HCF1305 EATON | Alldatasheet

Document overview

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Technical content

  • 12.5 mm x 12.5 mm x 5.0 mm surface mount package
  • Ferrite core material
  • Inductors designed for higher speed switch mode applications requiring low voltage and high current
  • Design utilizes ferrite core with high DC bias resistance and low core loss
  • Inductance range from 0.47 µH to 4.7 µH
  • Current range from 36.0 A to 10.4 A
  • Frequency range 100 kHz to 1 MHz

Applications

  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant HCF1305 High frequency, high current power inductors Pb HALOGEN HFFREE
  • Next generation processors
  • High current DC-DC converters
  • VRM, multi-phase buck regulators
  • PC Workstations, Routers, Servers
  • Telecom soft switches
  • Base stations Environmental data

High frequency, high current power inductors www.eaton.com/electronics Packaging information - mm Dimensions- mm Product specifications 1) OCL: Open Circuit Inductance test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. OCL@-40 °C can be lower than OCL@+20 °C b y 15% max. 2) Irms: DC current for an approximate DT of 40 ° C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 3) Isat1: Amperes Peak for approximately 30% rolloff (@+25 °C) 4) Isat2: Amperes Peak for approximately 30% rolloff (@+125 °C) 5) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I B p-p:(mT), K: (K factor from table), L: (Inductance in µH), ∆I (Peak to peak ripple current in Amps). Part number definition: HCF1305-XXX-R HCF1305 = Product code and size XXX = Inductance value in uH. R = Decimal point. If no R is present, third character = #of zeros -R suffix indicates RoHS compliant Part Number Ra ted OCL (1) Irms (2) Isat (3) Isat2 (4) DCR DCR K-factor Inductance µH ± 20% Amperes Amperes Amperes m Ω@20°C m Ω@20°C (5) (µH) (Typical) (Maximum) DIMENSION TABLE E: 2.40 +/- 0.10 F: 6.90 +/- 0.30 G: 4.00 Ref . H: 5.40 Ref. I: 3.00 Ref. J: 4.00 Ref. K: 4.00 Ref. L: 3.4 Ref. H G I SCHEMATIC I J RECOMMENDED PCB LAYOUT L K wwllyy=Date code, R=Revision Level TOP V IEW BOTTOM VI EW FRONT VIEW A F A: 12.5max 1 2 C B: 12.5max C: 5.0max B D: 2.00 ref HCF1305-XXX 3 D wwllyy R E Do not route traces or vias underneath the inductor K0= 5.50 m m A0= 12. 60 mm B0= 12.60 mm SECTION A-A 1.5 dia +0.1/-0.0 User direction of feed Parts packaged on a 13" Diameter reel. 600 parts per reel. 4.0 1.5 dia 2.0 min A 1.75 11.5 24.0 +/-0.3 AA0 16.00 HCF 130 5-X X X wwlly y-R

3www.eaton.com/electronics Technical Data 4133 Effective July 2017 Core loss vs Bp-p Inductance characteristics HCF1305 High frequency, high current power inductor Temperature rise vs total loss 100 0 0.4 1.6 20.8 1.2 Total Power Loss (W) Temperature Rise (ºC) 100 kHz 200 kHz 300 kHz 500 kHz

1 MHz

0.0001 0.001 0.01 0.1 1 10 100 1000 Bp-p (mT) Core Loss (W) Normalized Rolloff Curves at 25 Deg. C 100.0% 90.0% 80.0% 70.0% R47, 1R0, 1R8, 3R0 and 4R0 60.0% R56, 1R2 and 2R2 3R3 and 4R7 50.0% 40.0% % o f I SAT1 % of OC L Normali Curve s at 125 Deg. C 100.0% 90.0% 80.0% 70.0% 60.0% R47, 1R0, 1R8 , 3R0 and 4R0 R56, 1R2 and 2R250.0% 3R3 and 4R7 40.0% 30.0% % of I SAT2 % of OCL

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4133 July 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4133 Effective July 2017 HCF1305 High frequency, high current power inductor Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.