HCF40108B

HCC40108B STMICROELECTRONICS | Alldatasheet

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ORDER CODES : HCC40108BF HCF40108BM1 HCF40108BEY HCF40108BC1 F (Ceramic Package) (Micro Package) (Chip Carrier) PIN CONNECTIONS The HCC40108B (extended temperature range) and HCF40108B (intermediate temperature range) are monolithic integrated circuits, available in 24 lead dualin line plastic or ceramic packageand plas- tic micropackage. The HCC/HCF40108B is a 4 X 4 multiport register containing four 4-bit register, write address decoder, two separate read address decoders, and two 3-state output buses. When the ENABLE input is low, the corresponding output bus is switched, independently of the clock, to a high im- pedance state. The high impedance third state pro- vides the outputs with the capability of being connected to the bus lines in a bus organized sys- tem without the need for interface or pull-up compo- nents. When the WRITE ENABLE input is high, all data input lines are latched on the positive transition of the CLOCK and the data is entered into the word selected by the write address lines. When WRITE ENABLE is low, the CLOCK is inhibited and .FOUR 4-BIT REGISTERS .ONE INPUT AND TWO OUTPUT BUSES .UNLIMITED EXPANSION IN BIT AND WORD DIRECTION .DATA LINES HAVE LATCHED INPUTS .3-STATE OUTPUTS .SEPARATE CONTROL OF EACH BUS, ALLOWING SIMULTANEOUS INDEPENDET READING AND ANY OF FOUR REGISTERS ON BUS A AND BUS B AND INDEPENDENT WRITING INTO ANY ANY OF THE FOUR REG- ISTERS .40108B IS PIN COMPATIBLE WITH INDUSTRY TYPE MC14580 .STANDARDIZED, SYMMETRICAL OUTPUT CHARACTERISTICS .QUIESCENT CURRENT SPECIFIED AT 20V FOR HCC DEVICE .5V, 10V AND 15V PARAMETRIC RATINGS .INPUT CURRENTOF 100nA AT18VAND 25oC FOR HCC DEVICE .100% TESTED FOR QUIESCENT CURRENT .MEETS ALL REQUIREMENTS OF JEDECTEN- TATIVE STANDARD No 13a, ”STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES” no new data is netered. In either case, the contents of any word may be accessed via the read address lines independent of the state of the CLOCK input.

Symbol Parameter Value Unit VDD * Supply Voltage: HCC Types HCF Types -0.5 to +20 -0.5 to +18 V V Vi Input Voltage -0.5 to V DD + 0.5 V II DC Input Current (any one input) ± 10 mA Ptot Total Power Dissipation (per package) Dissipation per Output Transistor for Top = Full Package Temperature Range 200 100 mW mW T op Operating Temperature:HCC Types HCF Types -55 to +125 -40 to +85 oC oC Tstg Storage Temperature -65 to +150 oC Stressesabove those listedunder ”Absolute Maximum Ratings” may cause permanent damage to thedevice. This isa stress ratingonly and functional opera tion of the device at these or any other cond itions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Unit VDD Supply Voltage:HCC Types HCF Types 3t o1 8 3t o1 5 V V VI Input Voltage 0 to V DD V Top Operating Temperature:HCC Types HCF Types -55 to +125 -40 to +85 oC oC TRUTH TABLE CLOCK Write Enable Write Write Read Read Read Read Enable A Enable B D n Q nA Q nB

1 S 1S 2S 1S 2S 1S 2 1 1 1 1 1

1 S 1S 2S 1S 2S 1S 2 1 0 0 0 0

100011011 D n to

1 Out

2 Out

1 = HIGH LEVEL, 0 = LOW LEVEL, X = DON’T CARE, Z = HIGH IMPEDANCE S1 and S2 refer to input strates of either 1 or 0 HCC/HCF40108

STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Symbol Parameter Test Conditios Value UnitVI (V) VO (V) |IO | (µA) VDD (V) TLOW *2 5 oCT HIGH * IL Quiescent Current HCC Types 0/5 5 5 0.04 5 150 µA 0/10 10 10 0.04 10 300 0/15 15 20 0.04 20 600 0/20 20 100 0.08 100 3000 HCF Types 0/5 5 20 0.04 20 150 0/10 10 40 0.04 40 300 0/15 15 80 0.04 80 600 V OH Output High Voltage 0/5 < 1 5 4.95 4.95 4.95 V0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95 VOL Output Low Voltage 5/0 < 1 5 0.05 0.05 0.05 V10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05 VIH Input High Voltage V1/9 < 1 10 7 7 7 1.5/13.5 < 1 15 11 11 11 V IL Input Low Voltage V9/1 < 1 10 3 3 3 13.5/1.5 < 1 15 4 4 4 IOH Output Drive Current HCC Types mA HCF Types I OL Output Sink Current HCC Types 0/5 0.4 5 0.64 0.51 1 0.36 mA HCF Types 0/5 0.4 5 0.52 0.44 1 0.36 IIH,IIL Input Leakage Current HCC Types 0/18 Any Input µA HCF Types 0/15 15 ±0.3 ±10-5 ±0.3 ±1 IOH ,IOL 3-Sate Output Leakage Current HCC Types 0/18 0/18 18 ±0.4 ±10-4 ±0.4 ±12 µA HCF C I Input Capacitance Any Input 5 7.5 pF *T LOW =- 5 5oCf o rHCC device: -40oC forHCF device. *T HIGH =+ 1 2 5oCf o rHCC device: +85oC forHCF device. The Noise Margin for both ”1” and ”0” level is: 1V min. with VDD = 5 V, 2 V min. with VDD = 10 V, 2.5 V min. withVDD =1 5V ** Forced output disable HCC/HCF40108

DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =2 5 oC, CL =5 0p F ,RL = 200 KΩ , typical temperature coefficent for all VDD values is 03 %/oC, all input rise and fall times= 20 ns) Symbol Parameter Test Conditions Value Unit VDD (V) Min. Typ. Max. tPLH tPHL Propagation Delay Time Clock or Write Enable to Q 5 360 720 ns 10 140 280 15 100 200 Propagation Delay Time Read or Write Address to Q 5 300 600 10 120 240 15 85 170 tPZH tPHZ 3-State Disable Delay Time 5 100 200 ns10 50 100 15 40 80 tPZL tPLZ 3-State Display Delay Time 5 130 260 ns10 60 120 15 50 100 tTLH tTHL Output Transition Time 5 100 200 ns10 50 100 15 40 80 tsetup Setup Time Data to Clock ts(D) 5 0 -95 ns 10 0 -35 15 0 -20 Setup Time Write Enable to Clock ts(WE) 5 250 125 10 100 50 15 70 35 Setup Time Write Address to Clock ts(WA) 5 250 125 10 100 50 15 70 35 t r,ts Clock Rise and Fall Time 5 15 µs10 5 15 5 thold Hold Time Data to Clock ts(D) 5 220 110 ns 10 100 50 15 80 40 Hold Time Write Enable to Clock ts(WE) 5 270 135 10 130 65 15 80 40 Hold Time Write Address to Clock ts(WA) 5 330 165 10 140 70 15 90 45 tW Clock Pulse Width Clock or Write Enable tW(CL) 5 350 175 ns 10 130 65 15 90 45 Clock Pulse Width Write Address tW(WA) 5 300 150 10 150 75 15 90 45 fCL Maximum Clock Input Frequency 5 1.5 3 MHz10 3.5 7 15 4.5 9 HCC/HCF40108

Output Low (sink) Current Characteristics Typical Propagation Delay Time vs Load Capa- citance (CL or WE to Q) Typical Dynamic Power Dissipation vs Input Fre- quency Output High (source) Current Characteristics Typical Transition Time vs Load Capacitance HCC/HCF40108

Output Enable Delay Times and Waveforms HCC/HCF40108

Quiescent Device Current. Noise Immunity. Input Leakage Current. Power Dissipation and Waveforms HCC/HCF40108

Plastic DIP24 (0.25) MECHANICAL DATA DIM. mm inch a1 0.63 0.025 b 0.45 0.018 b1 0.23 0.31 0.009 0.012 b2 1.27 0.050 D 32.2 1.268 E 15.2 16.68 0.598 0.657 e 2.54 0.100 e3 27.94 1.100 F 14.1 0.555 I 4.445 0.175 L 3.3 0.130 P043A HCC/HCF40108

Ceramic DIP24 MECHANICAL DATA DIM. mm inch A 32.3 1.272 B 13.05 13.36 0.514 0.526 C 3.9 5.08 0.154 0.200 D 3 0.118 E 0.5 1.78 0.020 0.070 e3 27.94 1.100 F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 I 1.17 1.52 0.046 0.060 L 0.22 0.31 0.009 0.012 M 1.52 2.49 0.060 0.098 N1 4° (min.), 15° (max.) P 15.4 15.8 0.606 0.622 Q 5.71 0.225 P058C HCC/HCF40108

DIM. mm inch A 2.65 0.104 a1 0.10 0.20 0.004 0.007 a2 2.45 0.096 b 0.35 0.49 0.013 0.019 b1 0.23 0.32 0.009 0.012 C 0.50 0.020 c1 45 ° (typ.) D 15.20 15.60 0.598 0.614 E 10.00 10.65 0.393 0.420 e 1.27 0.05 e3 13.97 0.55 F 7.40 7.60 0.291 0.299 L 0.50 1.27 0.19 0.050 S8 ° (max.) F C L E A e D b 24 13 11 2 s HCC/HCF40108

DIM. mm inch A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 e3 5.08 0.200 F 0.38 0.015 G 0.101 0.004 M 1.27 0.050 M1 1.14 0.045 P027A HCC/HCF40108

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics.  1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A HCC/HCF40108