voltage :HCC Types HCF Types – 0.5 to + 20 – 0.5 to + 18 V V V i Input Voltage – 0.5 to V DD + 0.5 V II DC Input Current (any one input) ± 10 mA P tot Total Power Dissipation (per package) Dissipation per Output Transistor for T op = Full Package-temperature Range 200 100 mW mW T op Operating Temperature :HCC Types HCF Types –5 5t o+1 2 5 –4 0t o+8 5 T stg Storage Temperature – 65 to + 150 °C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Unit V DD Supply Voltage :HCC Types HCF Types 3t o1 8 3t o1 5 V V V I Input Voltage 0 to V DD V T op Operating Temperature :HCC Types HCF Types –5 5t o+1 2 5 –4 0t o +8 5 Stresses abov e those listed under ”Absolute Maximum Ratings” may cause permane nt damage to the device. This is a stress rating only and functional operation of the device atthese or any other conditions above those indica ted in the operationalsections of this specification is notimplied. Exposu re to absolu te maximu m rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage. HCC/HFC4011B/12B/23B

SCHEMATIC AND LOGIC DIAGRAMS 4011B 4023B 4012B HCC/HCF4011B/12B/23B

STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Test Conditions Value V I V O |IO |V DD T Low * 25 °CT High *Symbol Parameter Unit IL Quiescent Current HCC Types 0/5 5 0.25 0.01 0.25 7.5 µA 0/10 10 0.5 0.01 0.5 15 0/15 15 1 0.01 1 30 0/20 20 5 0.02 5 150 HCF Types 0/ 5 5 1 0.01 1 7.5 0/10 10 2 0.01 2 15 0/15 15 4 0.01 4 30 V OH Output High Voltage 0/5 < 1 5 4.95 4.95 4.95 V0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95 V OL Output Low Voltage 5/0 < 1 5 0.05 0.05 0.05 V10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05 V IH Input High Voltage V1/9 < 1 10 7 7 7 1.5/13.5 < 1 15 11 11 11 V IL Input Low Voltage V9/1 < 1 10 3 3 3 13.5/1.5 < 1 15 4 4 4 IOH Output Drive Current HCC Types mA HCF Types IOL Output Sink Current HCC Types 0/5 0.4 5 0.64 0.51 1 0.36 mA HCF Types 0/5 0.4 5 0.52 0.44 1 0.36 IIH,IIL Input Leakage Current HCC Types Any Input µA HCF Types C I Input Capacitance Any Input 5 7.5 pF *TLOW =–5 5°CforHCC device : – 40°Cf o rHCF device. *THIGH = + 125°C forHCC device : + 85°C forHCF device. The Noise Margin for both ”1” and ”0” level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5V with VDD = 15V. HCC/HFC4011B/12B/23B

Quiescent Device Current. Noise Immunity. Input Leakage Current. DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =2 5°C, CL = 50pF, RL = 200kΩ , typical temperature coefficient for all VDD values is 0.3%/°C, all input rise and fall times = 20ns) ValueSymbol Parameter Test Conditions V DD (V) Min. Typ. Max. Unit tPLH ,tPHL Propagation Delay Time 5 125 250 ns10 60 120 15 45 90 tTHL ,tTLH Transition Time 5 100 200 ns10 50 100 15 40 80 HCC/HCF4011B/12B/23B

Minimum Output High (source) Current Charac- teristics. Minimum Output Low (sink) Current Charac- teristics. Typical Output High (source) Current Charac- teristics. Typical Output Low (sink) Current Characteristics. Typical Propagation Delay Time per Gate as a Function of Load Capacitance. Typical Transition Time vs. Load Capacitance. HCC/HFC4011B/12B/23B

Typical Voltage Transfer Characteristics. Typical Power Dissipation/gate vs Frequency. HCC/HCF4011B/12B/23B

Plastic DIP14 MECHANICAL DATA DIM. mm inch a1 0.51 0.020 B 1.39 1.65 0.055 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 2.54 0.050 0.100 P001A HCC/HFC4011B/12B/23B

Ceramic DIP14/1 MECHANICAL DATA DIM. mm inch A 20 0.787 B 7.0 0.276 D 3.3 0.130 E 0.38 0.015 e3 15.24 0.600 F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060 L 0.22 0.31 0.009 0.012 M 1.52 2.54 0.060 0.100 N 10.3 0.406 P 7.8 8.05 0.307 0.317 Q 5.08 0.200 P053C HCC/HCF4011B/12B/23B

DIM. mm inch A 1.75 0.068 a1 0.1 0.2 0.003 0.007 a2 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45 ° (typ.) D 8.55 8.75 0.336 0.344 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 7.62 0.300 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M 0.68 0.026 S8 ° (max.) P013G HCC/HFC4011B/12B/23B

DIM. mm inch A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 e3 5.08 0.200 F 0.38 0.015 G 0.101 0.004 M 1.27 0.050 M1 1.14 0.045 P027A HCC/HCF4011B/12B/23B

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics.  1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A HCC/HFC4011B/12B/23B