HCF4006BC1

HCC4006B STMICROELECTRONICS | Alldatasheet

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18-STAGE STATIC SHIFT REGISTER

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.PERMANENT REGISTER STORAGE WITH CLOCK LINE ”HIGH” OR ”LOW” ... NO INFOR- MATION RECIRCULATION REQUIRED .FULLY STATIC OPERATION .SHIFTING RATES UP TO 12MHz @ 10V (typ.) .STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS .QUIESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE .INPUT CURRENT OF100nA AT 18V AND 25 °C FOR HCC DEVICE .100% TESTED FOR QUIESCENT CURRENT .5V, 10V, AND 15V PARAMETRIC RATING .MEETS ALL REQUIREMENTS OF JEDECTEN- TATIVE STANDARDN °13A, ”STANDARD SPE- CIFICATIONS FOR DESCRIPTION OF ”B” SERIES CMOS DEVICES” June 1989 The HCC4006B (extended temperature range) and theHCF4006B (standard temperature range), are monolithic integrated circuits, available in 14-lead dual in-line plastic or ceramic package and plastic micro package. The types are comprised of 4 sep- arate ”shift register” sections ; two sections of four stages and twosections of five stages with an output tap at the fourth stage. Each section has an inde- pendent ”single rail” data path. A common clock sig- nal is used for all stages. Data is shifted to the next stage on negative-going transitions of the clock. Through appropriate connections of inputs and out- puts, multiple register sections of 4, 5, 8, and 9 stages or single register sections of 10, 12, 13, 14, 16, 17 and 18 can be implemented using one HCC/HCF4006B package. Longer shift register sections can be assembled by using more than one HCC/HCF4006B . To facilitate cascading stages when clock rise and fall times are slow, an optional output (D 1 + 4’) that is delayed one-half clock-cycle, is provided (see truth table for output from pin 2). EY (Plastic Package) F (Ceramic Frit Seal Package) (Plastic Chip Carrier) ORDER CODES : HCC4006BF HCF4006BM1 HCF4006BEY HCF4006BC1 PIN CONNECTIONS (Micro Package)

Symbol Parameter Value Unit V DD * Supply Voltage :HCC Types HCF Types – 0.5 to + 20 – 0.5 to + 18 V V V i Input Voltage – 0.5 to V DD + 0.5 V II DC Input Current (any one input) ± 10 mA P tot Total Power Dissipation (per package) Dissipation per Output Transistor for T op = Full Package-temperature Range 200 100 mW mW T op Operating Temperature :HCC Types HCF Types – 55 to + 125 –4 0t o+8 5 T stg Storage Temperature – 65 to + 150 °C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Unit V DD Supply Voltage :HCC Types HCF Types 3t o1 8 3t o1 5 V V V I Input Voltage 0 to V DD V T op Operating Temperature :HCC Types HCF Types – 55 to + 125 –4 0t o+8 5 Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec- tions of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. HCC/HCF4006B

LOGIC DIAGRAM AND TRUTH TABLES (one register stage) TRUTH TABLE FOR OUTPUT FROM PIN 2 D 1 +4 C L Δ D 1 +4 ’ 0 –/– 0 1 –/– 1 X –\\– NC TRUTH TABLE FOR SHIFT REGISTER STAGE DC L Δ D+1 0 –\\– 0 1 –\\– 1 X –/– NC 1 = HIGH 0 = LOW NC = NO CHANGE X = DON’T CARE Δ = LEVEL CHANGE HCC/HCF4006B

STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Test Conditions Value V I V O |IO |V DD TLow * 25 °CT High*Symbol Parameter Unit IL Quiescent Current HCC Types 0/ 5 5 5 0.04 5 150 µA 0/10 10 10 0.04 10 300 0/15 15 20 0.04 20 600 0/20 20 100 0.08 100 3000 HCF Types 0/ 5 5 20 0.04 20 150 0/10 10 40 0.04 40 300 0/15 15 80 0.04 80 600 VOH Output High Voltage 0/ 5 < 1 5 4.95 4.95 4.95 V0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95 VOL Output Low Voltage 5/0 < 1 5 0.05 0.05 0.05 V10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05 VIH Input High Voltage V1/9 < 1 10 7 7 7 1.5/13.5 < 1 15 11 11 11 VIL Input Low Voltage V9/1 < 1 10 3 3 3 13.5/1.5 < 1 15 4 4 4 IOH Output Drive Current HCC Types mA HCF Types I OL Output Sink Current HCC Types 0/ 5 0.4 5 0.64 0.51 1 0.36 mA HCF Types 0/ 5 0.4 5 0.52 0.44 1 0.36 I IH,IIL Input Leakage Current HCC Types Any Input 18 ± 0.1 ±10 –5 ± 0.1 ± 1 µA HCF Types C I Input Capacitance Any Input 5 7.5 pF *T Low =–5 5 °Cf o rHCC device : – 40°Cf o rHCF device. *T High = + 125°Cf o rHCC device : + 85°Cf o rHCF device. HCC/HCF4006B

DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =2 5°C, CL = 50pF, RL = 200kΩ , typical temperature coefficient for all VDD values is 0.3%/°C, all input rise and fall times = 20ns) ValueSymbol Parameter Test Conditions V DD (V) Min. Typ. Max. Unit tPLH ,tPHL Propagation Delay Time 5 200 ns10 100 15 80 tTHL ,tTLH Transition Time 5 100 ns10 50 15 40 tw Clock Pulse Width 5 100 ns10 45 15 30 tr,tf Clock Input Rise or Fall Time* 5 15 µs10 15 15 15 tsetup Data Setup Time 5 50 ns10 25 15 20 fmax Maximum Clock Input Frequency 5 5 MHz10 12 15 16 * If more than unit is cascade d trCL should be made less than or equal to the sum of the transition time and the fixed propagation delay of the output of the driving stage for the estimated capacitive load. Minimum Output Low (sink) Current Charac- teristics. Typical Output Low (sink) Current Characteristics. HCC/HCF4006B

Typical Output High (source) Current Charac- teristics. Minimum Output High (source) Current Charac- teristics. Input Current. Input Voltage. TEST CIRCUITS Quiescent Device Current. HCC/HCF4006B

Plastic DIP14 MECHANICAL DATA DIM. mm inch a1 0.51 0.020 B 1.39 1.65 0.055 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 2.54 0.050 0.100 P001A HCC/HCF4006B

Ceramic DIP14/1 MECHANICAL DATA DIM. mm inch A 20 0.787 B 7.0 0.276 D 3.3 0.130 E 0.38 0.015 e3 15.24 0.600 F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060 L 0.22 0.31 0.009 0.012 M 1.52 2.54 0.060 0.100 N 10.3 0.406 P 7.8 8.05 0.307 0.317 Q 5.08 0.200 P053C HCC/HCF4006B

DIM. mm inch A 1.75 0.068 a1 0.1 0.2 0.003 0.007 a2 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45 ° (typ.) D 8.55 8.75 0.336 0.344 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 7.62 0.300 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M 0.68 0.026 S8 ° (max.) P013G HCC/HCF4006B

DIM. mm inch A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 e3 5.08 0.200 F 0.38 0.015 G 0.101 0.004 M 1.27 0.050 M1 1.14 0.045 P027A HCC/HCF4006B

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics.  1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A HCC/HCF4006B